Advanced Printed Electronic Solutions (APES)

What Advanced Printed Electronic Solutions (APES) does

Advanced Printed Electronic Solutions (APES) is a private Delaware LLC headquartered in Fishkill, New York that designs, develops, and delivers additive manufacturing electronics (AME) systems. The company combines mechanical, electrical, and process engineering with 3D printed electronics to produce full-stack mechatronic and structural electronic solutions, serving semiconductor packaging, medical device, and advanced materials and optics customers. Its offering spans engineering services, rapid prototyping, pilot manufacturing, and production manufacturing, in addition to hardware platforms and software.

APES's product portfolio centers on the Matrix6D software-defined additive manufacturing platform for factory-scale production, alongside the HELIOS and HYPERION R&D platforms (developed by partner Kronos Mechatronics, for which APES serves as an authorized manufacturer representative) and the Aion-5X CAD/CAM software that provides a unified workflow across R&D and production systems. The underlying technology supports multiple AME workflows including fused filament manufacturing, volumetric additive manufacturing, pick-and-place, piezo/inkjet deposition, UV curing, and hybrid additive/subtractive builds. The company protects its position with a registered portfolio of 14 patent families covering platform architecture, semiconductor packaging, multi-axis build platforms, and data processing.

The business operates a consultative direct enterprise sales motion with a long-cycle, four-phase methodology from concept to manufacturing, and quote-based, multi-year contract pricing tailored to each customer. Revenue streams combine engineering services, prototyping services, hardware platform sales (Matrix6D, R&D platforms), licensing and capability transfer, and recurring software revenue. The company is founder-led by Rich Neill, with a small named leadership team and one disclosed strategic enterprise partnership (Great Lakes Semiconductor, February 2026) that anchors its move into semiconductor packaging and heterogeneous integration.

Name

Advanced Printed Electronic Solutions (APES)

Legal name

Advanced Printed Electronic Solutions LLC

Website

https://advpes.com

Company type

Private

Founded year

2024

Operating status

Operating

Headcount range

1–10 employees

Short description

Advanced Printed Electronic Solutions (APES) is a Fishkill, NY-based provider of additive manufacturing electronics systems, combining mechanical, electrical, and process engineering with 3D printed electronics for semiconductor, medical device, and advanced materials customers.

Ownership category

akta.pro rank

Product category

Additive Manufacturing Electronics Systems

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Industrial Machinery Manufacturing (33324)

SIC

Special Industry Machinery (No Metalworking Machinery) (3550), Electronic Components & Accessories (3670)

akta.pro primary industry

Hybrid Additive-Subtractive Machine Tools (AM + CNC Systems) (IMAAAAAJ)

akta.pro secondary industries

Electronics & Electrical (Connectors, Housings, Tooling/Fixtures as End-Use) (Production AM Parts) (IMAAAEAF), Wafer Handling, Automation & Robotics (AMHS) (HDAHAEAI)

Keywords

• Additive manufacturing electronics
• 3D printed electronics
• Semiconductor packaging
• Printed electronics prototyping
• Multi-axis additive manufacturing

Headquarters

HQ city

Fishkill

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Operations, Supply Chain, Infrastructure, Marketing or Sales

Revenue model

1. Engineering Services: Project-based hardware/software design, R&D, materials/process development, and manufacturing engineering tailored to each customer for complete end-to-end mechatronic or structural electronic implementations. Includes embedded systems development, electronic/software design, simulation and mechanical design services.
2. Rapid Prototyping and Pilot Manufacturing: Fabrication of AME prototypes tailored to customer specifications. Ideal for highly customized, low-volume, or complex electronics with iterative development support.
3. Production Manufacturing: In-house or collaborative production solutions supporting scalable AME deployment for customer manufacturing requirements. Includes batch lot volumes and ongoing production.
4. Platform Solutions (MATRIX6D): Factory scale AM manufacturing solutions using modular Matrix6D platform and cloud-based orchestration software. Systems designed and configured around specific customer production needs, scalable as processes grow.
5. Software Platforms: Proprietary and partner-driven digital ecosystems including CAD design, multi-tool cloud integration/post-processing, and platform middleware for unified planning and precision control of AME hardware platforms.
6. Platform Engineering Configuration: Engineering services for configuring and designing AME manufacturing systems based on customer production requirements, including transfer of capability to customized in-house manufacturing solutions.

Pricing tiers

Go-to-market motion1 record

Distribution channels4 records

Marketing channels5 records

Core offering

APES is a product solutions and services company specializing in Additive Manufacturing Electronics (AME). It provides full-stack AME systems design combining mechanical, electrical, process engineering and 3D printed electronics to transform product concepts into manufactured solutions. Offerings include the Matrix6D™ modular production platform, HELIOS and HYPERION R&D prototyping platforms (via Kronos Mechatronics), AION-5X CAD/CAM software, and engineering services covering design, simulation, rapid prototyping, and scalable production manufacturing.

Product overview

APES offers a portfolio of products and services for Additive Manufacturing Electronics (AME). The core offerings include: (1) Matrix6D™ - a modular, software-defined production platform for factory-scale AM manufacturing with configurable tool stations; (2) HELIOS and HYPERION - R&D platforms for prototyping and low-volume fabrication; (3) AION-5X - CAD/CAM software for multi-axis additive manufacturing; and (4) Engineering Services covering design, process development, testing, and manufacturing. The Matrix6D platform serves as the flagship production system, while the R&D platforms (HELIOS, HYPERION) and AION-5X software enable seamless transition from lab-scale research to high-volume industrial production. Services include rapid prototyping, pilot manufacturing, and full-scale production manufacturing.

Differentiator

Problem solved

Functional benefit

Brands

• Matrix6D™: Next-generation, software-defined additive manufacturing platform designed for scalable, high-throughput production with modular architecture combining mobile build platforms with configurable tool stations.
• HELIOS
• HYPERION
• AION-5X

Products and services

• Matrix6D™ A next-generation, software-defined additive manufacturing platform designed for scalable, high-throughput production. Features a modular architecture combining mobile build platforms with a configurable array of tool stations capable of performing additive and non-additive processes including inkjet deposition, pick-and-place robotics, curing, inspection, and volumetric additive manufacturing (VAM). Orchestrated by proprietary intelligent software enabling fully automated, multi-step workflows with dynamic task allocation and parallelization.
• HELIOS An economic rapid prototyping system by Kronos Mechatronics combining piezo-actuated printing technology with 5-axis motion control for complex 3D printing. Supports conductive nano-particle inks, micron-scale inks, adhesive/dielectrics, and biological reagents deposited onto complex shaped non-planar substrates. Suited for R&D, prototyping, and product development operations.
• HYPERION An economical large area rapid prototyping system for 3D printed electronics by Kronos Mechatronics combining diverse printing technology with 5-axis motion control enabling complex 3D printing. Modular configuration with a standardized high-performance control system offering a clear path to high-volume manufacturing.
• AION-5X A high-performance CAD/CAM software platform developed by Kronos Mechatronics designed for multi-axis additive manufacturing and complex mechatronic systems. Features native path-planning algorithm with automatic tool orientation, supporting FFF, jetting, curing, and SMD pick-and-place processes within a single unified digital workflow. Provides a consistent software layer across Kronos R&D platforms and the Matrix6D system for seamless transition from lab-scale research to high-volume industrial production.
• Engineering Services End-to-end additive manufactured electronics product development including project-based hardware/software design, R&D, materials/process development, and manufacturing engineering. Covers embedded systems development, electronic/software design, simulation and mechanical design using SolidWorks, Autodesk Fusion, Altium, Sonnet EM, Ansys, and COMSOL for mechanical/electrical design, topology optimization, heat-transfer, and RF/EM simulation. Delivered as a single accountable partner across the 4-phase concept-to-manufacturing methodology.
• Rapid Prototyping and Pilot Manufacturing Fabrication of additive manufacturing electronics (AME) prototypes tailored to customer specifications, supporting iterative development and testing phases. Ideal for highly customized, low-volume, or complex electronics with iterative development support. Performed at APES' Fishkill, NY facility.
• Production Manufacturing In-house or collaborative production solutions supporting scalable AME deployment for customer manufacturing requirements. Includes batch lot volumes and ongoing production from small-batch specialized production to scaled manufacturing solutions. Delivered via APES' Fishkill, NY facility and via strategic collaborations such as the Great Lakes Semiconductor partnership.

Quantifiable outcome

• Fab-as-a-Service (FaaS) production model enabling semiconductor packaging outside traditional cleanroom environments
• +1 more outcomes

Named customers1 record

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

One partnership is on record.

• Great Lakes SemiconductorcoreStrategic or Co-development Partner · 24 February 2026Strategic partnership for advanced semiconductor packaging and heterogeneous integration. Enables design-to-manufacturing services for rapid, low-through-high volume, and mass customization of GLS-fabricated semiconductor and sensor devices. Partnership includes establishment of joint research and development center beginning at APES lab in Fishkill, NY, with plans to transition to GLS facilities for joint manufacturing operations.

Scale indicators1 record

Recent moves6 records

Expansion highlights5 records

Direct peers

• nScrypt: nScrypt manufactures direct-digital manufacturing equipment that combines 3D printing, pick-and-place, and dispensing for printed electronics and electronics packaging — closely aligned with APES's Matrix6D multi-process approach.
• Optomec: Optomec provides aerosol-jet printing systems used for 3D printed electronics, conformal sensors, and semiconductor packaging — directly competing with APES in functional electronics deposition onto non-planar substrates.
• Nano Dimension: Nano Dimension is a direct competitor offering additive manufacturing systems for printed electronics, including the DragonFly platform for 3D-printed PCBs and AME workflows targeting similar semiconductor, aerospace, and defense customers as APES.

Broad incumbents

• 3D Systems: 3D Systems offers a wide portfolio of additive manufacturing hardware and services across plastics, metals, and electronics; broad incumbent comparable to APES in scale ambitions and enterprise sales motion.
• Stratasys: Stratasys is a large incumbent in industrial 3D printing with a broad polymer and electronics-adjacent portfolio; competes broadly with APES in factory-scale additive manufacturing though without APES's AME specialization.
• EOS GmbH: EOS is an established industrial additive manufacturing systems vendor for metal and polymer production parts; a broader incumbent whose industrial printing platforms compete for the same enterprise manufacturing budget APES targets.

Emerging players

• Notion Systems: Notion Systems supplies inkjet-based functional material printing systems for printed electronics, PCB soldermask, and semiconductor applications — an emerging specialist overlapping with APES's deposition workflows.
• Voltera: Voltera offers printed-circuit prototyping platforms (V-One, NOVA) for rapid PCB and electronics prototyping; smaller scale than APES but overlaps in rapid prototyping and printed electronics use cases.
• PV Nano Cell: PV Nano Cell provides conductive inks and digital printing solutions for printed electronics and solar/semiconductor applications; emerging player offering complementary materials in a similar AME ecosystem.

Others

• Kronos Mechatronics: Kronos Mechatronics is APES's R&D platform partner (HELIOS, HYPERION, AION-5X); not a direct competitor but a closely adjacent equipment and software peer in the AME R&D tooling ecosystem.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/advanced-printed-electronic-solutions

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Advanced Printed Electronic Solutions (APES)