Name

Siliconware Precision Industries

Legal name

Siliconware Precision Industries Co., Ltd.

Website

https://spil.com.tw

Company type

Public

Founded year

1984

Operating status

Operating

Headcount range

5,001–10,000 employees

Ownership category

akta.pro rank

Product category

Semiconductor Packaging and Testing Services (OSAT)

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

akta.pro primary industry

Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ)

Keywords

• Semiconductor packaging services
• IC assembly testing
• Wafer bumping services
• Advanced packaging technology
• OSAT provider

Headquarters

HQ city

Taichung

HQ country

Taiwan

HQ region

Asia

Offices15 records

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Infrastructure, Technology or R&D, Supply Chain, Marketing or Sales

Revenue model

1. IC Packaging and Testing Services: SPIL provides comprehensive backend semiconductor assembly and test services on a turnkey basis. Services include wafer bumping, wafer sort, IC assembly, final test, and direct shipment. Revenue is generated through long-term manufacturing service agreements with fabless companies, IDMs, and wafer foundries. The business model is project-based, with services priced per wafer, per package, or per unit tested depending on complexity and technology node.
2. Advanced Packaging Technology Services: Premium pricing for advanced packaging technologies including TSV, SiP, FO-WLP, flip chip, and AiP, which command higher margins due to specialized capabilities and AI-driven demand for advanced packaging.

Pricing tiers

Go-to-market motion1 record

Distribution channels4 records

Marketing channels4 records

Core offering

SPIL provides comprehensive Outsourced Semiconductor Assembly and Test (OSAT) services on a turnkey basis, covering wafer bumping, wafer sort, IC assembly, final test, and direct shipment. The company manufactures advanced leadframe-based and substrate-based packages — including QFN, PBGA, TFBGA, Stacked-die CSP, WLCSP, and FCBGA — and offers advanced packaging technologies such as 2.5D/3D TSV, SiP, FO-WLP, Flip Chip, and Antenna-in-Package for computing, mobile, consumer, automotive, IoT, AI, VR/AR, and smart automotive markets. SPIL serves global fabless design houses, IDMs, and wafer foundries through long-term manufacturing service agreements.

Product overview

Siliconware Precision Industries (SPIL) is a world-class IC packaging and testing services provider offering comprehensive turnkey solutions. The company's portfolio spans multiple IC packaging types organized into categories: (1) Laminate Substrate packages including PBGA, TFBGA/VFBGA, LGA, FCBGA, and FCCSP for wirebond and flip chip applications; (2) Leadframe packages including LQFP, TQFP, E-pad variants, and QFN for quad packages; (3) Wafer Level packaging (WLCSP) for miniaturization; (4) Stacked Die packages for higher density; and (5) Multi-Package BGA modules. Services include Assembly (design, characterization, reliability testing), Test (CP, FT/SLT, burn-in, engineering), Bumping (direct bumping, redistribution, gold bumping), and Quality Management. Advanced technologies encompass 2.5D/3D Integration with TSV, System in Package (SiP), FanOut-WLP, Flip Chip, Cu Pillar/BOT, Fine Pitch Die Bond, Fine Pitch WB, Molding (including Thin Mold and Exposed Die), and Antenna in Package (AiP). Products serve applications in computers, tablets, cellular phones, set-top boxes, LCD monitors, wearable devices, smart appliances, IoT, AI, smart cars, VR/AR, drones, smart speakers, digital cameras, and game consoles.

Differentiator

Problem solved

Functional benefit

Products and services

• PBGA (Plastic Ball Grid Array) Plastic Ball Grid Array package using laminate substrate with wirebond interconnection, suitable for various applications including computing and consumer electronics.
• EDHS-PBGA (Enhanced Dual Heat Spreader Plastic Ball Grid Array) Enhanced Dual Heat Spreader Plastic Ball Grid Array variant offering improved thermal performance for high-heat applications.
• TFBGA / VFBGA (Thin/Very Fine Ball Grid Array) Thin/Very Fine Ball Grid Array packages with fine pitch for miniaturized applications.
• LGA (Land Grid Array) Land Grid Array package with laminate substrate for high-density applications.
• FCBGA (Flip Chip Ball Grid Array) Flip Chip Ball Grid Array offering high electrical performance for computing, networking, and high-end memory applications, with ball counts exceeding 2597.
• FCCSP (Flip Chip Chip Scale Package) Flip Chip Chip Scale Package providing compact form factor with high performance.
• LQFP (Low-profile Quad Flat Package) Quad flat package with leadframe for surface mount applications.
• TQFP (Thin Quad Flat Package) Thin quad flat package variant for space-constrained applications.
• E-pad LQFP (Exposed Pad Low-profile Quad Flat Package) Exposed pad LQFP variant with enhanced thermal performance.
• E-pad TQFP (Exposed Pad Thin Quad Flat Package) Exposed pad TQFP variant with improved thermal dissipation.
• QFN (Quad Flat No-lead) Quad flat no-lead package with leadframe for compact applications.
• WLCSP (Wafer Level Chip Scale Package) Wafer level packaging solution where package outline is the same or near the same as the die, enabling miniaturization.
• Stacked Die Package Multi-die stacked configuration offering higher density, better performance, and smaller footprint.
• Multi-Package BGA Multi-chip module solution integrating multiple chips when known-good-die is not feasible.
• Assembly Service Full turnkey IC packaging services including substrate design, lead frame design, bumping mask design, package characterization (stress, electrical, material, thermal), and reliability testing for fabless companies, IDMs, and foundries.
• Test Service Comprehensive testing solutions for digital, mixed signal, and RF devices including tester capability, CP service, FT/SLT service, burn-in service, back-end service, and engineering services.
• Bumping Service Complete wafer bumping products including direct bumping, repassivation, redistribution, wafer level CSP, and gold bumping for advanced packaging applications.
• Quality Management Company-wide quality management services focused on customer satisfaction, supporting the full backend semiconductor manufacturing process.
• 2.5D/3D Integration with TSV Through-Silicon-Via technology providing vertical electrical interconnections for homogeneous and heterogeneous integration of semiconductor dies, enabling advanced stacking and miniaturization for AI and high-performance computing chips.
• System in Package (SiP) Integration of one or more semiconductor devices plus optionally passive components to define a functional block within a quasi-package, enabling multi-chip integration in compact form factors.
• Fan-Out Wafer Level Package (FO-WLP) Fan-Out Wafer Level Package technology offering additional space for routing higher number of I/O on top of silicon chip area, extending package size beyond conventional Fan-In WLP constraints.
• Flip Chip Flip chip packages offering solutions for low to high I/O applications in high-end memory, ASICs, and microprocessors with high frequency and speed requirements, including full turn-key wafer bumping, wafer sort, flip chip assembly, and testing.
• Cu Pillar and Bond-on-Trace (BOT) Advanced interconnection technology for fine pitch applications, providing electrical performance benefits through copper pillar bumps and bond-on-trace processes.
• Fine Pitch Die Bonding Die bonding technology for fine pitch applications supporting advanced packaging requirements.
• Fine Pitch Wire Bonding (WB) Fine pitch wire bonding technology with copper wires offering better electrical performance due to low resistance parasitic compared to gold wires, while maintaining wire inductance and capacitance characteristics.
• Molding (Thin Mold and Exposed Die) Thin mold and exposed die molding packages suited for computing, video/audio, telecommunications, data acquisition, and communication applications requiring broad performance characteristics.
• Antenna in Package (AiP) Technology to fully integrate antennas, chips, and passives within an IC package, enabling compact wireless communication solutions.

Quantifiable outcome

• 90% customer satisfaction rate, with the target being ≥90% in 2024
• +6 more outcomes

Named customers1 record

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

One partnership is on record.

• ASE Technology Holding Co., Ltd.coreOthersASE Technology Holding Co., Ltd. (TWSE:3711, NYSE:ASX) is the parent company of Siliconware Precision Industries Co., Ltd. SPIL, Advanced Semiconductor Engineering, Inc., and USI Inc. are all members of ASE Technology Holding, which is described as the largest outsourced semiconductor assembly and test company in the world. SPIL aligns with the parent company's sustainability goals and participates in group-level ESG initiatives.

Scale indicators19 records

Recent moves5 records

Expansion highlights5 records

Direct peers

• UTAC Holdings: Singapore-headquartered OSAT with mixed analog/power and logic packaging capabilities. Competes with SPIL in automotive and industrial-grade assembly and test.
• JCET Group: China's largest OSAT, offering bumping, wafer-level packaging, and advanced assembly services. Competes with SPIL especially in mid-range packages and in serving Chinese fabless customers.
• Tongfu Microelectronics: Major Chinese OSAT providing IC packaging and testing services across leadframe, substrate, and advanced packaging. Competes with SPIL in both mature and emerging package types.
• Amkor Technology: Leading US-headquartered OSAT competing head-to-head with SPIL in advanced packaging for AI, HPC, automotive, and mobile customers. Closely aligned on advanced flip chip, TSV/2.5D, and turnkey assembly-and-test services.
• Powertech Technology Inc. (PTI): Taiwan-based OSAT offering bumping, assembly, and test services similar to SPIL. Competes directly across memory and logic packaging, including advanced flip chip and stacked-die packaging.
• ChipMOS Technologies: Taiwan-based OSAT providing assembly and test services for memory and logic semiconductors. Directly competes with SPIL in flat-panel display driver ICs, memory, and mixed-signal test.
• ASE Technology Holding Co., Ltd. Parent company of SPIL and the world's largest OSAT. Directly comparable in advanced packaging (TSV, SiP, FO-WLP, flip chip), test services, and turnkey backend offerings, serving the same fabless, IDM, and foundry customer base globally.

Regional players

• Hana Microelectronics: Thailand-based OSAT offering assembly and test services primarily for Asian customers. Comparable business model to SPIL but focused on a different geography and customer mix.

Broad incumbents

• TSMC: Largest pure-play foundry, increasingly offering advanced packaging (CoWoS, InFO, 3DFabric). Not a classical OSAT but an indirect competitor for advanced packaging share, especially in AI/HPC.
• Samsung Foundry: IDM-foundry offering wafer fabrication plus growing advanced packaging (I-Cube, H-Cube). Competes with SPIL indirectly for advanced packaging business tied to high-performance and memory devices.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

Compliance7 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries2 records

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Siliconware Precision Industries