MEMSensing
MEMSensing (688286.SH) designs and manufactures MEMS sensors — acoustic, pressure, inertial, force, flow, and infrared thermopile — with full domestic supply chain localization in China. It serves enterprise customers in consumer electronics, automotive, medical, and industrial control via direct B2B sales.
- Company typePublic
- Founded2007
- HeadquartersSuzhou, China
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
What MEMSensing does
MEMSensing (苏州敏芯微电子技术股份有限公司, stock code 688286.SH) is a Suzhou-headquartered MEMS (Micro-Electro-Mechanical Systems) technology platform enterprise that designs and manufactures a broad portfolio of MEMS sensors across six categories: acoustic sensors (silicon microphones and bone conduction sensors), pressure sensors, inertial sensors (accelerometers), force sensors, flow sensors, and infrared thermopile sensors. Founded in September 2007, the company operates across the full value chain — independent ASIC chip design, proprietary process technologies (US-patented SENSA process, SOI process), wafer fabrication, packaging, and testing — through four wholly-owned subsidiaries: LinkSensing (pressure modules), DSBEL (packaging and testing at ~1.5 billion units annual capacity), Mlinksemi (gyroscope/inertial ASICs), and SENLUTION (inertial modules and algorithms). The company has achieved complete domestic MEMS supply chain localization in China.
The company serves B2B enterprise customers via direct sales across consumer electronics, automotive, medical, and industrial control verticals. Named customers include Samsung, Xiaomi, OPPO, Huawei, Vivo, Lenovo, Asus, Haier, Transsion, Realme, Skullcandy, JBL, EDIFIER, Yuyue Medical, Liven Medical, and Rokid. MEMSensing ranks 4th globally in MEMS microphone shipments and 3rd globally in MEMS acoustic sensor chip shipments, with cumulative shipments exceeding 50 billion units and monthly production capacity of 100 million sensors. Acoustic sensors represented 47.61% of 2024 revenue.
The business model is hardware-centric: MEMS sensor sales on a quote-based B2B enterprise basis with multi-year contracts, supplemented by MEMS packaging and testing services from the DSBEL subsidiary. The company is publicly listed on the Shanghai Stock Exchange STAR Market since August 2020, recognized as the first MEMS chip stock in China. R&D spend exceeded 80 million RMB (16.01% of revenue) in 2024, supporting continued platform development. Notable awards include National Specialized and New 'Little Giant' enterprise status from MIIT, consecutive Top 10 Sensor Company rankings from AspenCore, and consecutive Top Ten Chinese MEMS Enterprises recognition from the China Semiconductor Industry Association.
MEMSensing firmographics
Firmographics- Name
- MEMSensing
- Legal name
- 苏州敏芯微电子技术股份有限公司 (Suzhou MEMSensing Microelectronics Technology Co., Ltd.)
- Website
- https://memsensing.com
- Company type
- Public
- Founded year
- 2007
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Short description
- MEMSensing (688286.SH) designs and manufactures MEMS sensors — acoustic, pressure, inertial, force, flow, and infrared thermopile — with full domestic supply chain localization in China. It serves enterprise customers in consumer electronics, automotive, medical, and industrial control via direct B2B sales.
- Ownership category
- akta.pro rank
MEMSensing industry classification
Industry- Product category
- MEMS Sensors (Semiconductor Sensors)
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (33441), Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (33451), Other Measuring and Controlling Device Manufacturing (334519), Electromedical and Electrotherapeutic Apparatus Manufacturing (334510)
- SIC
- Industrial Instruments For Measurement, Display, And Control (3823), Electromedical & Electrotherapeutic Apparatus (3845)
- akta.pro primary industry
- Sensors, MEMS & Imaging ICs (HDAHAAAG)
- akta.pro secondary industries
- Microphones & Acoustic MEMS (MEMS Mics/Ultrasonic Transducers) (HDAHALAH), Sensor Fusion, Interface ICs & Modules (AFE/Readout/Packaging/Calibration) (HDAHALAO), MEMS & Sensor Foundries (HDAHACAF), Industrial-Grade Sensors & Transducer Components (Discrete sensing elements, transducers, MEMS sensors) (IMAGAJAO)
Keywords
Where MEMSensing is headquartered
LocationHeadquarters
- HQ city
- Suzhou
- HQ country
- China
- HQ region
- Asia
Offices2 records
Markets served
MEMSensing business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Supply Chain, Operations, Personnel, Infrastructure, Marketing or Sales
Revenue model
- MEMS Sensor Products: The company generates revenue primarily through the sale of MEMS sensors including acoustic sensors (microphones), pressure sensors, inertial sensors, force sensors, flow sensors, and infrared thermopile sensors. Revenue breakdown shows acoustic sensors accounted for 47.61% of revenue in 2024.
- MEMS Packaging and Testing Services: Subsidiary DSBEL provides MEMS product packaging and testing services, including wire bonding, dispensing, die attach, and testing services for pressure products and other MEMS components.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | B2B enterprise hardware sales with customized solutions |
Go-to-market motion2 records
Distribution channels1 record
Marketing channels4 records
MEMSensing product offering
Product offeringCore offering
MEMSensing designs, develops, fabricates, packages, and tests a full range of MEMS (Micro-Electro-Mechanical Systems) sensors including acoustic sensors (silicon microphones, bone conduction), pressure sensors (barometers, automotive, medical, e-cigarette), inertial sensors (accelerometers), force sensors, flow sensors, and infrared thermopile sensors. The company operates a fully localized supply chain from chip design to wafer fabrication to packaging and testing through four subsidiaries (LinkSensing, DSBEL, Mlinksemi, SENLUTION) and supplies major consumer electronics, automotive, medical, and industrial brands.
Product overview
MEMSensing (苏州敏芯微电子技术股份有限公司, stock code 688286.SH) is a MEMS technology platform enterprise offering a comprehensive portfolio of MEMS sensors. The product portfolio spans six main categories: MEMS Acoustic Sensors (silicon microphones, bone conduction sensors), MEMS Pressure Sensors (barometers, automotive sensors, medical sensors, e-cigarette sensors), MEMS Inertial Sensors (three-axis accelerometers), MEMS Force Sensors, MEMS Flow Sensors (MSH01, MSL01), and Infrared Thermopile Sensors. The company operates four subsidiaries: LinkSensing (pressure sensor modules for automotive/industrial/medical), DSBEL (MEMS packaging and testing with ~1.5 billion units annual capacity), Mlinksemi (ASIC chip design for inertial sensors), and SENLUTION (inertial sensing modules and algorithms). MEMSensing has achieved full supply chain localization from chip design to wafer fabrication, packaging and testing. The company ranks 3rd globally in MEMS acoustic sensor chip shipments and 4th globally in MEMS microphone shipments.
Differentiator
Problem solved
Functional benefit
Brands
- LinkSensing (灵科传感): Focuses on sensor module production, specializing in pressure modules for automotive, industrial control, and medical fields
- DSBEL (德斯倍电子)
- Mlinksemi (敏易链半导体)
- SENLUTION (中宏微宇)
Products and services
- MEMS Acoustic Sensors (Silicon Microphones) Capacitive MEMS microphones with high reliability, stability, and consistency, featuring thin elastic diaphragm and rigid backplate forming parallel-plate capacitor to convert sound to electrical signals. Available in PDM, IIS, and Analog output types with SNR up to 70dB. Bone conduction sensors detect skull-propagated vibration for noise-suppressed call quality in TWS earphones.
- MEMS Pressure Sensors Portfolio of MEMS pressure sensors including barometers with LGA packaging and waterproof variants for wearables, LGA absolute/gauge pressure modules with ASIC signal conditioning and integrated DSP compensation, COB differential pressure modules with perfluorinated gel encapsulation for harsh exhaust environments, disposable blood pressure monitor sensors with factory calibration and medical-grade packaging, and single-chip differential pressure sensors for e-cigarette suction detection.
- MEMS Inertial Sensors (Three-Axis Accelerometers) Three-axis MEMS accelerometers with full-process design capability covering MEMS design, ASIC design, packaging and testing. Features multiple interrupt outputs and built-in 32-depth FIFO for low power consumption. Used for screen rotation, pedometer, sleep monitoring, and gesture/HCI applications in consumer electronics.
- MEMS Force Sensors Single-chip force sensors with four piezoresistive resistors forming a Wheatstone bridge, plus integrated force sensors combining a MEMS chip with signal processing ASIC for I2C digital output with interrupt functionality. Applications include earbud pressure sensing, weighing scales, and medical infusion pumps.
- MEMS Flow Sensors (MSH01 and MSL01) MEMS flow sensors based on thermal conduction principle with range ratio >300:1, response time <5ms, and ultra-low startup flow <0.05m/s. The MSH01 covers 0.01-35 m/s with metal film TiPt resistor; the MSL01 covers 0.01-10 m/s with Pt heater. Applications include medical respiration, fuel cells, automotive air flow meters, and industrial automation.
- Infrared Thermopile Sensors Thermopile sensors based on the Seebeck effect with multiple thermocouple pairs in series, integrating a 5-14 μm infrared bandpass filter and NTC thermistor in a TO-46 metal can package. Available as bare thermopile chips (MSTPT46 series with 1.1-1.8mm sizes) and as a TO-46 packaged module with environmental temperature compensation. Used in non-contact forehead/ear thermometers, smart home temperature control, and HVAC.
- LinkSensing Pressure Sensor Modules Subsidiary LinkSensing (灵科传感) produces sensor modules with a focus on pressure modules for automotive, industrial control, and medical applications. Operations are based in Kunshan Development Zone (Kunshan Lingke Sensing Technology Co., Ltd.).
- DSBEL MEMS Packaging and Testing Services Subsidiary DSBEL (德斯倍电子) provides MEMS product packaging and testing services including wire bonding, dispensing, die attach, and testing for pressure products and other MEMS components. Equipped with high-level cleanroom planning approximately 1.5 billion particles of annual capacity.
- Mlinksemi ASIC Chip Design Subsidiary Mlinksemi (敏易链半导体) provides MEMS sensor interface ASIC chip design with main products being six-axis inertial sensors. Key for domestic substitution in accelerometer and gyroscope ASIC chips, delivering combined hardware and software solutions.
- SENLUTION Inertial Sensing Modules and Algorithms Subsidiary SENLUTION (中宏微宇) focuses on inertial sensing modules and algorithm applications, delivering high-precision, highly integrated miniature attitude reference systems for automotive electronics, industrial control, and smart manufacturing, plus smart IoT solutions built around intelligent sensors.
Quantifiable outcome
- R&D expenses exceeded 80 million RMB in 2024, accounting for 16.01% of total revenue
- +3 more outcomes
Companies that use MEMSensing
Customer profileNamed customers20 records
Segments4 records
Ideal customer profiles4 records
MEMSensing technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature6 records
MEMSensing partnerships and signals
Strategic signalPartnerships
Six partnerships are on record, tiered core and minor.
- China Resources Microelectronics (CSMC)coreStrategic partnership for MEMS wafer manufacturing. In 2011, achieved mass production of first-generation 6-inch products at China Resources Microelectronics and submitted for customer validation. Partnership enabled transition from 4-inch to 8-inch wafer manufacturing.
- SMIC Chengdu (Chengxin)coreJoint development of 8-inch MEMS mass production processes with SMIC Chengdu, considered SMIC's earliest domestic MEMS customer. Partnership achieved transition from 4-inch to 8-inch wafer lines.
- National 02 Major ProjectcoreParticipated in the National 02 Major Project (Very Large Scale Integrated Circuit Manufacturing Equipment and Complete Processes) which facilitated establishment of China's first wafer fabrication plant with MEMS production capabilities.
- Suzhou Institute of Nano-Tech & Nano-BionicsminorEarly R&D partnership using the institute's 4-inch pilot line for product and process development in 2008 when the company was founded.
- MEMS Industry Intellectual Property AlliancecoreMEMSensing serves as chairman unit of the MEMS Industry Intellectual Property Alliance, leading the establishment of a MEMS patent pool collecting over 100 industry patents.
- Rokid GlassesminorMEMS microphones supplied for Rokid Glasses AI smart glasses product, demonstrating entry into AI wearable device market.
Scale indicators9 records
Recent moves11 records
Expansion highlights6 records
MEMSensing competitors and assessment
Company assessmentBroad incumbents
- STMicroelectronics: Global IDM with broad MEMS portfolio including microphones, pressure, inertial sensors and actuators. Competes with MEMSensing across consumer, automotive, and industrial sensor segments.
- Qorvo: RF and sensor semiconductor company with MEMS pressure and acoustic products. Competes with MEMSensing in select pressure/consumer sensor sockets and shares automotive customer relationships.
- Bosch Sensortec: Bosch's MEMS sensor subsidiary — global #1 in many MEMS categories. Competes with MEMSensing in pressure, inertial, and environmental sensors for automotive, consumer, and industrial.
- Infineon Technologies (with XENSIV line): Major MEMS player with XENSIV MEMS microphones and pressure sensors. Targets automotive and consumer electronics customers that overlap with MEMSensing's tier-1 OEM roster.
- TDK InvenSense: Global leader in MEMS inertial sensors (accelerometers, gyroscopes, IMUs). Directly competes with MEMSensing's Mlinksemi/SENLUTION inertial sensor roadmap in consumer and automotive.
Direct peers
- Hosiden: Japanese MEMS and electret condenser microphone supplier for smartphones and TWS earphones. Overlaps with MEMSensing in global MEMS microphone supply for consumer OEMs.
- Knowles Electronics: A global leader in MEMS microphones and acoustic sensors. Directly comparable to MEMSensing's largest product line (acoustic sensors) and competes for the same smartphone/TWS/hearable OEM sockets.
- AAC Technologies: China-based acoustic and haptic component supplier with strong smartphone/TWS customer overlap. Comparable in scale and customer base to MEMSensing's MEMS microphone business.
- GoerTek: Chinese acoustic and MEMS sensor manufacturer with strong TWS/consumer electronics exposure. Closest domestic rival to MEMSensing in MEMS microphones and module-level acoustic solutions.
Regional players
- Cirrus Logic: US-based mixed-signal and audio IC vendor with MEMS microphone partnerships. While not a direct MEMS supplier, it competes in adjacent signal chain and audio capture for the same OEM customer base.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks7 records
Key highlights7 records
Customer concentration
MEMSensing social profiles
Digital presenceMEMSensing financial estimates
Financial estimateRevenue estimate
Valuation estimate
MEMSensing leadership team
Management profileNumber of profiles
Profiles3 records
MEMSensing subsidiaries and ownership
Company hierarchySubsidiaries4 records
MEMSensing funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
MEMSensing M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about MEMSensing
What does MEMSensing do?
MEMSensing designs, develops, fabricates, packages, and tests a full range of MEMS (Micro-Electro-Mechanical Systems) sensors including acoustic sensors (silicon microphones, bone conduction), pressure sensors (barometers, automotive, medical, e-cigarette), inertial sensors (accelerometers), force sensors, flow sensors, and infrared thermopile sensors. The company operates a fully localized supply chain from chip design to wafer fabrication to packaging and testing through four subsidiaries (LinkSensing, DSBEL, Mlinksemi, SENLUTION) and supplies major consumer electronics, automotive, medical, and industrial brands.
Is MEMSensing a public or private company?
MEMSensing is a public company. It is classified as public and is currently operating.
When was MEMSensing founded?
MEMSensing was founded in 2007. It employs 11 to 50 people.
Where is MEMSensing based?
MEMSensing is headquartered in Suzhou, China, in the Asia region.
How does MEMSensing make money?
Two revenue lines are on record. MEMS Sensor Products are the primary driver. The others are MEMS Packaging and Testing Services.
Who are MEMSensing's main competitors?
Broad incumbents on record are STMicroelectronics, Qorvo, Bosch Sensortec, Infineon Technologies (with XENSIV line) and TDK InvenSense. Direct peers are Hosiden, Knowles Electronics, AAC Technologies and GoerTek. Cirrus Logic is listed as a regional player.
Does MEMSensing have an API?
No public API is recorded for MEMSensing.
What industry is MEMSensing in?
MEMSensing's product category is MEMS Sensors (Semiconductor Sensors). Its primary akta.pro industry code is HDAHAAAG, Sensors, MEMS & Imaging ICs, with a secondary code of HDAHALAH, Microphones & Acoustic MEMS (MEMS Mics/Ultrasonic Transducers). Its NAICS code is 33441 and its SIC code is 3823.