What Kingsemi does

Kingsemi (沈阳芯源微电子设备股份有限公司, stock code SSE:688037) is a Chinese semiconductor equipment manufacturer founded in December 2002 by the Chinese Academy of Sciences Shenyang Institute of Automation and headquartered in Shenyang. The company designs, manufactures, and sells photolithography track equipment (coater & developer systems) and single-wafer wet processing equipment, addressing a category where Tokyo Electron commands roughly 90% global market share. Kingsemi is the only domestic Chinese supplier capable of front-end coater & developer equipment at 28nm and above process nodes, and it has shipped more than 2,000 cumulative units to roughly 100 customers across front-end fabs, advanced packaging houses, LED/compound semiconductor manufacturers, MEMS, and OLED lines. Flagship products include the KS-FT200/300 front-end coater & developer, KS-C300/S300 clustered and star-type track systems, KS-CM300/200 single-wafer chemical cleaner, KS-CF300/200-8SR scrubber, KS-S300-E wet etcher, KS-S300-ST stripper, KS-C300-2TB temporary bonder, KS-S300-1DBL laser debonder, and KS-S200-2H1L SiC dicing-and-breaking machine. Core proprietary technology spans centrifugal wafer rotation, hot plate baking, photoresist coating uniformity, ultrasonic atomization spray coating, dual-fluid nozzle particle removal, high-temperature SPM cleaning, and a proprietary dual-vacuum dual-grip four-hand wafer-transfer robot; the company holds 405+ granted patents and two hosted industry standards.

Kingsemi operates a direct enterprise sales model with field sales engineers, pre-sales technical consultation, and 24/7 after-sales service, selling capital equipment priced from roughly RMB 1.1 million for entry-level LED/compound semiconductor track units up to approximately US$5 million per front-end coater & developer system. Revenue is generated through hardware sales plus aftermarket services and spare parts, with project-based revenue recognition. The company manufactures out of three major factory complexes spanning approximately 140,000 square meters (Shenyang headquarters, Shenyang Caiyun Road facility completed 2022, and Shanghai Lingang facility in production since March 2024), and operates a wholly-owned Japanese subsidiary (Kingsemi Japan, established August 2022) with a Tokyo trading office and Kyoto R&D center. North Huachuang Group became controlling shareholder in 2025, embedding Kingsemi within a broader Chinese semiconductor equipment platform. The company listed on the Shanghai STAR Market on December 16, 2019, raising approximately RMB 566 million.

Name

Kingsemi

Legal name

沈阳芯源微电子设备股份有限公司

Website

https://kingsemi.com

Company type

Public

Founded year

2002

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

Kingsemi is a Chinese semiconductor equipment maker that designs and sells photolithography track (coater & developer) and single-wafer wet processing systems for foundries, IDMs, advanced packaging houses, and LED/compound semiconductor manufacturers, and is the only domestic Chinese supplier of front-end coater & developer equipment at 28nm and above.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Electronic & Other Electrical Equipment (No Computer Equip) (3600)

akta.pro primary industry

Wafer Cleaning & Surface Preparation Equipment (HDAHAEAG)

akta.pro secondary industry

Etch & Strip Equipment (Dry/Wet/Ashing) (HDAHAEAC)

Keywords

• Semiconductor manufacturing equipment
• Photolithography track systems
• Wafer cleaning equipment
• Advanced packaging equipment
• Wet process equipment

Headquarters

HQ city

Shenyang

HQ country

China

HQ region

Asia

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Infrastructure, Marketing or Sales

Revenue model

1. Semiconductor Equipment Sales: Kingsemi derives revenue primarily from selling semiconductor manufacturing equipment including coater & developer systems, single-wafer cleaning machines, spray coaters, wet etchers, strippers, and dicing equipment. Revenue is generated through direct sales to semiconductor manufacturers and packaging houses. Equipment is sold as complete systems with associated installation, commissioning, and after-sales service support. The company follows a project-based revenue recognition model.
2. Aftermarket Services & Spare Parts: Kingsemi provides after-sales technical support, spare parts, and maintenance services to installed equipment customers. This includes on-site service response (7x24 hours at some customer sites), equipment calibration, process optimization, and consumables supply.

Pricing tiers

Go-to-market motion2 records

Distribution channels3 records

Marketing channels4 records

Core offering

Kingsemi designs, manufactures, and sells semiconductor manufacturing equipment — specifically photolithography track systems (coaters and developers), single-wafer wet cleaning equipment, single-wafer etchers and strippers, bonding/debonding machines for advanced packaging, and SiC dicing equipment. Equipment is sold directly to semiconductor foundries, IDMs, advanced packaging houses, LED/compound semiconductor manufacturers, and MEMS/OLED producers globally.

Product overview

Kingsemi (沈阳芯源微电子设备股份有限公司) is a leading Chinese semiconductor equipment manufacturer specializing in front-end and advanced packaging process equipment. The company offers a comprehensive portfolio of wafer processing equipment including: (1) Track systems - coaters and developers (涂胶显影机) in various configurations including KS-FT200/300 for front-end 28nm+ processes, KS-C300 clustered type, KS-S300 star type, KS-S150 automatic, KS-M300 semi-automatic, and KS-S300-SP spray coater; (2) Cleaning equipment - KS-CM300/200 single-wafer chemical cleaners, KS-CF300/200-8SR scrubbers, and KS-S300-SR single-wafer cleaners; (3) Wet processing equipment - KS-S300-E single-wafer wet etcher and KS-S300-ST stripper; (4) Bonding equipment - KS-C300-2TB temporary bonding and KS-S300-1DBL laser debonding machines; (5) Dicing equipment - KS-S200-2H1L SiC dicing and breaking machine. Products serve semiconductor manufacturing, advanced packaging, MEMS, LED, OLED, 3D-IC TSV, and photovoltaic applications.

Differentiator

Problem solved

Functional benefit

Products and services

• KS-FT200/300 Front-end Coater & Developer (KS-FT200/300 前道8/12寸涂胶显影机) Stacked high-throughput front-end track coater and developer system for IC manufacturing at 28nm and above process nodes. Compatible with ArF, KrF, I-Line, PI, BARC, SOC, SOD, SOG materials. Designed for use with lithography machines and supports factory automation in front-end wafer fabs.
• KS-C300 300mm Clustered Coater & Developer (KS-C300 12寸 集束型涂胶显影机) Clustered coater and developer system for 300mm wafers targeting advanced packaging, MEMS, and OLED applications. Processes 180 wafers/hour, compatible with silicon, glass, bonded wafers, and compound materials. SEMI S2 certified for safety and environmental compliance.
• KS-S300 300mm Star-type Coater & Developer (KS-S300 12寸 星型涂胶显影机) Star-type coater and developer for 300mm wafers targeting advanced packaging, MEMS, and OLED processes. Processes 100 wafers/hour with ultra-thin wafer handling and thick photoresist coating capability. Features special coating unit design that avoids the 'marshmallow' phenomenon in high-viscosity photoresist centrifugal coating. SEMI S2 certified. Won Liaoning Province Excellent New Product Second Prize.
• KS-S150 150mm Automatic Coater & Developer (KS-S150 星型全自动涂胶显影机) Automatic star-type coater and developer for 150mm wafers targeting LED-PSS and compound semiconductor manufacturing. Compatible with sapphire, GaAs, and SiC substrates with throughput >190 wafers/hour. CSA certified. Low photoresist consumption of 0.6ml per 4-inch wafer and excellent flow field design for coating uniformity.
• KS-M300 Semi-automatic Equipment Platform (KS-M300 半自动机台) Semi-automatic equipment platform for single-wafer coating, developing, spraying, cleaning, etching, and stripping processes. Suitable for process verification and small batch production with manual wafer loading and unloading.
• KS-S300-SP 300mm Spray Coater (KS-S300-SP 12寸喷雾式涂胶机) 300mm spray coater using ultrasonic atomization for uniform photoresist coating of high aspect ratio microstructures. Effective for trench sidewall and edge coverage with static spray on chuck to avoid breakage risk for thin/fragile substrates. Suitable for advanced packaging and MEMS manufacturing. SEMI S2 certified.
• KS-CM300/200 Single-wafer Chemical Cleaner (KS-CM300/200 单片式化学清洗机) Single-wafer chemical cleaning machine for FEOL and BEOL processes including pre-deposition, post-thinfilm, post-etch, post-imp, post-CMP, PR-strip, and NiPt removal. Features high-temperature SPM cleaning technology with >80% process coverage, proprietary high-efficiency low-damage jet nozzle, dual-sided cleaning capability, and fully domestically developed mechanical arms. Configurable with 8/12/16 chambers.
• KS-CF300/200-8SR Full-automatic Scrubber Cleaner (KS-CF300/200-8SR 全自动SCRUBBER清洗机) Full-automatic scrubber cleaner for wafer front, back, and edge cleaning using dual-fluid nozzle technology. Removes particles while protecting wafer surface patterns through optimized cleaning parameters. Equipped with special brush materials and high-pressure spray for micron-level large particle removal and anti-static piping.
• KS-S300-SR Single-wafer Cleaner (KS-S300-SR 单片清洗机) Single-wafer cleaner for wafer-level packaging and OLED processes. Combines chemical, high-pressure water, megasonic, and two-fluid cleaning capabilities for particle, organic, and metal removal.
• KS-S300-E Single-wafer Wet Etcher (KS-S300-E 单片湿法刻蚀机) Single-wafer wet etcher for semiconductor manufacturing processes including SiO2, SiN, polysilicon and metal layer etching. Features controlled spray arm positioning and multi-chemical capability. Used in front-end and advanced packaging wet etching.
• KS-S300-ST Single-wafer Wet Stripper (KS-S300-ST 单片湿法去胶机) Single-wafer wet stripper for advanced packaging processes including photoresist removal and metal liftoff. Features tank soaking and single-wafer spin spray combination. Includes Kingsemi's proprietary dual-vacuum dual-grip four-hand high-speed robot with dry-wet separation and no cross-contamination.
• KS-C300-2TB Temporary Bonding Machine (KS-C300-2TB 临时键合机) Temporary bonding machine for 3D integration and 2.5D/3D packaging applications. Supports ultra-thin wafer handling with multi-viscosity coating chamber up to 20,000cp. Used for wafer thinning prior to stacking.
• KS-S300-1DBL Laser Debonding Machine (KS-S300-1DBL 激光解键合机) Laser debonding machine for 2.5D/3D packaging applications. Supports stress-free separation of thinned wafers from glass carrier plates with 12 wafers/hour throughput. Used after temporary bonding processes.
• KS-S200-2H1L Full-automatic SiC Dicing and Breaking Machine (KS-S200-2H1L 全自动SiC划片裂片一体机) Full-automatic SiC dicing and breaking machine for 8-inch steel rings, compatible with 200mm wafers (150mm compatible). Dry cutting at 100mm/s speed and 20WPH throughput. Used in compound semiconductor wafer processing.

Quantifiable outcome

• Hot plate unit cost reduced from US$20,000 (imported) to RMB 20,000 (domestic)
• +6 more outcomes

Named customers7 records

Segments4 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature9 records

Partnerships

Six partnerships are on record, tiered moderate, core and minor.

• Japanese semiconductor industry partners and suppliersmoderateTechnology or Integration · 16 May 2023Kingsemi Japan facilitates technology exchange and business collaboration with Japanese semiconductor companies, equipment suppliers, and component manufacturers. The Kyoto R&D center leverages Japanese technical expertise and talent. The Tokyo office serves as a supply chain hub for importing high-purity materials and precision components into China while also facilitating Kingsemi's product promotion in Japan. Over 50 Japanese partners attended the KSJ opening ceremony.
• Silan Microelectronics (士兰微)coreStrategic or Co-development Partner · 21 April 2023Kingsemi was awarded Silan Microelectronics' Best Supplier Award in April 2023 after scoring over 90 points in comprehensive evaluation. Nearly 40+ units of Kingsemi equipment have been deployed across Silan's 4-12 inch production lines. The partnership covers coating, developing, cleaning, stripping, etching, and UV curing processes. Silan is recognized as providing a critical platform for domestic equipment validation, enhancement, and volume application.
• Xiamen Silan Jike (厦门士兰集科)coreStrategic or Co-development Partner · 10 June 2022Kingsemi's 12-inch KrF coater & developer became Silan Jike's first domestic high-throughput KrF track equipment. Both companies signed a strategic cooperation agreement in June 2022. The partnership covers technology collaboration for advanced process development and volume supply across Silan's production lines.
• China Electronics Engineering No. 2 (中电二公司)minorImplementation/ SI/ Consulting Partner · 27 May 2022General contractor for Kingsemi's Caiyun Road factory construction project. Successfully completed the main structure topping-out ceremony in May 2021.
• Shenyang IC Equipment Alliance (沈阳IC装备联盟)moderateStrategic or Co-development PartnerKingsemi serves as the 'pioneer' of the Shenyang IC Equipment Alliance. The alliance brings together companies including Kingsemi, Tuojing Technology, Shenyang Fuchuang, and others to form industrial cluster effects. Kingsemi is recognized as one of the 'Four Little Dragons' of Shenyang's IC equipment manufacturing industry, with government support to grow into 'Four Great Dragons.'
• Chinese Academy of Sciences Shenyang Institute of Automation (中科院沈阳自动化研究所)coreTechnology or IntegrationFounding parent organization of Kingsemi. Established in 2002 as the initiating founder. Kingsemi is the first STAR Market listing from the Chinese Academy of Sciences system. The institute provided the founding technology basis and continues to support Kingsemi through research collaboration and talent development.

Scale indicators7 records

Recent moves11 records

Expansion highlights6 records

Others

• ASML: ASML is the global monopoly supplier of advanced photolithography systems. While ASML does not directly compete in coater & developer equipment, Kingsemi's Track systems must integrate with ASML lithography tools at advanced nodes, making ASML a critical ecosystem participant.

Direct peers

• SCREEN Holdings: SCREEN (formerly Dainippon Screen) is a leading supplier of single-wafer cleaning equipment for semiconductor manufacturing. SCREEN directly competes with Kingsemi's KS-CM300/200 chemical cleaner and KS-CF300/200-8SR scrubber product lines in wafer cleaning.
• Tokyo Electron (TEL): Tokyo Electron is the global leader in coater & developer (Track) equipment with ~90% market share, the direct incumbent Kingsemi is substituting in China. TEL competes head-to-head with Kingsemi in photoresist coating and developing systems across all process nodes.
• ACM Research (Shanghai): ACM Shanghai is a Chinese semiconductor equipment company specializing in single-wafer wet cleaning and advanced packaging equipment. ACM directly competes with Kingsemi's cleaning equipment franchise in the Chinese domestic market.

Regional players

• Tuojing Technology (拓荆科技): Tuojing Technology is another 'dragon' in the Shenyang IC Equipment Alliance alongside Kingsemi, focusing on complementary semiconductor equipment. Tuojing is a regional ecosystem peer benefiting from the same Shenyang IC equipment cluster.

Broad incumbents

• Lam Research: Lam Research is a global leader in semiconductor etch and deposition equipment. Lam competes indirectly with Kingsemi in single-wafer wet etch and strip equipment, and represents the global benchmark for advanced node etch process capability.
• Applied Materials: Applied Materials is the world's largest semiconductor equipment company, with broad portfolio across deposition, etch, CMP, and inspection. Applied Materials competes broadly with Kingsemi in cleaning and etch, particularly at advanced process nodes.
• NAURA Technology Group: NAURA (北方华创) is a leading Chinese semiconductor equipment company across etch, CVD, PVD, and thermal processing. As Kingsemi's controlling shareholder since 2025, NAURA is both a parent and a broad domestic peer with overlapping semiconductor equipment portfolios.

Emerging players

• Shenyang Fuchuang (沈阳富创): Shenyang Fuchuang is a regional Chinese semiconductor equipment components and subsystems supplier. As a fellow member of the Shenyang IC Equipment Alliance, Fuchuang is a regional peer and ecosystem partner to Kingsemi.
• Piotech: Piotech (拓荆科技) is a Chinese domestic semiconductor equipment company specializing in CVD and ALD deposition equipment. Piotech is a comparable Chinese semi equipment peer pursuing similar domestic substitution opportunities in the same customer base.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks7 records

Key highlights7 records

Customer concentration

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles12 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Kingsemi