ASMPT AMICRA
ASMPT AMICRA GmbH designs and manufactures ultra-high precision die attach and flip chip bonding equipment (±0.2 µm accuracy) for enterprise semiconductor and photonics customers, serving silicon photonics, 3D IC/TSV/TCB, AOC, VCSEL, fan-out/WLP, and automotive/LiDAR production applications globally.
- Company typePrivate
- Founded2001
- HeadquartersRegensburg, Germany
- Headcount51–100
- GTM typeB2B
- OfferingHardware or Manufacturing
What ASMPT AMICRA does
ASMPT AMICRA GmbH is a Germany-based designer and manufacturer of ultra-high precision die attach equipment, headquartered in Regensburg and operating as a wholly-owned subsidiary of ASM Pacific Technology Limited (ASMPT, HKEX: 0522). The company was originally founded as AMICRA Microtechnologies GmbH in 2001 by Rudolf Kaiser and Horst Lapsien, merged with ASMPT in 2018, and today specializes in sub-micron placement accuracy (±0.2 µm@3s on its NANO platform) die bonders and flip chip bonders, plus high-speed dispensing systems. Its core technology combines vision-driven dynamic alignment (with up to four automatic vision stations mounted on rigid granite structures), fiber-laser eutectic bonding, vibration damping, and precision motion control to support die attach, flip chip bonding, thermocompression bonding (TCB), and panel-level processes up to 550 mm × 600 mm.
The product portfolio comprises five core systems: the AMICRA NANO (ultra-precision, ±0.2 µm, silicon photonics and WLP), AMICRA NOVA (high-throughput, ±1.0 µm, advanced packaging and optoelectronics), NANO Lite (±1 µm, micro-optics/LED/MEMS volume production), CoS Die Bonder (±1.5 µm, chip-on-submount for SiPhotonics, 5G, LiDAR, AR), and the High Speed Dispense System (inline reel-to-reel dispensing). Revenue is generated primarily through direct hardware sales to high-volume enterprise semiconductor and photonics manufacturers, supplemented by process development, prototyping, and small-batch manufacturing services. Distribution combines direct sales offices in Germany, the USA (Tempe, AZ), Hong Kong, and Singapore with exclusive regional partners covering Taiwan, France/Spain/Portugal/Morocco, Switzerland, Singapore/Malaysia/Thailand, Israel, the Philippines, and Japan.
ASMPT AMICRA serves photonics and advanced packaging customers in silicon photonics/PIC, 3D IC/TSV/TCB, active optical cables (AOC), VCSEL/laser diodes, fan-out/WLP, MEMS, and automotive/LiDAR applications. The customer base includes named enterprise accounts such as a large European laser diode manufacturer, a large Taiwanese semiconductor packaging manufacturer, and a large Thai optoelectronic packaging manufacturer. The company markets itself as a worldwide leading supplier of sub-micron die attach equipment, supported by the 2019 Productronica Innovation Award, the 2022 TOP 100 German innovation seal, ISO 9001 certification (2025-2028), and a 2021 strategic partnership with X-Celeprint to integrate Micro-Transfer Printing (300+ patents) into AMICRA bonding platforms.
ASMPT AMICRA firmographics
Firmographics- Name
- ASMPT AMICRA
- Legal name
- ASMPT AMICRA GmbH
- Website
- https://amicra.semi.asmpt.com
- Company type
- Private
- Founded year
- 2001
- Operating status
- Operating
- Headcount range
- 51–100 employees
- Short description
- ASMPT AMICRA GmbH designs and manufactures ultra-high precision die attach and flip chip bonding equipment (±0.2 µm accuracy) for enterprise semiconductor and photonics customers, serving silicon photonics, 3D IC/TSV/TCB, AOC, VCSEL, fan-out/WLP, and automotive/LiDAR production applications globally.
- Ownership category
- akta.pro rank
ASMPT AMICRA industry classification
Industry- Product category
- Semiconductor Manufacturing Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- akta.pro primary industry
- Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)
- akta.pro secondary industry
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)
Keywords
Where ASMPT AMICRA is headquartered
LocationHeadquarters
- HQ city
- Regensburg
- HQ country
- Germany
- HQ region
- Europe
Offices4 records
Markets served
ASMPT AMICRA business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Supply Chain, Personnel, Marketing or Sales, Operations
Revenue model
- Die Attach Equipment Sales: Sale of ultra-high precision die attach equipment including Die Bonders, Flip Chip Bonders, and dispensing systems. Equipment is sold directly to semiconductor and photonics manufacturers for high-volume production.
- Process Development and Support Services: Engineering services including process development, production transfer, prototyping, and small-batch manufacturing to support customer adoption of advanced packaging technologies.
Go-to-market motion2 records
Distribution channels3 records
Marketing channels7 records
ASMPT AMICRA product offering
Product offeringCore offering
ASMPT AMICRA designs, manufactures, and sells ultra-high precision die attach equipment with submicron placement accuracy (±0.2µm@3s). Its portfolio includes the AMICRA NANO, AMICRA NOVA, CoS Die Bonder, NANO Lite die/flip-chip bonders, and a High Speed Dispense System (HDS), sold to high-volume semiconductor and photonics manufacturers for advanced packaging applications such as silicon photonics, 3D IC/TSV/TCB, active optical cables, and fan-out wafer-level packaging.
Product overview
ASMPT AMICRA GmbH is a worldwide leading supplier of ultra-high precision Die Attach Equipment specializing in submicron placement accuracy (±0.2μm@3s). The company offers a portfolio of die bonding and flip chip bonding equipment along with high-speed dispense systems. The core product line includes: AMICRA NANO (ultra-precision bonder with ±0.2μm accuracy for silicon photonics applications), AMICRA NOVA (high-speed precision bonder with ±1.0μm accuracy and <3 second cycle time for advanced packaging), NANO Lite (flexible die bonder with ±1μm accuracy for volume production), CoS Die Bonder (chip-on-substrate bonder with ±1.5μm accuracy for optoelectronic packaging), and the High Speed Dispense System (HDS) for inline dispensing applications. These systems support die attach, flip chip bonding, eutectic bonding, epoxy processes, and UV-curable adhesive bonding across markets including silicon photonics, 3D IC/TSV/TCB, active optical cables, and fan-out packaging.
Differentiator
Problem solved
Functional benefit
Brands
- CoS Die Bonder: High-precision chip-on-substrate bonding die bonder system
- AMICRA NOVA
- AMICRA NANO
- NANO Lite
- High Speed Dispense System (HDS)
Products and services
- CoS Die Bonder Fully automatic high-precision chip-on-substrate die bonder with placement accuracy of ±1.5µm @ 3σ and cycle time of 6-10 seconds, designed for SiPhotonics, data communication/5G, 3D sensor/LiDAR, and augmented reality markets.
- AMICRA NOVA High-precision die bonder and flip chip bonder with placement accuracy of ±1.0µm @ 3σ and cycle time of <3 seconds, supporting eutectic bonding via diode laser, heating plate, or epoxy stamping, designed for semiconductor advanced packaging, automotive sensors, LED, and optoelectronics markets.
- AMICRA NANO Ultra-precision die bonder and flip chip bonder offering the highest placement accuracy in its class at ±0.2µm @ 3σ with cycle times of 20-30 seconds/bond, designed for silicon photonics, optical device packaging, WLP, and direct bond connection applications.
- NANO Lite Fully automatic high-precision die bonder and flip chip bonder with placement accuracy of ±1µm @ 3σ and cycle time of <15 seconds, designed for micro optics, LED and MEMS assembly, and semiconductor advanced packaging for volume production.
- High Speed Dispense System (HDS) Fully automatic inline high speed reel-to-reel, lead or frame dispensing line supporting quad or dual headed dispensing, underfill, glob top, and general dispensing applications, compatible with time pressure vacuum, volumetric/auger, and jet dispensers.
Quantifiable outcome
- Placement accuracy of ±0.2µm@3s for NANO system - highest in its class
- +3 more outcomes
Companies that use ASMPT AMICRA
Customer profileNamed customers3 records
Segments8 records
Ideal customer profiles2 records
ASMPT AMICRA technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature7 records
ASMPT AMICRA partnerships and signals
Strategic signalPartnerships
Ten partnerships are on record, tiered core and minor.
- X-Celeprint, Ltd.coreStrategic partnership to incorporate X-Celeprint's Micro-Transfer Printing (MTP) technology into ASMPT AMICRA's die bonding systems. Combined technology enables high-volume heterogeneous integration of ultra-thin chips onto 300mm base wafers. Three MTP systems developed: Nova+ MTP, NANO MTP, and AFC+ MTP.
- Kanematsu PWS LTD.minorIntegrated into sales team in Asia to cover Japan market as exclusive distribution partner.
- Globaltech AutomationminorSales team addition in Asia to serve the Philippines market.
- PAiTECH Co., LtdminorNew sales partner for Israel.
- Schmidtek Ltd.minorExclusive distribution agreement for Taiwan sales territory.
- Caleo S.A.minorExclusive distribution agreement for France, Spain, Portugal, and Morocco.
- Interelec AGminorExclusive distribution agreement for Switzerland.
- WKKminorDistribution agreement for Singapore, Malaysia, and Thailand.
- ASM Pacific Technology Limited (ASMPT)coreParent company of ASMPT AMICRA. ASMPT is a leading global supplier of hardware and software solutions for semiconductor and electronics manufacturing, headquartered in Singapore (HKEX stock code: 0522).
- EPIC AssociationminorIndustry association membership for photonics companies, started in 2017.
Scale indicators5 records
Recent moves9 records
Expansion highlights6 records
ASMPT AMICRA competitors and assessment
Company assessmentBroad incumbents
- ASM Pacific Technology (ASMPT): AMICRA's parent and a global broad-line supplier of semiconductor and SMT assembly equipment; competes in adjacent die bonding and advanced packaging categories, and shapes AMICRA's go-to-market.
- Panasonic Smart Factory Solutions: Large Japanese industrial conglomerate offering die bonders and electronics assembly equipment with overlapping capability in advanced packaging; competes broadly rather than specializing in AMICRA's submicron niche.
Direct peers
- Kulicke & Soffa Industries: Major supplier of die bonders and advanced packaging equipment with overlapping accuracy and throughput positioning; competes head-to-head with AMICRA in flip chip, photonics, and automotive sensor assembly.
- Toray Engineering: Japanese supplier of die bonders and advanced packaging equipment serving semiconductor and photonics customers; directly comparable to AMICRA in flip chip and Fan-Out wafer-level packaging equipment.
- Mycronic MRSI: Manufacturer of high-precision die bonders for photonics, 5G, and datacom modules; a close direct competitor to AMICRA in submicron flip chip and eutectic die bonding for optoelectronic packaging.
- BE Semiconductor Industries (Besi): Global leader in die bonding and advanced packaging equipment for semiconductor assembly, directly competing with AMICRA in flip chip, TCB, and hybrid bonding tools serving similar OSAT and IDM customers.
- Hesse Mechatronics: Manufacturer of precision wire bonders and die bonders for automotive, power, and optoelectronic packaging; competes with AMICRA in heavy-duty and high-reliability die attach applications.
- Finetech GmbH: German maker of submicron die bonders and flip chip systems used in photonics, R&D, and micro-assembly; a direct competitor in sub-micron placement accuracy niches.
- SET Corporation (Smart Equipment Technology): French specialist in high-accuracy die bonders and flip chip bonders for 3D IC, photonics, and MEMS; competes directly with AMICRA in submicron placement accuracy and in-situ bonding segments.
- Palomar Technologies: US-based supplier of precision die bonders and photonics packaging equipment, directly comparable to AMICRA in eutectic bonding and submicron optoelectronic component assembly.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
ASMPT AMICRA social profiles
Digital presenceASMPT AMICRA compliance and trust
Trust signalCompliance1 record
ASMPT AMICRA financial estimates
Financial estimateRevenue estimate
Valuation estimate
ASMPT AMICRA leadership team
Management profileNumber of profiles
Profiles2 records
ASMPT AMICRA funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
ASMPT AMICRA M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about ASMPT AMICRA
What does ASMPT AMICRA do?
ASMPT AMICRA designs, manufactures, and sells ultra-high precision die attach equipment with submicron placement accuracy (±0.2µm@3s). Its portfolio includes the AMICRA NANO, AMICRA NOVA, CoS Die Bonder, NANO Lite die/flip-chip bonders, and a High Speed Dispense System (HDS), sold to high-volume semiconductor and photonics manufacturers for advanced packaging applications such as silicon photonics, 3D IC/TSV/TCB, active optical cables, and fan-out wafer-level packaging.
Is ASMPT AMICRA a public or private company?
ASMPT AMICRA is a private company. It is classified as corporate owned and is currently operating.
When was ASMPT AMICRA founded?
ASMPT AMICRA was founded in 2001. It employs 51 to 100 people.
Where is ASMPT AMICRA based?
ASMPT AMICRA is headquartered in Regensburg, Germany, in the Europe region.
How does ASMPT AMICRA make money?
Two revenue lines are on record. Die Attach Equipment Sales are the primary driver. The others are process Development and Support Services.
Who are ASMPT AMICRA's main competitors?
Broad incumbents on record are ASM Pacific Technology (ASMPT) and Panasonic Smart Factory Solutions. Direct peers are Kulicke & Soffa Industries, Toray Engineering, Mycronic MRSI, BE Semiconductor Industries (Besi), Hesse Mechatronics, Finetech GmbH, SET Corporation (Smart Equipment Technology) and Palomar Technologies.
Does ASMPT AMICRA have an API?
No public API is recorded for ASMPT AMICRA.
What industry is ASMPT AMICRA in?
ASMPT AMICRA's product category is Semiconductor Manufacturing Equipment. Its primary akta.pro industry code is HDAHAEAL, Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB), with a secondary code of HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets). Its NAICS code is 333242.