Great Lakes Semiconductor

What Great Lakes Semiconductor does

Great Lakes Semiconductor (GLS) is a privately held US semiconductor company developing modular fabrication facilities and a technology park ecosystem designed to onshore chip manufacturing capacity for North American customers. The company is building the ChipForge platform, a modular fabrication system targeting essential node devices in the 18nm to 28nm range with up to 100,000 sq. ft. of Class 1000 cleanroom space, under-12-day production times, and a SkyForge process-isolation architecture using SMIF/FOUP pods rather than building-wide cleanrooms. GLS complements ChipForge with FINPAT, an integrated packaging and test offering, and an APES-powered Matrix6D additive manufacturing capability for chiplet-based packaging and heterogeneous integration targeting automotive and defense end markets. GLS also develops ferroelectric RAM and IoT sensors for automotive applications as downstream proprietary products.

GLS monetizes through a Fab-as-a-Service (FaaS) subscription model that sells on-demand wafer production capacity and backend services to startups, OEMs, and governments, reducing customer capital expenditure risk while smoothing GLS's revenue against industry cyclicality. The Zero Miles collaborative supply chain co-locates design, fabrication, packaging, and testing in a single domestic facility, with lights-out manufacturing via autonomous mobile robots and module-level environmental controls supporting lower operating expenses. Pricing is quote-based and not publicly disclosed; revenue figures are not disclosed in available sources. Initial capital investment is projected to exceed US$250 million with phased expansion ultimately surpassing US$2.5 billion, supported by foreign direct investment from more than six countries.

The company is founder-led by former TSMC executive Dr. Richard L. Thurston (Co-founder, Chairman & CEO) and Jim Bark (Co-founder & CFO), with strategic technology and capital partnerships with Japan's Neitas and Daikin, US-based APES, and AltaScient. Operations are based at a Fishkill, New York headquarters and R&D office, with a new Dallas, Texas R&D and staging site established in February 2026. Headcount currently sits between 11-50 with planned scaling to over 2,000 within three years and more than 10,000 over the next decade, reflecting the pre-revenue, pre-operational nature of the business as Phase 1a fab construction commences.

Name

Great Lakes Semiconductor

Legal name

Great Lakes Semiconductor

Website

https://greatlakessemiconductor.com

Company type

Private

Operating status

Operating

Headcount range

11–50 employees

Short description

Great Lakes Semiconductor is a privately held US fab company developing modular ChipForge semiconductor fabrication facilities and offering on-demand wafer production, packaging, and testing services to automotive, defense, OEM, startup, and government customers via a Fab-as-a-Service model.

Ownership category

akta.pro rank

Product category

Semiconductor Fabrication Services

NAICS

Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441), Semiconductor Machinery Manufacturing (333242)

SIC

Semiconductors & Related Devices (3674), Special Industry Machinery (No Metalworking Machinery) (3550)

akta.pro primary industry

R&D / Prototyping & MPW Shuttle Foundries (HDAHACAI)

akta.pro secondary industries

Foundry Platform & Design Enablement Services (PDK/DFM/Process Qualification) (HDAHACAJ), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Semiconductor fabrication
• Wafer production services
• Advanced chip packaging
• Fab-as-a-service
• Ferroelectric memory devices

Headquarters

HQ city

Fishkill

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Infrastructure, Technology or R&D, Personnel, Operations, Supply Chain, Marketing or Sales

Revenue model

1. Fab-as-a-Service (FaaS) Wafer Production: On-demand subscription model providing wafer production capacity to startups, OEMs, and governments. Reduces customer capital expenditure risk, encourages ecosystem innovation, and ensures consistent revenue for GLS while mitigating industry cyclicality.
2. Advanced Packaging Services: Backend packaging and integration services including additive manufacturing through APES partnership, supporting chiplet-based manufacturing, System-in-Package (SiP), and heterogeneous integration.
3. FINPAT Integrated Services: End-to-end wafer fab, packaging, test and reliability lab services integrated into a seamless delivery model enabling rapid product iteration.
4. Prototype and Small-Lot Production: Pocket Fab services for essential node (18nm to 28nm) prototype and small-lot production with production time under 12 days including same-facility packaging.
5. Chiplet-Based Semiconductor Manufacturing: Targeted manufacturing services for automotive and defense sectors combining on-demand wafer production with APES's design and packaging capabilities.

Go-to-market motion2 records

Distribution channels1 record

Marketing channels2 records

Core offering

Great Lakes Semiconductor (GLS) develops and operates ChipForge, a modular semiconductor fabrication platform that provides prototype and small-lot wafer production for essential node (118nm to 28nm) devices in a Class 1000 cleanroom with production times under 12 days. Through its Fab-as-a-Service (FaaS) model, GLS delivers on-demand wafer production capacity, advanced 3D packaging (FINPAT), and backend test services directly to startups, OEMs, and government customers, eliminating the capital expenditure burden of owning a fab. The company also develops ferroelectric RAM (FeRAM) memory and IoT sensors for automotive applications, supported by an AI-driven supply chain and risk intelligence platform built with partner AltaScient.

Product overview

Great Lakes Semiconductor (GLS) operates a platform-plus-services model centered on ChipForge™, a modular semiconductor fabrication platform for rapid prototyping and small-batch production of essential node devices. The core offerings are supplemented by Fab-as-a-Service™ (FaaS™) for on-demand wafer production and FINPAT™ for integrated packaging and testing. GLS also develops ferroelectric RAM (FeRAM) products and IoT sensors for automotive applications, leveraging APES's Matrix6D platform for advanced chip packaging and additive manufacturing capabilities. The company is supported by AI-powered demand forecasting and supply chain tools developed in partnership with AltaScient LLC.

Differentiator

Problem solved

Functional benefit

Brands

• ChipForge™: Modular semiconductor platform featuring Phase 1a Pocket Fab for essential node (18nm to 28nm) devices with up to 100,000 sq. ft. Class 1000 cleanroom space.
• Fab-as-a-Service™ (FaaS™)
• FINPAT™
• SkyForge™

Products and services

• ChipForge A modular semiconductor fabrication platform featuring Pocket Fab capabilities with up to 100,000 sq. ft. Class 1000 cleanroom space, 2-inch wafer size (expandable to 4-inch and 6-inch), production time under 12 days, and no photomask required. Supports CMOS, NMOS, and image sensor production for essential node devices (118nm to 28nm) and is targeted at startups, OEMs, and government customers needing rapid prototyping and small-batch production.
• Fab-as-a-Service (FaaS) An on-demand subscription service providing wafer production capacity and backend services to startups, OEMs, and governments. Reduces customer capital expenditure risk, supports ecosystem innovation, and provides GLS with consistent recurring revenue while mitigating semiconductor industry cyclicality.
• FINPAT (Fab-Integrated Packaging and Test) An end-to-end service integrating wafer fabrication, advanced packaging (including additive manufacturing), and test and reliability labs into a seamless delivery model. Supports chiplet-based manufacturing, System-in-Package (SiP), and heterogeneous integration through the APES Matrix6D partnership, enabling rapid product iteration for customers.
• FeRAM (Ferroelectric RAM) Low-power, high-speed, durable memory solutions built on cutting-edge ferroelectric materials. Targeted at automotive control systems and IoT-enabled devices, with future potential for flexible circuit design. Designed for power efficiency and durability in demanding automotive and connected device environments.
• IoT Sensors Automotive-grade sensors utilizing proprietary low-power radio technology for monitoring tire pressure, vibration, brake wear, tread depth, internal air quality, and temperature. Designed for vehicle IoT and battery-free device applications in partnership with APES for flexible hybrid electronics.
• SkyForge A proprietary modular fabrication system that processes wafers separately to ensure customer isolation across processes, contamination, and IP. Uses SMIF/FOUP pod contamination control to lower reliance on stringent Class 1-2 air quality standards, preventing learning delays common in high-volume fabs and reducing infrastructure cost.

Segments5 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration1 record

AI capability2 records

Feature8 records

Partnerships

Four partnerships are on record, tiered core and key.

• Advanced Printed Electronic Solutions (APES)coreTechnology or Integration · 4 March 2026Strategic partnership to develop advanced semiconductor packaging and heterogeneous integration capabilities, combining GLS's ChipForge modular semiconductor platform with APES's Matrix6D AI-driven additive manufacturing platform. The collaboration launches at APES's Fishkill, NY laboratory before transitioning to GLS facilities by Q3 2026, with the goal of co-locating chip fabrication and back-end package integration within a single domestic manufacturing footprint. APES Matrix6D supports single die, multi-chiplets, System-in-Package (SiP), and heterogeneous integration.
• NeitascoreStrategic or Co-development PartnerJapanese strategic partner collaborating with GLS on semiconductor fabrication facilities and technology park ecosystem development as part of the ChipForge initiative.
• DaikincoreStrategic or Co-development PartnerJapanese strategic partner providing equipment design, procurement, operations and maintenance expertise for ChipForge facilities through executive vice president Yasunori Deguchi.
• AltaScient LLCkeyStrategic or Co-development PartnerAtlanta-based partner providing accurate and dynamic risk assessments and demand forecasting vital for key component sourcing, investment decisions, technology development, capital expense decisions, workforce planning, and inventory management. GLS plans to leverage advanced computational AI and Large Language Models (LLM) for predicting demand fluctuations, improving supply chain transparency, digital twins and building resiliency against risks.

Scale indicators6 records

Recent moves8 records

Expansion highlights7 records

Broad incumbents

• Amkor Technology: One of the world's largest OSATs, leading provider of advanced packaging including 2.5D/3D, fan-out, and chiplet integration. Directly comparable to GLS's FINPAT and APES Matrix6D advanced packaging ambitions.
• ASE Technology Holding: Global OSAT leader offering SiP, fan-out, 2.5D/3D-IC, and chiplet packaging. Comparable to GLS's FINPAT offering and APES partnership in advanced heterogeneous integration services.
• Vanguard International Semiconductor: Taiwan-based specialty foundry focused on mature-node analog, power, and mixed-signal CMOS. Closely comparable to GLS in process mix and customer profile, though it operates at far greater scale and from Taiwan.
• Tower Semiconductor (Intel Foundry): Specialty foundry (now under Intel) focused on RF, analog, MEMS, and power processes at mature and mid-nodes. Comparable in mixed-signal/sensor specialty positioning; much larger scale and broader process portfolio.
• GlobalFoundries: One of the world's largest dedicated foundries with major US fab capacity (Malta, NY — geographically adjacent to GLS's Fishkill HQ) and a roadmap centered on 12nm–22nm and RF/FDX platforms serving automotive and defense. Competes for the same essential-node and automotive customer wallet.

Direct peers

• SkyWater Technology: US-based pure-play specialty foundry offering mature and emerging-node wafer services (including 90nm and 130nm platforms) to defense, automotive, and medical customers. Closest analog to GLS in terms of domestic, mid-node, mixed-customer foundry positioning.
• Polar Semiconductor: US-based analog/mixed-signal and power semiconductor foundry serving automotive and industrial OEMs. Comparable in focus on mature-node, automotive-grade, domestically manufactured chips.
• X-FAB Silicon Foundries: Specialty foundry focused on analog/mixed-signal, MEMS, and sensor processes at mature nodes (down to 130nm). Comparable to GLS in targeting sensor-rich, low-to-mid-node applications including automotive and industrial IoT.

Emerging players

• MOSIS (USC ISI): Long-standing multi-project wafer (MPW) shuttle and prototyping service for academic and small-volume commercial users. Directly comparable to GLS's ChipForge prototype/no-photomask offering in addressing low-volume, fast-turnaround fab demand.
• QuickLogic (eFabless): Acquired Efabless, an open-source silicon platform enabling startups to prototype and produce small batches of chips via partner foundries. Comparable to GLS's Fab-as-a-Service model targeting startups and low-volume designers.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles16 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Great Lakes Semiconductor