3SP Technologies S.A.S.
- Company typePrivate
- Founded1994
- HeadquartersNozay, France
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
3SP Technologies S.A.S. firmographics
Firmographics- Name
- 3SP Technologies S.A.S.
- Legal name
- 3SP Technologies S.A.S.
- Website
- https://3sptechnologies.com
- Company type
- Private
- Founded year
- 1994
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Ownership category
- akta.pro rank
3SP Technologies S.A.S. industry classification
Industry- Product category
- Optoelectronic Components (III-V Semiconductor Laser Modules and Chips)
- NAICS
- Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441)
- SIC
- Semiconductors & Related Devices (3674)
- akta.pro primary industry
- Optoelectronics & Photonics (LED/Laser/Optical ICs) (HDAHAAAH)
- akta.pro secondary industries
- Optoelectronic Emitters (LED/Laser/VCSEL) (HDAHALAL), Optoelectronic / Photonics Foundries (Silicon Photonics/LED/Laser) (HDAHACAG), Optoelectronic Components (LEDs, photodiodes, optocouplers, optical sensors) (IMAGAJAF)
Keywords
Where 3SP Technologies S.A.S. is headquartered
LocationHeadquarters
- HQ city
- Nozay
- HQ country
- France
- HQ region
- Europe
Offices1 record
Markets served
3SP Technologies S.A.S. business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Operations, Technology or R&D, Infrastructure, Supply Chain
Revenue model
- Optoelectronic Components Sales: Sale of active optoelectronic components including pump laser modules, seed pump laser modules, Raman pump laser modules, and chips/chips on submount. Products are powered by in-house III-V chip technology and sold to telecommunications, industrial, and medical markets.
- Foundry Services: Provides foundry services using its epitaxial and wafer processing expertise for III-V semiconductor components
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Custom optoelectronic components and modules |
Go-to-market motion1 record
Distribution channels1 record
Marketing channels4 records
3SP Technologies S.A.S. product offering
Product offeringCore offering
3SP Technologies develops, manufactures and sells active optoelectronic components powered by in-house III-V (InP and GaAs) chips, including 980nm pump laser modules, 106x nm seed laser modules, ultra-low power consumption 14xx-15xx nm Raman pump laser modules, and chips/chips-on-submount such as 1480nm DFB laser chips and PIN photodiodes. The company also provides foundry services using its epitaxial and wafer processing expertise. Products serve telecommunications, industrial laser, and medical/sensing applications and are Telcordia GR-468-CORE qualified where applicable.
Product overview
3SP Technologies develops, manufactures and sells active optoelectronic components powered by in-house III-V chips. The product portfolio includes: (1) Pump Laser Modules (980nm cooled and uncooled versions in various packages including 14-pin butterfly, 10-pin butterfly, mini-DIL, and TO can formats ranging from 200mW to 1100mW output power); (2) Seed Pump Laser Modules (106x nm wavelength modules for industrial applications); (3) Raman Pump Laser Modules (14XX-15XXnm ultra-low power consumption pump modules for optical amplification); and (4) Chips & Chips On Submount (including 1480nm DFB laser chips and PIN photodiodes). All products are fully Telcordia GR-468-CORE qualified where applicable, RoHS 6/6 compliant, and leverage GaAs and InP semiconductor chip technology.
Differentiator
Problem solved
Functional benefit
Products and services
- Pump Laser Modules (980nm cooled and uncooled) Family of 980nm pump laser modules powered by in-house GaAs chip technology, including uncooled 8-pin Mini-DIL (1999PLU), 3-pin Mini-Pump (1999UMM), and 3-pin TO Can (1999UMT) packages, plus cooled 14-pin Butterfly (1999CMB, 1999CHB, 1999CVB dual-chip) and 10-pin Butterfly (1999CMX, 1999CHX, 1999CVX, 1999SHX) variants with output power ranging from 200mW to 1100mW kink-free. All modules are fully Telcordia GR-468-CORE qualified and RoHS 6/6 compliant, targeting telecom and industrial laser applications including EDFA pumping.
- Seed Pump Laser Modules (106x nm) High-power seed laser module product portfolio for pulse operation and gain switching applications, including the 1064CHP 14-pin 106x nm seed laser module without FBG, available in 500mW 1060nm and 150mW 1030nm cooled versions. Powered by in-house GaAs chip technology, fully Telcordia GR-468-CORE qualified, and RoHS 6/6 compliant, serving industrial laser integrators.
- Raman Pump Laser Modules (14xx-15xx nm) Ultra-low power consumption 14XX-15XXnm Raman pump laser modules for optical amplification in telecom networks, including the 1948RxB 14-pin butterfly Raman pump (300-500mW EOL output power, FBG stabilized, with TEC, thermistor and linear monitoring photodiode) and the 1948RUB 700mW module launched in 2024. Designed and qualified for Raman amplification applications with high efficiency and Telcordia-grade reliability.
- Chips & Chips on Submount Discrete III-V optoelectronic chips and chip-on-submount products, including the 1943LCv1 1480nm DFB laser chip with pn-BH structure for high conversion efficiency and low beam divergence to single mode fiber (targeting industrial and medical markets), and the 1911DC 2.5Gb/s PIN photodiode for telecom applications. Sold to customers who integrate the bare or submounted chips into their own modules and systems.
- III-V Semiconductor Foundry Services Foundry services using 3SP Technologies' in-house epitaxial (MOVPE, GS-MBE) and wafer processing expertise for III-V semiconductor components. Provided to external customers leveraging the company's manufacturing platform, with vertical integration from front-end to back-end under one roof.
Quantifiable outcome
- 700mW output power with ultra-low 11W power consumption for Raman pump modules
- +2 more outcomes
Companies that use 3SP Technologies S.A.S.
Customer profileNamed customers3 records
Segments3 records
Ideal customer profiles3 records
3SP Technologies S.A.S. technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature4 records
3SP Technologies S.A.S. partnerships and signals
Strategic signalPartnerships
Five partnerships are on record, tiered minor and core.
- Riberminor3SP Technologies placed an order to purchase a MBE 412 system from Riber in 2019 to increase production capacity of optoelectronic components. Equipment delivered in 2020.
- O-Netcore3SP Technologies products are showcased and sold through O-Net Group's booth at trade shows. Products integrated with O-Net's portfolio including passive components, EDFAs and transceivers.
- ITF (ITF Technologies)minorStrategic partner relationship. ITF hosted 3SP Technologies at their booth representing the O-Net group at Photonics West 2019.
- CosetminorListed as strategic partner with Coset, a distributor/integrator in the optical components market.
- BFM BusinessminorFrench TV and radio channel featured 3SP Technologies CEO in 'Objectif Croissance' program for fast-growing French SMEs.
Scale indicators5 records
Recent moves7 records
Expansion highlights5 records
3SP Technologies S.A.S. competitors and assessment
Company assessmentDirect peers
- Lumentum: Lumentum is a leading US-based manufacturer of optical components, including pump lasers and Raman amplifiers for telecom. Its pump laser portfolio directly overlaps with 3SP's 980nm cooled pump modules and Raman pump modules, making it the most direct competitor in the same product category.
- EMCORE Corporation: EMCORE is a US-based specialist in compound semiconductor (InP, GaAs) optical components, including pump lasers, photodiodes, and inertial navigation products. Its product portfolio and customer base in telecom and industrial lasers directly overlap with 3SP Technologies.
- IPG Photonics: IPG Photonics is the world's leading manufacturer of high-power fiber lasers and corresponding pump diode sources. Its vertical integration into pump laser diodes closely mirrors 3SP's model of selling into industrial laser manufacturers and competes for the same downstream customers.
- nLight: nLight is a US-based manufacturer of high-power semiconductor laser diodes and fiber lasers for industrial, defense, and medical applications. It directly competes with 3SP in high-power GaAs-based laser chips and modules for industrial laser manufacturers.
Broad incumbents
- Broadcom: Broadcom is a major incumbent in optical components and transceivers for data centers and telecom. Its optics division supplies EDFAs and pluggable transceivers that incorporate pump laser technology, overlapping with 3SP's downstream customers and competitive landscape.
- Hamamatsu Photonics: Hamamatsu Photonics is a Japanese photonics incumbent offering optoelectronic devices, laser diodes, and detectors across scientific, medical, and industrial markets. Its compound semiconductor laser diode offering competes with 3SP in industrial and sensing applications.
- Coherent: Coherent (formerly II-VI) is a broad US-based photonics and compound semiconductor incumbent that produces pump laser diodes, optical components, and materials used in telecom and industrial laser systems. It competes with 3SP in III-V laser chips and modules but operates across a much wider portfolio.
- Mitsubishi Electric (Semiconductor & Device): Mitsubishi Electric manufactures laser diodes and optical devices for telecommunications and industrial applications. As a large Japanese incumbent, it competes with 3SP in pump and high-power laser diode modules but operates across a much broader electronics portfolio.
Others
- O-Net Communications: O-Net Communications is the Hong Kong-listed parent company of 3SP Technologies, supplying passive optical networking components, EDFAs, and transceivers. While not a direct competitor, it is the most economically linked entity and a key distribution channel for 3SP's products.
Emerging players
- Innolight: Innolight is a leading Chinese manufacturer of high-speed optical transceivers for data centers, a key downstream customer and adjacent ecosystem participant for 3SP's pump laser components. It represents the demand-side pull on 3SP's products rather than a direct competitor in chip manufacturing.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat6 records
Key risks6 records
Key highlights7 records
Customer concentration
3SP Technologies S.A.S. social profiles
Digital presence3SP Technologies S.A.S. compliance and trust
Trust signalCompliance1 record
3SP Technologies S.A.S. financial estimates
Financial estimateRevenue estimate
Valuation estimate
3SP Technologies S.A.S. leadership team
Management profileNumber of profiles
Profiles11 records
3SP Technologies S.A.S. subsidiaries and ownership
Company hierarchySubsidiaries2 records
3SP Technologies S.A.S. funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
3SP Technologies S.A.S. M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about 3SP Technologies S.A.S.
What does 3SP Technologies S.A.S. do?
3SP Technologies develops, manufactures and sells active optoelectronic components powered by in-house III-V (InP and GaAs) chips, including 980nm pump laser modules, 106x nm seed laser modules, ultra-low power consumption 14xx-15xx nm Raman pump laser modules, and chips/chips-on-submount such as 1480nm DFB laser chips and PIN photodiodes. The company also provides foundry services using its epitaxial and wafer processing expertise. Products serve telecommunications, industrial laser, and medical/sensing applications and are Telcordia GR-468-CORE qualified where applicable.
Is 3SP Technologies S.A.S. a public or private company?
3SP Technologies S.A.S. is a private company. It is classified as corporate owned and is currently operating.
When was 3SP Technologies S.A.S. founded?
3SP Technologies S.A.S. was founded in 1994. It employs 101 to 250 people.
Where is 3SP Technologies S.A.S. based?
3SP Technologies S.A.S. is headquartered in Nozay, France, in the Europe region.
How does 3SP Technologies S.A.S. make money?
Two revenue lines are on record. Optoelectronic Components Sales are the primary driver. The others are foundry Services.
Who are 3SP Technologies S.A.S.'s main competitors?
Direct peers on record are Lumentum, EMCORE Corporation, IPG Photonics and nLight. Broad incumbents are Broadcom, Hamamatsu Photonics, Coherent and Mitsubishi Electric (Semiconductor & Device). O-Net Communications is listed as an others. Innolight is listed as an emerging player.
Does 3SP Technologies S.A.S. have an API?
No public API is recorded for 3SP Technologies S.A.S..
What industry is 3SP Technologies S.A.S. in?
3SP Technologies S.A.S.'s product category is Optoelectronic Components (III-V Semiconductor Laser Modules and Chips). Its primary akta.pro industry code is HDAHAAAH, Optoelectronics & Photonics (LED/Laser/Optical ICs), with a secondary code of HDAHALAL, Optoelectronic Emitters (LED/Laser/VCSEL). Its NAICS code is 334413 and its SIC code is 3674.