IPDIA
IPDIA is a Montreal-based private semiconductor company founded in 2009 that develops passive integration technologies — including connecting substrates, 3D packaging, and interconnection solutions — for the advanced electronics packaging value chain.
- Company typePrivate
- Founded2006
- HeadquartersMontréal, Canada
- Headcount51–100
- GTM typeB2B
- OfferingHardware or Manufacturing
What IPDIA does
IPDIA is a Montreal, Canada-based private semiconductor company founded in 2009 that develops passive integration technologies for advanced electronics packaging. The company's stated focus spans connecting substrates, 3D packaging, and interconnection solutions — core disciplines in heterogeneous integration and chiplet-era semiconductor manufacturing. Operating in the for-profit sector with 51-100 employees, IPDIA serves customers in the semiconductor and electronics packaging value chain.
The company was founded by Franck Murray, who continues to serve as founder and CEO, indicating a stable, founder-led governance structure. IPDIA's only disclosed capital event is a Series 2 funding round of $6.81 million closed on 2009-05-04, backed by a deep-tech investor syndicate consisting of CEA Investissement, Emertec, NCI, and Prime Ventures. The presence of CEA Investissement — the corporate venture arm of France's CEA — alongside other European semiconductor-focused VCs suggests an early alignment with research-driven capital and the broader European semiconductor ecosystem, despite the company's Canadian headquarters.
The combination of Montreal's microelectronics cluster, founder-led leadership, and specialist positioning in passive integration and 3D packaging points to a focused, IP-centric business model serving advanced packaging customers. The dataset does not disclose product pricing, customer logos, segment mix, or revenue figures, limiting deeper financial characterization.
IPDIA firmographics
Firmographics- Name
- IPDIA
- Legal name
- Société FactorFX
- Website
- https://ipdia.com
- Company type
- Private
- Founded year
- 2006
- Operating status
- Operating
- Headcount range
- 51–100 employees
- Short description
- IPDIA is a Montreal-based private semiconductor company founded in 2009 that develops passive integration technologies — including connecting substrates, 3D packaging, and interconnection solutions — for the advanced electronics packaging value chain.
- Ownership category
- akta.pro rank
IPDIA industry classification
Industry- Product category
- Semiconductor Packaging
- NAICS
- Electronic Connector Manufacturing (334417), Semiconductor and Other Electronic Component Manufacturing (3344)
- SIC
- Electronic Connectors (3678)
- akta.pro primary industry
- Passive Component Arrays & Modules (Integrated Passives/IPD Networks) (HDAHANAJ)
- akta.pro secondary industry
- Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC)
Keywords
Where IPDIA is headquartered
LocationHeadquarters
- HQ city
- Montréal
- HQ country
- Canada
- HQ region
- North America
Markets served
IPDIA business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Operations, Supply Chain, Infrastructure
Revenue model
- Integration and Consulting Services: Professional services for implementing and integrating open source IT solutions, including audit, strategy, transformation, migration, and integration into existing systems. The company leverages 20 years of experience to provide tailored solutions.
- Technical Support Subscriptions: Recurring support services providing dedicated team access for questions and incident ticket management with rapid response times.
- Software Subscriptions: Subscription offerings for third-party and proprietary open source solutions including Proxmox virtualization subscriptions and related licensing.
Go-to-market motion1 record
Distribution channels2 records
Marketing channels4 records
IPDIA product offering
Product offeringCore offering
IPDIA develops passive integration technology for advanced semiconductor applications. The company specializes in 3D packaging and interconnection solutions that connect substrates within integrated circuits, enabling higher-density, higher-performance IC designs for electronics manufacturers.
Product overview
FactorFX is an open source IT integration company that develops and supports a portfolio of software solutions. The core offerings include My B'Suite (collaborative messaging environment built on Bluemind), OCS Inventory (IT asset management and deployment), and Bekane (VDI solution). These products are complemented by infrastructure services, technical support, and consulting capabilities, delivered as an integrated ecosystem for enterprise IT environments.
Differentiator
Problem solved
Functional benefit
Brands
- My B'Suite: Collaborative messaging solution developed by FactorFX, built around the Bluemind platform
- OCS Inventory
Products and services
- Passive Integration Technology IPDIA's foundational technology platform for embedding passive components (resistors, capacitors, inductors) into interconnect substrates, enabling miniaturization and performance gains in integrated circuits for semiconductor manufacturers.
- 3D Packaging Solutions Three-dimensional integrated circuit packaging technology that enables vertical stacking and interconnection of substrates and dies, targeting semiconductor and electronics OEMs seeking higher functional density in their products.
- Substrate Interconnection Technology IPDIA's interconnection technology for bonding and linking multiple substrates within advanced IC packages, supporting high-bandwidth and high-density routing required by next-generation semiconductor devices.
Companies that use IPDIA
Customer profileSegments2 records
Ideal customer profiles1 record
IPDIA technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature2 records
IPDIA partnerships and signals
Strategic signalPartnerships
Two partnerships are on record, tiered core.
- BluemindcoreFactorFX integrates Bluemind's collaborative messaging platform into My B'Suite, offering enterprise messaging solutions to clients. Bluemind provides the core messaging technology that powers their proprietary My B'Suite product. This is a core technology partnership for their messaging solutions.
- ProxmoxcoreFactorFX offers Proxmox virtualization solutions through subscription services, providing open source virtualization technology to customers. They provide subscription procurement and integration services for Proxmox VE and related products.
Scale indicators2 records
Recent moves3 records
Expansion highlights3 records
IPDIA competitors and assessment
Company assessmentBroad incumbents
- Stats ChipPAC / JCET: OSAT provider focused on advanced packaging including WLP, fan-out, and 3D/TSV integration. Compares to IPDIA on packaging/interconnect technology for 3D and wafer-level integration.
- Vishay Intertechnology: Global supplier of discrete semiconductors and passive components including integrated passive networks. Comparable product overlap in passive component arrays and modules for similar end-markets.
- TDK Corporation (including EPCOS): Major passive component and module supplier competing in integrated passives, WLP/embedded substrates, and 3D packaging for RF and automotive modules. Same end-customers and qualification cycles as IPDIA.
- Samsung Electro-Mechanics: Leading manufacturer of MLCCs, IPDs, and substrate package solutions for mobile/5G modules. A meaningful competitor in integrated passive components for handset and RF modules — directly comparable product lines.
- Murata Manufacturing: World's largest passive component manufacturer with deep IPD/MLCC and module integration capabilities. Directly comparable as the dominant buyer/integrator in IPD networks and substrate-level packaging that IPDIA targets.
- Amkor Technology: One of the largest OSATs globally with strong positions in WLP, fan-out wafer-level packaging, and 3D packaging. Comparable on packaging/interconnect capability that competes with IPDIA's substrate-level integration.
- STMicroelectronics: European IDM active in integrated passives, MEMS, and advanced packaging (including 3D/TSV). Comparable as a broad European semiconductor incumbent that IPDIA cooperates with or competes against in passive integration.
- AVX / Kyocera AVX: Large passive and interconnect component maker with strong portfolios in capacitors, integrated passives, and substrate packaging used in mobile and RF modules. Overlaps with IPDIA in integrated passives for advanced packages.
Emerging players
- Ipdia (legacy competitor sets aside) — Silicon Laboratories / MaxLinear IPD suppliers: Specialty semiconductor and IPD suppliers serving RF/wireless integration. Comparable as emerging players in integrated passive and 3D interconnect technology that compete with IPDIA's specialty offerings.
Others
- CEA-Leti (technology ecosystem): French deep-tech research institute with leading programs in IPD, TSV, and 3D packaging. Not a competitor per se but the primary upstream R&D partner and reference institution for IPDIA's integrated passive and 3D packaging technologies.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat3 records
Key risks5 records
Key highlights5 records
Customer concentration
IPDIA social profiles
Digital presenceIPDIA financial estimates
Financial estimateRevenue estimate
Valuation estimate
IPDIA leadership team
Management profileNumber of profiles
Profiles1 record
IPDIA funding detail
Funding detailFunding overview
Funding rounds1 record
Investors4 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
IPDIA M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about IPDIA
What does IPDIA do?
IPDIA develops passive integration technology for advanced semiconductor applications. The company specializes in 3D packaging and interconnection solutions that connect substrates within integrated circuits, enabling higher-density, higher-performance IC designs for electronics manufacturers.
Is IPDIA a public or private company?
IPDIA is a private company. It is classified as venture growth investor backed and is currently operating.
When was IPDIA founded?
IPDIA was founded in 2006. It employs 51 to 100 people.
Where is IPDIA based?
IPDIA is headquartered in Montréal, Canada, in the North America region.
How does IPDIA make money?
Three revenue lines are on record. Integration and Consulting Services are the primary driver. The others are technical Support Subscriptions and software Subscriptions.
Who are IPDIA's main competitors?
Broad incumbents on record are Stats ChipPAC / JCET, Vishay Intertechnology, TDK Corporation (including EPCOS), Samsung Electro-Mechanics, Murata Manufacturing, Amkor Technology, STMicroelectronics and AVX / Kyocera AVX. Ipdia (legacy competitor sets aside) — Silicon Laboratories / MaxLinear IPD suppliers is listed as an emerging player. CEA-Leti (technology ecosystem) is listed as an others.
Does IPDIA have an API?
No public API is recorded for IPDIA.
What industry is IPDIA in?
IPDIA's product category is Semiconductor Packaging. Its primary akta.pro industry code is HDAHANAJ, Passive Component Arrays & Modules (Integrated Passives/IPD Networks), with a secondary code of HDAHADAC, Wafer-Level Packaging (WLP) & Redistribution (RDL). Its NAICS code is 334417 and its SIC code is 3678.