What Taipro Engineering does

Taipro Engineering is a Belgium-based, privately held microelectronics design and manufacturing service provider founded in 2009 in Lambermont. The company operates an ISO 7 cleanroom and delivers an integrated offering that combines electronic design (circuit and layout, feasibility studies, prototyping, hybrid electronics integrating bare die and SMD components on the same board) with advanced IC packaging and assembly (die attach, flip-chip, wire bonding, encapsulation, sintering, eutectic bonding, BGA, thermo-compression). Its proposition to customers is a one-stop concept-to-production workflow that eliminates the need to coordinate multiple vendors across the design and packaging boundary.

The company serves mission-critical verticals including semiconductors, aerospace (including Formula 1 motorsport), biomedical/medical devices, automotive, and heavy industries, with approximately 150 custom projects executed per year and annual production scaled from 50-100 pieces in 2010 to 50,000 pieces in 2025. The firm claims six world-first achievements in microelectronics packaging and positions its hybrid electronics capability as unique in Western Europe. Its go-to-market is direct enterprise sales via phone, email, and a quote-request workflow, with no public pricing or self-serve channel; all projects are bespoke and quotation-driven.

Taipro Engineering is founder-led by CEO Michel Saint-Mard and has grown to a team of approximately 13-14 engineers, technicians, and support staff across R&D, production, operations, quality, embedded systems, sales, and administration. Growth has been entirely self-funded through organic operations with no disclosed external investors, funding rounds, or M&A activity. Operational partnerships include an academic talent pipeline with Texas A&M University (running since approximately 2022) and a co-marketing collaboration with Sensorade, a complementary ultra-miniaturized sensor firm co-located at the Lambermont facility.

Name

Taipro Engineering

Legal name

Taipro Engineering

Website

https://taipro.be

Company type

Private

Founded year

2009

Operating status

Operating

Headcount range

11–50 employees

Short description

Taipro Engineering is a Belgium-based microelectronics design and manufacturing firm combining electronic design with advanced IC packaging in an ISO 7 cleanroom. It serves roughly 150 bespoke projects per year across aerospace, semiconductor, biomedical, automotive, and industrial customers, producing 50,000 pieces annually.

Ownership category

akta.pro rank

Product category

Microelectronics Design and Manufacturing Services

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

SIC

Services-Commercial Physical & Biological Research (8731)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

akta.pro secondary industry

Testing, Inspection, Certification & Commissioning (TICx) Technical Services (BPAHAIAL)

Keywords

• Microelectronics design services
• Semiconductor packaging services
• Advanced IC packaging
• Hybrid electronics manufacturing
• Electronic assembly services

Headquarters

HQ city

Lambermont

HQ country

Belgium

HQ region

Europe

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Infrastructure, Technology or R&D, Supply Chain, Marketing or Sales

Revenue model

1. Electronic Design Services: Project-based design services covering circuit design, layout, component selection, feasibility studies, and prototypes
2. Manufacturing/Assembly Services: Production services including die attach, pick & place, flip-chip, wire bonding, encapsulation, and testing
3. Complete Electronic Solutions: Turnkey solutions from wafer design to finished electronic products including packaging, supply chain, micro-assembly, and EMS production

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

Taipro Engineering provides integrated microelectronics design and manufacturing services, transforming customer ideas into reliable electronic designs and producing them through advanced packaging and assembly. Core offerings include feasibility studies, circuit design and layout, prototyping, and testing on the design side, plus die attach, pick & place, flip-chip, wire bonding, encapsulation, and inspection in an ISO 7 cleanroom on the production side. The company combines design and production under one roof, unique in Western Europe, serving aerospace, semiconductor, biomedical, automotive, and industrial customers.

Product overview

Taipro Engineering (standing for 'Tailored microsystems improving your Product') is a microelectronics design and manufacturing service provider offering an integrated approach combining electronic design and advanced packaging. The core offerings include Electronic Project Design services (feasibility studies, circuit design, layout, prototyping, testing) and Manufacturing Services (die attach, pick&place, flip-chip, wirebonding, encapsulation). Additional supporting services include Design for Packaging, Workshop Assembly, Custom 3D Printing, Laser Marking, and Optical/Functional Inspection. The company operates an ISO 7 cleanroom and serves key markets including semiconductors, aerospace, biomedical, automotive, and heavy industries, supporting customers from concept to production.

Differentiator

Problem solved

Functional benefit

Products and services

• Electronic Project Design Transforms customer ideas into reliable electronic designs ready for manufacturing, including hybrid electronics (bare die and SMD components on the same board), standard electronics, feasibility studies, circuit design and layout, components selection and purchasing, prototypes, and tests. Targeted at enterprise customers in semiconductors, aerospace, biomedical, automotive, and heavy industries.
• Manufacturing Services Production service taking validated designs into reliable assembly and IC packaging, including die attach, pick & place, flip-chip, wire bonding, and encapsulation, performed in an ISO 7 cleanroom. Targeted at enterprise customers requiring advanced microelectronics packaging.
• Assembly and Packaging Technologies Advanced assembly and packaging processes including die attach (stacked die, shear test, sintering, eutectic), flip-chip (stud bumping, BGA, thermo-compression), wire bonding (wedge bonding, ball bonding, pull test), and encapsulation (glob-top, dam and fill, partial). Targeted at enterprise customers needing advanced packaging for semiconductors, aerospace, medical, and automotive applications.
• Electronic Microsystems Design Development of test benches and functional validation, demonstration modules ready for customer delivery, and complete electronic solutions integrating chips from silicon die to system integration. Targeted at enterprise customers requiring complete microelectronics solutions.
• Workshop Assembly Manual soldering, connector integration, and small-series builds performed under controlled ESD conditions. Targeted at enterprise customers needing small-series or specialized assembly work.
• Custom 3D Printing (ESD-Safe) Design and production of custom protective boxes and fixtures using ESD-safe filament, ensuring component safety during storage and shipment. Targeted at enterprise customers needing custom handling fixtures for sensitive electronics.
• Laser Marking Permanent and high-precision component identification for traceability and quality assurance. Targeted at enterprise customers requiring component traceability in regulated industries.
• Optical and Functional Inspection Comprehensive inspection to guarantee product conformity and electrical performance. Targeted at enterprise customers in high-reliability sectors such as aerospace, automotive, and medical devices.

Quantifiable outcome

• 50,000 pieces produced annually as of 2025 (up from 50-100 in 2010)
• +2 more outcomes

Named customers5 records

Segments5 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Two partnerships are on record, tiered minor.

• Texas A&M UniversityminorOthers · 1 January 2022Educational partnership for talent recruitment. Texas A&M University, the largest engineering university in the US, sends interns annually to Taipro's facility in Lambermont, Belgium. Collaboration has been running for 3 years (since approximately 2022). Initiative addresses challenges in finding local engineering talent in Belgium.
• SensorademinorStrategic or Co-development PartnerJoint open door event for JDE2025 at shared location (151 Rue des Ormes, Lambermont). Sensorade specializes in ultra-miniaturized pressure sensors. Both companies are high-tech microelectronics firms that co-host events to showcase their complementary expertise in microelectronics packaging and custom microsystem development.

Scale indicators5 records

Recent moves4 records

Expansion highlights4 records

Direct peers

• Variosystems: Swiss EMS provider offering design, industrialization, and production of high-reliability electronic assemblies for medical, industrial, and aerospace customers. Comparable boutique European EMS profile.
• Cicor Technologies: Swiss-listed provider of advanced electronic packaging and EMS services across Europe, with similar focus on miniaturized, high-reliability assemblies for medical, aerospace, and industrial customers. Directly comparable in service model and target verticals.
• Asteelflash: French-headquartered EMS provider (now part of Universal Electronics) with European and global footprint serving aerospace, medical, automotive and industrial customers. Comparable in design-to-production EMS model and vertical mix.
• Micross Components: US/UK-based provider of advanced semiconductor packaging, die processing, and high-reliability microelectronic services. Directly comparable in advanced packaging (flip-chip, wire bonding, BGA) and high-reliability customer base.
• ICAPE Group: French-listed distributor and service provider for PCBs and custom electronic assemblies, serving industrial and high-reliability customers across Europe. Comparable in custom assembly services and European customer base.
• Neways Electronics International: Dutch EMS provider serving industrial, aerospace/defense, medical and automotive customers with custom electronic and microelectronic assemblies. Comparable in customer verticals and the design-to-production integration model.
• Lacroix Electronics: French EMS division of Lacroix Group, focused on industrial, automotive, aerospace and medical electronics. Comparable in mid-sized European EMS positioning and multi-vertical customer mix.

Regional players

• Inission: Swedish EMS provider focused on industrial and high-reliability customers in the Nordics. Comparable in custom assembly services but primarily serves a different Nordic geography rather than Belgium/France/Benelux.

Broad incumbents

• Amkor Technology: Top-tier global OSAT offering advanced packaging and test services for semiconductor and high-reliability customers. Comparable in advanced packaging capabilities but operates as a broad incumbent with extensive scale and geographic reach Taipro cannot match.
• ASE Technology Holding: World's largest OSAT provider offering advanced packaging, test, and assembly services globally. Comparable in advanced packaging offering (flip-chip, BGA, wire bonding) but operates at vastly larger scale and broader portfolio than Taipro.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/taipro-engineering-s-a-

Revenue estimate

Valuation estimate

Number of profiles

Profiles12 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Taipro Engineering