What Facility does

Facility Co., Ltd. is a Japanese manufacturer of wet processing equipment for the printed circuit board (PCB) and package substrate industry, headquartered in Sagamihara, Kanagawa Prefecture, and operating as a consolidated subsidiary of Tazmo Co., Ltd. since 2017. Founded in 1980 originally as a software developer, the company pivoted into PCB equipment and now designs, manufactures, and services vertical continuous plating (VCP) lines, batch-type plating systems, and complementary automation and ancillary equipment. Its installed base exceeds 400 cumulative VCP and batch units, and it claims top market share for wet PCB equipment in East Asia, with equipment deployed at world-class PCB and package substrate manufacturers serving smartphones, automobiles, computers, and servers.

The core technology stack centers on precision wet chemistry — electroplating, electroless plating, desmear, blackening, and nickel/gold family finishes — executed under proprietary process know-how. Differentiated R&D capabilities include a special-shielding batch electroplating device achieving ±5% film thickness uniformity on 510 x 515mm substrates for PLP applications, an electroless copper adhesion process for glass substrates (4.5–20 N/cm), and a high-aspect-ratio through-glass via (TGV) filling plating process (e.g., Φ80μm, 1.1mmt substrates). Automation hardware and integration services are delivered via sister company Tazmo Vietnam, and the company also resells German SCHMID wet/vacuum process equipment under a long-standing channel partnership dating to 1999.

Facility operates a direct enterprise sales motion targeting Japanese and Taiwanese high-end customers, with manufacturing in China (Dongguan, ISO 9001:2015) and Vietnam (Hanoi) under Japanese quality supervision, and field service technicians deployed across Japan, China, Vietnam, and Thailand. Revenue is generated primarily through one-time capital equipment sales, recurring maintenance/modification service contracts, and custom engineering fees; pricing is not publicly disclosed and is negotiated on a contact basis. The customer base is concentrated among top-tier PCB and package substrate manufacturers, with no named public logos disclosed in available sources. The company reports ¥203.86 million in stated capital, 276 consolidated employees, and relationships with MUFG Bank and Mizuho Bank as principal banking partners.

Name

Facility

Legal name

株式会社ファシリティ

Website

https://facility.co.jp

Company type

Private

Founded year

1980

Operating status

Operating

Headcount range

11–50 employees

Short description

Facility Co., Ltd. is a Japan-based manufacturer of wet processing equipment — vertical continuous plating lines, batch plating systems, and automation — for printed circuit board and package substrate makers. It serves top-tier PCB manufacturers across Japan, Taiwan, China, Vietnam, and Thailand, and is a consolidated subsidiary of Tazmo Co., Ltd.

Ownership category

akta.pro rank

Product category

PCB Manufacturing Equipment

NAICS

Bare Printed Circuit Board Manufacturing (334412)

SIC

Printed Circuit Boards (3672)

akta.pro primary industry

PCB Fabrication (Rigid PCBs) (HDAHAOAG)

Keywords

• PCB manufacturing equipment
• Wet processing equipment
• Plating equipment
• Vertical continuous plating
• Package substrate plating

Headquarters

HQ city

Sagamihara

HQ country

Japan

HQ region

Asia

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Operations, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. Manufacturing Equipment Sales: Sale of wet processing equipment including Vertical Continuous Plating Lines (VCP), batch-type plating equipment, automation equipment, and other process equipment. One-time capital equipment sales with customization options.
2. Maintenance and After-Sales Services: After-sales support including maintenance, emergency troubleshooting, equipment modification, relocation, and repair services. Provided through distributed technical staff across Japan, China, Vietnam, and Thailand.
3. Customization and Integration Services: Custom design and engineering services for plating processes, including chemical selection, jig preparation based on board size/thickness, and full automation system design from concept through implementation.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels2 records

Core offering

Facility designs, manufactures, and sells wet processing equipment for printed circuit board (PCB) and package substrate production, with its flagship Vertical Continuous Plating Line (VCP) and batch-type plating equipment. The company also provides automation equipment for PCB conveyance and loading/unloading, and serves as a Japanese distributor for SCHMID (Germany) wet process and vacuum equipment. It offers comprehensive after-sales maintenance, modification, and emergency support services across Japan, China, Vietnam, and Thailand.

Product overview

Facility offers a portfolio of wet processing equipment for printed circuit board manufacturing, centered on vertical continuous plating (VCP) lines and batch-type plating systems with over 400 units sold cumulatively. The product lineup includes core plating equipment (VCP and Batch Type), automation equipment for PCB conveyance and loading/unloading, SCHMID-branded German wet process and vacuum equipment, and complementary systems (development, stripping, plastic plating, chemical dilution). All equipment is manufactured in Japan, China, and Vietnam facilities under Japanese headquarters quality supervision. The company also provides maintenance services and advanced R&D capabilities including special shielding electroplating, glass substrate plating, and TGV filling processes.

Differentiator

Problem solved

Functional benefit

Brands

• VCP (Vertical Continuous Plating Line): Vertical continuous plating equipment — the company's flagship product line serving high-end PCB manufacturers in Japan and Taiwan, capable of handling via-fill, through-hole, and HDI applications.

Products and services

• Vertical Continuous Plating Line (VCP) Vertical continuous plating system and Facility's flagship product, designed for high-end PCB and package substrate manufacturers. Supports via-fill, through-hole, and HDI applications with customizable configurations based on customer needs.
• Batch Type Equipment Batch-type plating equipment for a wide range of wet processes including electroless plating, desmear, black oxide processing, nickel/gold plating, and nickel/palladium/gold plating. Offered in systems ranging from high-performance to mass production lines, customized to customer investment plans.
• Automation Equipment Automation systems for loading/unloading of plating equipment and PCB conveyance between processes, including integration with third-party equipment such as laser processing machines. Supports labor savings, productivity improvement, and quality stabilization.
• SCHMID Equipment German-made wet process and vacuum processing equipment for PCB and electronic component manufacturing, distributed by Facility in the Japanese market. Includes automation and conveyance systems, ranging from standalone units to smart factory solutions from SCHMID (founded 1965).
• Other Equipment (Vertical Development, Vertical Stripping, Plastic Plating, Chemical Dilution Systems) Complementary PCB manufacturing systems including vertical development devices, vertical stripping devices, plastic plating devices, and chemical dilution systems for SAP processes, custom-designed for specific production requirements.
• Maintenance Services After-sales support including installation, maintenance, modification, relocation, and repair services for installed equipment, with technical staff deployed across Japan, China, Vietnam, and Thailand to provide rapid response to customer needs.

Quantifiable outcome

• Film thickness uniformity of ±5% on 510x515mm substrates
• +2 more outcomes

Named customers3 records

Segments3 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Three partnerships are on record, tiered core and flagship.

• タツモ株式会社 (Tazmo Co., Ltd.)coreStrategic or Co-development Partner · 1 January 2017Tazmo Co., Ltd. is the parent company and major shareholder of Facility Co., Ltd. Facility became part of the Tazmo Group in 2017. Tazmo Vietnam handles design and manufacturing of automation equipment for Facility. This is a core group relationship with shared manufacturing resources.
• 中国 プロテック社 (Protec)coreStrategic or Co-development Partner · 1 January 2008Proteck (sic) China subsidiary acquired in 2008 for manufacturing and sales of various plating equipment. This subsidiary became the foundation of Facility's China operations and was later expanded as Facility Technology Dongguan.
• SCHMID (ドイツ シュミッド社)flagshipChannel Partner/ Reseller/ Distributor · 1 January 1965German company SCHMID, established in 1965, is an innovative partner in the electronics industry. Facility began handling SCHMID equipment in 1999. SCHMID provides wet processes, vacuum processing technology, and automation/handling systems for PCB and electronic component manufacturing, from individual machines to smart factory solutions.

Scale indicators5 records

Recent moves8 records

Expansion highlights4 records

Direct peers

• C. Uyemura & Co., Ltd. Japan-headquartered supplier of plating chemicals and equipment for PCB and semiconductor packaging. Direct competitor to Facility in wet processing equipment and surface finishing chemistry for PCB fabrication.
• Ihara Electronic Industries Co., Ltd. Japanese manufacturer of plating chemicals and equipment for PCBs and electronics. Similar customer base and process focus to Facility, especially in East Asian PCB manufacturing.
• Technic Inc. US-based supplier of plating chemistry and equipment for PCB, semiconductor and electronic component manufacturing. Competes with Facility in advanced wet processes for PCB and package substrates.
• Schloetter Company: UK-based PCB and electronics chemistry and equipment supplier. Competes with Facility in plating chemistry and wet process equipment for PCB fabrication.
• MEC Co., Ltd. Japanese manufacturer of plating chemicals and equipment for electronics, including PCB fabrication and semiconductor packaging. Comparable product line and customer base to Facility.
• JCU Corporation: Japanese maker of chemicals and equipment for PCB surface treatment ( electroless plating, copper, tin). Closely comparable to Facility in serving PCB manufacturers with chemistry and process equipment.

Broad incumbents

• ASMPT (ASM Pacific Technology): Global semiconductor and electronics assembly equipment supplier with growing exposure to advanced packaging. Adjacent to Facility's PCB and package substrate process equipment business.
• Atotech (MKS Instruments): Global leader in PCB wet chemistry and plating equipment, now part of MKS Instruments. Competes with Facility across plating and surface finishing, with broader portfolio and global service network.
• DuPont Electronics & Industrial: Major diversified materials supplier with significant PCB metallization and process chemistry offerings. Overlaps with Facility in PCB and advanced packaging wet processing.

Emerging players

• Ebara Corporation: Diversified industrial pump and equipment maker with exposure to plating and wet process equipment used in PCB manufacturing. Partial overlap with Facility in plating line components and fluid handling.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Facility