Shenzhen Chengtian Weiye Technology

What Shenzhen Chengtian Weiye Technology does

Shenzhen Chengtian Weiye Technology Co., Ltd. (Shenzhen Stock Exchange ChiNext, ticker 300689) is a Chinese precision manufacturer founded in 1997 that operates three business segments: smart cards and digital security carriers, semiconductor packaging materials, and AI INFRA liquid cooling thermal management. The legacy smart card business serves telecommunications operators, financial institutions, and government identity programs with SIM/USIM cards, financial IC cards, and secure chip packaging, generating stable cash flow from an established customer base built over more than two decades. In 2019, the company extended into semiconductor packaging materials — including lead frames and copper pin heat-spreading substrates for power devices — targeting domestic substitution demand in advanced packaging.

The company's strategic center of gravity has shifted toward AI infrastructure thermal management since 2023. Leveraging its precision manufacturing and chip-level packaging heritage, Chengtian Weiye has built a full-stack liquid cooling product portfolio spanning chip-level micro-channel liquid cold plates (MLCP), server-level cold plate modules with quick connectors and stainless steel bellows tubing, rack-level manifolds and CDU structural components, and data-center-level secondary-side liquid cooling architectures. The company holds IATF16949, ISO9001, ISO14001, and ISO45001 certifications and operates a documented full-process closed loop covering CNC machining, vacuum brazing, micro-channel processing, surface treatment, leak testing, and reliability verification. In October 2025, the company formed SuperX Cooltech Pte. Ltd. in Singapore with SuperX AI Technology Limited (NASDAQ: SUPX) — SuperX became the single largest shareholder — to distribute liquid cooling solutions globally outside mainland China, Hong Kong SAR, and Macau SAR, targeting AI data center deployments exceeding 100kW per rack driven by next-generation GPU architectures. Revenue mechanics are B2B hardware sales with quote-based, project-negotiated pricing across telecom, financial, semiconductor manufacturing, and AI infrastructure customer segments.

Name

Shenzhen Chengtian Weiye Technology

Legal name

深圳市澄天伟业科技股份有限公司

Website

https://ctwygroup.com

Company type

Public

Founded year

1997

Operating status

Operating

Headcount range

101–250 employees

Short description

Shenzhen Chengtian Weiye Technology is a Chinese precision manufacturer (SZSE: 300689) producing smart cards, semiconductor packaging materials, and AI infrastructure liquid cooling components for telecom, finance, semiconductor, and AI data center customers.

Ownership category

akta.pro rank

Product category

Electronic Components Manufacturing

NAICS

Electrical Equipment Manufacturing (3353), Semiconductor and Related Device Manufacturing (334413)

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600), Electrical Industrial Apparatus (3620)

akta.pro primary industry

Thermal Management & Safety Systems (cooling, fire detection/suppression, venting) (IMAGAHAI)

akta.pro secondary industry

Secure ICs, Smart Cards & Trusted Hardware (HDAHAAAJ)

Keywords

• Smart card manufacturing
• Semiconductor packaging materials
• AI server liquid cooling
• Micro channel cold plates
• Digital security carriers

Headquarters

HQ city

Nanshanqu

HQ country

China

HQ region

Asia

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Operations, Technology or R&D, Infrastructure, Marketing or Sales

Revenue model

1. 智能卡与数字安全 (Smart Card and Digital Security): Provides smart cards, dedicated chip packaging, and digital security carrier products and services for telecommunications, finance, and identity identification applications. Generates recurring revenue through established customer base and scaled manufacturing capabilities.
2. 半导体封装材料 (Semiconductor Packaging Materials): Sales of lead frames, copper heat-spreading substrates, and related key materials for power devices and advanced packaging. Supports domestic substitution (国产替代) demand in the semiconductor sector.
3. AI INFRA 液冷散热 (AI INFRA Liquid Cooling & Thermal Management): Sales of liquid cooling core components (cold plates, manifolds, CDU components, quick connectors, tubing) and system-level engineering capabilities for AI data centers. Revenue from both component supply and system-level project cooperation.
4. 深圳证券交易所创业板上市 (Shenzhen Stock Exchange GEM Listed Company): Publicly listed on Shenzhen Stock Exchange Growth Enterprise Market (创业板), stock code 300689. Listed since 2017.

Go-to-market motion2 records

Distribution channels2 records

Marketing channels3 records

Core offering

Shenzhen Chengtian Weiye Technology manufactures smart cards and digital security carriers, semiconductor packaging materials (lead frames, copper heat-spreading substrates), and AI infrastructure liquid cooling thermal management components including MLCP micro channel liquid cold plates, manifolds, CDU structural components, quick connectors, and stainless steel bellows tubing. The company serves telecommunications, finance, identity verification, power device, and AI data center customers through integrated material-level, structure-level, and system-level engineering capabilities.

Product overview

Shenzhen Chengtian Weiye Technology (深圳市澄天伟业科技股份有限公司, Stock Code: 300689) is a Shenzhen Stock Exchange GEM-listed company operating three business segments: Smart Cards & Digital Security, Semiconductor Packaging Materials, and AI INFRA Liquid Cooling Solutions. The AI INFRA Liquid Cooling business provides a comprehensive thermal management product portfolio spanning from chip-level micro channel liquid cold plates (MLCP) to server-level cold plate modules, rack-level manifolds, CDU systems, quick connectors, and complete liquid-cooled rack solutions. The company leverages its semiconductor packaging, precision manufacturing, and reliability verification capabilities to deliver products from prototype validation to mass production, serving AI data center deployments with power demands exceeding 100kW per rack.

Differentiator

Problem solved

Functional benefit

Brands

• AI INFRA 液冷散热: AI infrastructure liquid cooling thermal management platform providing microchannel liquid cold plates (MLCP), CDU systems, manifolds, and liquid cooling solutions for AI servers and data centers
• AI INFRA Thermal

Products and services

• Smart Cards & Digital Security Carriers (智能卡与数字安全载体)
• Semiconductor Packaging Materials (半导体封装材料)
• AI INFRA Liquid Cooling Solutions (AI INFRA 液冷散热)
• MLCP Micro Channel Liquid Cold Plates (MLCP 微通道液冷板)
• Copper Brazed / Nano-Injection Liquid Cooling Plates
• CDU (Coolant Distribution Unit) Structural Components
• Manifold / Water Distributor (分水器)
• Quick Connectors & Connector Bases (快速接头与接头底座)
• Stainless Steel Bellows Piping (不锈钢波纹管路) Flexible stainless steel bellows piping components for rack-level liquid cooling pipeline systems providing durable and reliable fluid transport.

Quantifiable outcome

• Single-rack power consumption management for AI GPU deployments exceeding 100kW, enabling liquid cooling as the critical thermal management solution

Segments3 records

Ideal customer profiles3 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

One partnership is on record.

• SuperX AI Technology LimitedcoreStrategic or Co-development Partner · 24 October 2025SuperX AI Technology Limited (NASDAQ: SUPX) and Shenzhen Chengtian Weiye Technology's Hong Kong wholly-owned subsidiary have entered into a definitive agreement to jointly establish SuperX Cooltech Pte. Ltd. in Singapore. SuperX becomes the single largest shareholder. The joint venture integrates SuperX's AI system integration capabilities with Chengtian Weiye's thermal management R&D and manufacturing expertise (including Micro Channel Liquid Cold Plates, CDU systems, and manifolds) to provide liquid cooling products and infrastructure solutions to global markets outside mainland China, Hong Kong SAR, and Macau SAR. The partnership addresses escalating power demands from next-generation GPU architectures like NVIDIA Blackwell, pushing single-rack power consumption above 100kW.

Scale indicators5 records

Recent moves6 records

Expansion highlights5 records

Direct peers

• IDEMIA: Global leader in digital identity and smart card solutions serving telecom (SIM), financial, and government identity markets—directly comparable to Chengtian Weiye's legacy smart card and digital security carrier business.
• Asetek: Norwegian liquid cooling solutions provider expanding from gaming/PC heritage into data center and AI server cooling. Comparable product overlap in cold plates and liquid cooling loops targeting high-density compute deployments.
• CoolIT Systems: Canada-based direct liquid cooling specialist serving HPC and AI data centers with cold plates, manifolds, and complete rack-level cooling systems—directly comparable to Chengtian Weiye's MLCP, CDU, and rack-level liquid cooling offerings.
• STULZ: Germany-based precision air conditioning and liquid cooling specialist serving data centers worldwide. Direct competitor in precision cooling for high-density AI and HPC deployments where Chengtian Weiye targets.
• Amphenol: Global interconnect, sensor, and antenna solutions provider with thermal management products including cold plates and liquid cooling connectors—closely comparable to Chengtian Weiye's quick connector and cold plate components for AI servers.
• Boyd Corporation: Global thermal management and engineered materials manufacturer serving data center, semiconductor, and electronics customers with cold plates and liquid cooling components—directly comparable product portfolio to Chengtian Weiye's thermal management line.

Broad incumbents

• Vertiv: Major US-listed data center infrastructure provider offering thermal management, power, and IT systems. Operates broadly across data center cooling where Chengtian Weiye targets the AI-specific liquid cooling niche.
• Schneider Electric: Global energy management and data center infrastructure giant offering integrated cooling solutions alongside power and IT systems. Competes with Chengtian Weiye at the data center level with comprehensive thermal management portfolios.
• Rittal: Germany-based (Friedhelm Loh Group) enclosure, power distribution, and data center cooling provider. Operates broadly in industrial cooling with liquid cooling solutions that overlap Chengtian Weiye's CDU and rack-level offerings.

Regional players

• Wuhan Tianyu Information Industry: China-based smart card and digital security products manufacturer serving telecom, finance, and identity verticals within the Chinese market. Closest regional peer to Chengtian Weiye's legacy smart card business with comparable product offerings.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/ctwyindo

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Subsidiaries1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Shenzhen Chengtian Weiye Technology