What Nan Ya Printed Circuit Board does

Nan Ya Printed Circuit Board Corporation (TWSE: 8046) is a Taiwan-based, publicly listed manufacturer of high-density interconnect printed circuit boards (PCBs) and advanced IC substrates, founded in 1985 as the PCB division of Nan Ya Plastics within Formosa Plastics Group and formally incorporated in 1997. It operates three manufacturing campuses — Jinshing (Taoyuan, Taiwan), Shulin (New Taipei, Taiwan), and Kunshan (Jiangsu, China) — and reports a Q1 2026 consolidated revenue of NT$11,177 million from a workforce of approximately 5,000–6,000. Its product portfolio spans Conventional PCBs, HDI boards, Rigid-Flex boards, ABF (Ajinomoto Build-up Film) substrates, PP (Prepreg) substrates, Flip Chip substrates, and Wire Bond substrates, with technology roadmaps targeting >24-layer ABF, 5/5 µm line/space PP, and 40-layer HLC boards by 2027.

The company's primary customers are tier-1 semiconductor, OSAT, and electronics manufacturers — including AMD (designated Strategic Partner 2023 and named ecosystem partner in AMD's $10B Taiwan AI infrastructure initiative), ASE Group (Best Supplier of Substrate 2013–2022), Hon Hai/Foxconn, Luxshare Precision, STMicroelectronics, Microchip, and Inphi. Its competitive position rests on advanced fine-line and microvia manufacturing, an IBM Joint Development Agreement for next-generation packaging, and the financial backing of its 66.97% parent Nan Ya Plastics. End-markets are horizontally segmented across AI/data center/HPC, networking/5G, semiconductor packaging (IC substrates), consumer electronics, and automotive electronics, with substrate sales for AI accelerators and HPC chips positioned as the primary growth driver.

Nan Ya PCB monetizes its products through B2B negotiated, project-specific hardware sales contracts denominated per board and substrate, with revenue tied to layer count, material specifications, and production volume. Go-to-market is direct enterprise sales supplemented by analyst days, investor conferences, and ESG/sustainability reporting; marketing is relationship-driven rather than consumer-facing. The company has accumulated over 214 valid patents and a comprehensive certification stack (ISO 9001/14001/27001/45001, IATF 16949, UL2799 Platinum, CDP A-/A) that supports tier-1 OEM qualification and ESG-screened supply chains.

Name

Nan Ya Printed Circuit Board

Legal name

Nan Ya PCB Co., Ltd.

Website

https://nanyapcb.com.tw

Company type

Public

Founded year

1997

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Nan Ya Printed Circuit Board (TWSE: 8046) is a Taiwan-based manufacturer of high-density interconnect PCBs and advanced IC substrates (ABF, PP, flip-chip), serving tier-1 semiconductor, OSAT, and AI infrastructure customers including AMD, ASE, and Foxconn from campuses in Taiwan and China.

Ownership category

akta.pro rank

Product category

IC Substrates and Printed Circuit Boards

NAICS

Bare Printed Circuit Board Manufacturing (334412), Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

SIC

Printed Circuit Boards (3672)

akta.pro primary industry

Printed Electronics & Advanced Substrates (HDI, IC Substrates, Embedded Components) (HDAHAOAK)

akta.pro secondary industries

PCB Fabrication (Rigid PCBs) (HDAHAOAG), PCB Fabrication (Flex & Rigid-Flex PCBs) (HDAHAOAH)

Keywords

• Printed circuit boards
• IC substrate manufacturing
• Advanced packaging substrates
• High-density interconnect
• Semiconductor packaging materials

Headquarters

HQ city

Taoyüan

HQ country

Taiwan

HQ region

Asia

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Personnel, Technology or R&D, Infrastructure

Revenue model

1. PCB and IC Substrate Manufacturing and Sales: Nan Ya PCB manufactures and sells conventional PCBs, HDI boards, rigid-flex boards, ABF substrates, and PP substrates. Revenue is generated through direct product sales to electronics manufacturers in AI, networking, automotive, and consumer electronics sectors. The company operates on a project/contract basis with major semiconductor and electronics companies, with pricing influenced by material specs, layer count, and production volume.
2. Consolidated Sales Revenue: Consolidated revenue reported at NT$11,177 million for Q1 2026 (Jan-Mar 2026). Monthly sales data available from 2007 onwards. The company has shown revenue recovery from 2023 lows with strong AI-driven demand driving 2024-2025 growth. Taiwan Stock Exchange listed company (ticker 8046).

Go-to-market motion3 records

Distribution channels3 records

Marketing channels5 records

Core offering

Nan Ya PCB manufactures and sells conventional printed circuit boards, high-density interconnect (HDI) PCBs, rigid-flex PCBs, and IC substrates (ABF, PP, flip chip, and wire bond substrates) for AI/HPC, 5G networking, automotive, and consumer electronics applications. The company positions itself between semiconductor producers and device manufacturers as a critical supplier of advanced packaging materials, with manufacturing facilities in Taiwan and China and Formosa Plastics Group backing.

Product overview

Nan Ya Printed Circuit Board Corporation is a leading Taiwan-based manufacturer of printed circuit boards (PCBs) and IC substrates, producing a comprehensive portfolio including Conventional PCB, HDI (High Density Interconnection), and Rigid-Flex boards for computing and communications sectors, as well as ABF (Ajinomoto Build-up Film) Substrates, PP (Prepreg) Substrates, Flip Chip Substrates, and Wire Bond Substrates for semiconductor packaging. The company positions itself between semiconductor producers and device manufacturers, serving AI, automotive, consumer electronics, and 5G infrastructure end-markets.

Differentiator

Problem solved

Functional benefit

Products and services

• Conventional PCB Traditional multilayer printed circuit boards serving desktop and notebook motherboards and home electrical appliances.
• HDI (High Density Interconnection) PCB High-density interconnect PCBs with fine-line routing, laser-drilled microvias, and controlled-impedance stackups for space-constrained, high-frequency applications serving smartphones, game consoles, GPS, PDA, automotive, and MP3 players.
• Rigid-Flex PCB Rigid-flex printed circuit boards combining rigid and flexible substrates for high-end portable devices and notebooks, enabling 3D assembly and dynamic bending capabilities.
• Flip Chip Substrate IC substrates for flip-chip packaging using solder bumps to connect chips directly to substrates, providing high signal density and improved chip performance for microprocessors, graphics chips, and high-end ASICs.
• Wire Bond Substrate IC substrates using gold wire connections between IC chips and carrier substrates, supporting BGA, CSP, and window BGA packaging for memory, communication, and networking applications.
• ABF Substrate Ajinomoto Build-up Film substrates for advanced IC packaging, addressing critical bottlenecks in advanced packaging for 5G, AI, and high-speed computing workloads with fine-line design and high thermal reliability.
• PP Substrate Prepreg substrates for IC packaging applications, complementing ABF substrates in the company's IC substrate portfolio, with roadmap targeting 5/5 µm line width/space and 90 µm min bump pitch.

Quantifiable outcome

• ABF substrate market projected to grow at 16.1% CAGR 2025-2030, with AI-related applications accounting for about 75% of end market by 2030 vs. ~10% in 2015 (Morgan Stanley)
• +3 more outcomes

Named customers12 records

Segments5 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

Seven partnerships are on record, tiered core, strategic and major.

• AMDcoreStrategic or Co-development Partner · 21 May 2026Nan Ya PCB is named as a key ecosystem partner in AMD's $10 billion+ Taiwan AI infrastructure investment initiative. The company supplies ABF substrate technology for AMD's Helios rack-scale AI platform (featuring Instinct MI450X GPUs and 6th Gen AMD EPYC Venice CPUs) and advanced packaging of Venice CPUs. AMD's investment through 2029 supports capacity expansion for next-generation AI infrastructure, with Nan Ya positioned as a strategic substrate supplier in this initiative.
• ASE Technology HoldingcoreTechnology or Integration · 21 May 2026ASE Group is a key assembly and test partner in AMD's Taiwan ecosystem initiative. Nan Ya PCB supplies substrates to ASE for advanced packaging of AMD processors. ASE has repeatedly recognized Nan Ya PCB as Best Supplier of Substrate (2013-2022, 2014, 2018-2022).
• Siliconware Precision Industries (SPIL)coreTechnology or Integration · 21 May 2026SPIL is a key OSAT partner in AMD's Taiwan ecosystem investment, collaborating on EFB-based 2.5D interconnect technology. Nan Ya PCB supplies substrates through this ecosystem for advanced packaging of AMD Venice CPUs.
• Powertech Technology (PTI)coreTechnology or Integration · 21 May 2026PTI is collaborating with AMD on the industry's first 2.5D panel-based EFB interconnect technology qualification. Nan Ya PCB supplies substrates as part of the ecosystem for this advanced packaging solution targeting AMD's Venice CPU platform.
• IBMstrategicStrategic or Co-development Partner · 1 January 2016Nan Ya PCB signed a Joint Development Agreement with IBM in 2016 for advanced packaging technology development. The agreement was renewed in 2018 with additional collaboration projects. IBM acknowledged Nan Ya PCB's contribution in research papers presented at the Electronics Components and Technology Conference (ECTC) in 2018 and 2019.
• Hon Hai (Foxconn) GroupmajorChannel Partner/ Reseller/ DistributorNan Ya PCB has been recognized as Hon Hai Group's Best Supplier, supplying PCBs and substrates for Hon Hai's manufacturing of servers, AI hardware, and consumer electronics products.
• ASE Group (日月光)majorChannel Partner/ Reseller/ DistributorASE Group is a major OSAT customer that has repeatedly awarded Nan Ya PCB as Best Supplier of Substrate from 2013 through 2022, recognizing consistent quality and delivery performance in substrate supply.

Scale indicators8 records

Recent moves10 records

Expansion highlights6 records

Direct peers

• Samsung Electro-Mechanics Co., Ltd. Korea-based manufacturer of advanced IC substrates (FCBGA, ABF) and MLCC, a global Tier-1 competitor in the same ABF substrate market as Nan Ya PCB, serving Samsung Electronics, Qualcomm, and other major chipmakers with significant capacity expansion underway.
• Ibiden Co., Ltd. Japanese IC substrate and PCB manufacturer that is a global leader in high-end ABF/FCBGA substrates, competing directly with Nan Ya PCB in advanced packaging substrates for CPUs, GPUs, and AI accelerators serving top global semiconductor customers.
• Compeq Electronics Co., Ltd. Major Taiwan HDI PCB manufacturer with strong positions in smartphone, networking, and server boards. Directly competes with Nan Ya PCB in HDI and high-layer-count PCB product lines serving similar end-customers.
• LG Innotek Co., Ltd. Korea-based IC substrate manufacturer with a growing ABF substrate business, competing directly with Nan Ya PCB for advanced packaging sockets in AI and high-performance computing applications.
• Tripod Technology Corporation: Taiwan-based PCB manufacturer specializing in multilayer and HDI boards for networking, server, and automotive applications. Competes directly with Nan Ya PCB's conventional and HDI product lines for similar Tier-1 customers.
• Unimicron Technology Corp. Taiwan-based PCB and IC substrate manufacturer that is the most direct competitor to Nan Ya PCB in ABF substrates for advanced packaging, serving similar AI and HPC customers. Both are top-tier Taiwan substrate suppliers with overlapping end-market exposure and comparable technology roadmaps.
• Shinko Electric Industries Co., Ltd. Japanese IC substrate manufacturer specializing in flip-chip BGA and ABF substrates, a key competitor in the high-end substrate market for AI, HPC, and server applications where Nan Ya PCB also competes.
• Zhen Ding Technology Holding Ltd. Leading Taiwan-based flexible PCB manufacturer and a major Apple supplier, competing with Nan Ya PCB in HDI and rigid-flex PCBs for consumer electronics, smartphone, and mobile device applications.
• Kinsus Interconnect Technology Corp. Taiwan-based IC substrate manufacturer directly competing in ABF and flip-chip BGA substrates for AI, networking, and consumer applications. Operates with similar product mix (substrates and PCBs) and serves overlapping Tier-1 customers in the semiconductor packaging supply chain.

Emerging players

• AT&S Austria Technologie & Systemtechnik AG: Austrian IC substrate and PCB manufacturer expanding into ABF substrates with new capacity in Malaysia and elsewhere, positioning as an emerging Western alternative to the Taiwan/Korea/Japan substrate incumbents including Nan Ya PCB for advanced AI packaging.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/nan-ya-printed-circuit-board-corporation

Compliance16 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles10 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Nan Ya Printed Circuit Board