Elephantech Inc.
- Company typePrivate
- Founded2014
- HeadquartersTokyo, Japan
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
Elephantech Inc. firmographics
Firmographics- Name
- Elephantech Inc.
- Legal name
- Elephantech Inc.
- Website
- https://elephantech.com
- Company type
- Private
- Founded year
- 2014
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Ownership category
- akta.pro rank
Elephantech Inc. industry classification
Industry- Product category
- Electronic Manufacturing Services (PCB manufacturing equipment and materials)
- NAICS
- Bare Printed Circuit Board Manufacturing (334412)
- SIC
- Printed Circuit Boards (3672)
- akta.pro primary industry
- PCB Materials & Laminates (Copper Clad, Prepreg, Cores) (HDAHAOAJ)
- akta.pro secondary industries
- Digital & Specialty Inks (Inkjet, UV, Conductive) (IMAEAHAI), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)
Keywords
Where Elephantech Inc. is headquartered
LocationHeadquarters
- HQ city
- Tokyo
- HQ country
- Japan
- HQ region
- Asia
Offices4 records
Markets served
Elephantech Inc. business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Operations, Infrastructure, Marketing or Sales, Supply Chain
Revenue model
- Flexible Printed Circuit (FPC) Sales - P-Flex: Sale of environmentally-friendly flexible printed circuit boards manufactured using SustainaCircuits/Pure Additive process. Available in PET and PI substrates, thin-film and thick-film variants. Target applications include consumer electronics, automotive sensors, cameras, and industrial equipment.
- Inkjet Printing Equipment Sales - ELP04 Series: Sale of proprietary inkjet printing equipment (ELP04 PILOT 600R and variants) to manufacturing partners. Elephantech has sold systems to partners such as Sumitronics Corporation for in-house production deployment.
- Advanced Materials - Copper Nano-Paste: Sale of proprietary copper nanoparticle inks and nano-paste materials (SAphire series, DeepVia solutions) for specialized PCB and semiconductor packaging applications. Materials include SAphire B, D, D02, G and DeepVia formulations.
- SustainaCircuits Technology Licensing and Solutions: Provision of SustainaCircuits multilayer solutions including equipment and materials to partners like LITEON for their own PCB production, enabling them to adopt Elephantech's additive manufacturing process.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | B2B custom pricing for enterprise electronics manufacturers |
Go-to-market motion1 record
Distribution channels5 records
Marketing channels7 records
Elephantech Inc. product offering
Product offeringCore offering
Elephantech develops and manufactures low-environmental-impact printed circuit boards using its proprietary SustainaCircuits additive platform, which combines metal inkjet printing with selective copper plating to replace conventional subtractive etching. The company sells flexible printed circuits (P-Flex), multilayer rigid PCBs, industrial inkjet printing equipment (ELP04 series), advanced copper nano-paste materials (SAphire), and seed-layer solutions (DeepVia, DS-SAP) for semiconductor packaging, primarily to enterprise electronics manufacturers worldwide.
Product overview
Elephantech Inc. is a Japanese technology company that has developed SustainaCircuits, a proprietary additive manufacturing platform for printed circuit boards (PCBs). The company's product portfolio centers on three main areas: (1) SustainaCircuits technology for low-carbon PCB manufacturing using inkjet printing and selective copper plating, (2) P-Flex® flexible printed circuits as the main product offering, and (3) advanced materials including SAphire™ copper nano-paste series for die attach and via filling, and DeepVia™ seed layer solutions for semiconductor packaging. The company also offers inkjet printing equipment (ELP04 Series), AI-powered droplet control technology (NeuralJet®), and multi-layer PCB solutions (SustainaCircuits Multilayer). All products are designed to reduce environmental impact—reducing CO2 emissions by 75%, water consumption by 95%, and copper usage by 70% compared to conventional subtractive manufacturing. The company serves consumer electronics, automotive, IoT, and semiconductor packaging industries.
Differentiator
Problem solved
Functional benefit
Brands
- SustainaCircuits: Proprietary additive PCB manufacturing process that uses inkjet printing and copper plating to reduce CO2 emissions by 75% and water consumption by 95%.
- P-Flex
- SAphire
- DeepVia
- DS-SAP
- TabbyPrint
- Pure Additive
- NeuralJet
- Neochromato Process
Products and services
- P-Flex Flexible Printed Circuits Flexible printed circuit boards manufactured using Elephantech's Pure Additive / SustainaCircuits process. Available in polyimide (PI) and PET substrates, with thin-film (<1 μm copper) and thick-film (>100 μm copper) variants. Used in consumer electronics, automotive sensors, cameras, IoT devices, and industrial equipment.
- SustainaCircuits Multilayer Rigid PCB Solutions Multi-layer rigid PCB manufacturing solutions using the SustainaCircuits additive process, including multilayer equipment and materials provision to partners like LITEON. Targets computing and AI hardware markets.
- ELP04 Series Inkjet Printing Equipment Industrial-grade inkjet printing equipment series (ELP04 PILOT, ELP04 PILOT 600R) delivering high-precision, high-productivity additive PCB manufacturing. Sold to manufacturing partners for in-house production deployment.
- SAphire Series Copper Nano-Paste Materials Family of low-temperature sintering copper nano-paste products: SAphire B for inter-board connections in ultra-high-layer PCBs, SAphire D for power semiconductor die attach, SAphire D02 for pressureless die attach, and SAphire G for Through-Glass Via (TGV) filling. Sold as consumable materials to PCB and semiconductor packaging manufacturers.
- DeepVia Solutions Seed-layer metallization solutions for high-aspect-ratio vias: DeepVia Silicon for copper seed layers in 3D semiconductor integration, and DeepVia HDI for high-aspect-ratio (≥3:1) microvia metallization in AI/HPC applications.
- DS-SAP Dual-Seed Advanced Packaging Process Dual-Seed Advanced Packaging process for semiconductor package substrates. Independently forms seed layers for surface patterning and via metallization, enabling ultra-thin traces and reliable coverage of high-aspect-ratio vias for AI accelerator packaging.
- Copper Nanoparticle Inks
Quantifiable outcome
- 75% reduction in CO2 emissions vs conventional PCB manufacturing (cradle-to-gate LCA)
- +7 more outcomes
Companies that use Elephantech Inc.
Customer profileNamed customers7 records
Segments4 records
Ideal customer profiles5 records
Elephantech Inc. technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
AI capability2 records
Feature9 records
Elephantech Inc. partnerships and signals
Strategic signalPartnerships
14 partnerships are on record, tiered core, flagship and minor.
- UCLA CHIPS (Center for Heterogeneous Integration and Performance Scaling)coreElephantech joined UCLA's university-industry consortium focused on heterogeneous integration and performance scaling for advanced semiconductor packaging.
- Mitsubishi Electric CorporationflagshipJPY 4 billion strategic investment and partnership to accelerate global deployment of SustainaCircuits technology. Partnership aims to scale SustainaCircuits adoption across Mitsubishi Electric's global manufacturing operations.
- Sumitronics CorporationcoreSumitronics implemented Elephantech's inkjet printing system ELP04 PILOT 600R for their own manufacturing operations, with joint exhibition presence at NEPCON Japan 2026.
- Amazon DevicesflagshipElephantech selected as inaugural member of Amazon Devices Climate Tech Accelerator 2025 - a global initiative to drive sustainability innovations for Amazon hardware products.
- Logitech InternationalflagshipSustainaCircuits FPC mass-produced in Logitech MX Vertical mouse - first global mass production deployment of SustainaCircuits by a major consumer electronics brand. Collaboration began with Logitech Future Positive Challenge Winner selection in 2023.
- OM Digital Solutions CorporationcoreSustainaCircuits FPC adopted for mass production in OM Digital Solutions' interchangeable lens products, marking first camera/optical application of SustainaCircuits.
- LITEON Technology CorporationflagshipFirst MoU signed November 2023 for low-carbon PCB adoption. Second MoU signed April 2025 for SustainaCircuits multilayer solutions. LITEON adopted SustainaCircuits FPC for keyboard backlight modules, marking first SustainaCircuits adoption by a major EMS provider.
- DaikyoNishikawa CorporationminorP-Flex flex PCB adopted for bumper millimeter-wave radar concept for ADAS vehicles.
- NICCA CHEMICAL CO., LTD.minorJoint development of Neochromato Process - polyester fabric decolorization technology for zero-waste fashion. Awarded crQlr Decolor Without Waste Award and 2024 Kinki Bureau Director General Award.
- Marubun CorporationminorDistributorship agreement for P-Flex flexible circuit products in Japan market.
- Nisshinbo Mechatronics Inc.minorAgreement to develop molded parts for ADAS vehicles using IMPC (Injection Molded Printed Circuit) technology.
- Sumitomo CorporationcoreStrategic business partnership established November 2019 to support Elephantech's business expansion and manufacturing scaling.
- Mitsui Chemicals Inc.coreMitsui Chemicals provides factory building and mass-production know-how. Elephantech established AMC Nagoya within Mitsui Chemicals Nagoya Works. Mitsui Chemicals contributed director (Hiroshi Miyao) to Elephantech's Additive Manufacturing Center in 2022.
- Seiko Epson CorporationcoreEpson provides inkjet printhead technology and equipment for Elephantech's additive PCB manufacturing. Strategic capital and business partnership established in 2019.
Scale indicators8 records
Recent moves11 records
Expansion highlights7 records
Elephantech Inc. competitors and assessment
Company assessmentBroad incumbents
- Unimicron Technology: Unimicron is a leading Taiwanese PCB and IC substrate manufacturer with global scale, including HDI, rigid-flex, and high-layer-count boards. Relevant as a large incumbent serving consumer electronics, automotive, and IC packaging customers overlapping with Elephantech's target segments.
- Tripod Technology: Tripod Technology is a Taiwanese PCB manufacturer with significant HDI and multilayer PCB capacity serving consumer electronics, networking, and automotive end markets. Overlaps with Elephantech's traditional PCB customer base.
- TTM Technologies: TTM Technologies is one of the world's largest PCB manufacturers serving aerospace, automotive, and datacenter end markets. Compares as a broad incumbent offering the full PCB portfolio (rigid, flex, HDI, substrate-like) against which Elephantech's additive process must compete.
- Nippon Mektron: Nippon Mektron is a leading Japanese flex PCB manufacturer serving consumer electronics, automotive, and industrial markets. Directly comparable to Elephantech's P-Flex flexible circuit business in product category and target geographies.
- AT&S (Austria Technologie & Systemtechnik): AT&S is a major European PCB and IC substrate manufacturer with strong positions in high-end substrates for AI/data center applications. Comparable as an incumbent in advanced PCB and substrate manufacturing competing for similar semiconductor packaging customers.
- Ibiden Co., Ltd. Ibiden is a Japanese PCB and IC substrate manufacturer with strong positions in high-end package substrates for CPUs and AI chips. Comparable for advanced semiconductor packaging substrates where Elephantech's DS-SAP solution is targeting.
- Zhen Ding Technology Holding: Zhen Ding is the world's largest flexible PCB maker, serving smartphone, wearable, and automotive customers. Most directly comparable to Elephantech's P-Flex flexible printed circuit product line.
Direct peers
- Nano Dimension: Nano Dimension develops additive manufacturing systems for printed circuit boards (DragonFly, Admatec), directly competing with Elephantech's inkjet-based PCB manufacturing approach. Both target rapid prototyping and on-demand PCB production using proprietary deposition processes.
Emerging players
- Voltera: Voltera produces benchtop inkjet/Dispense PCB printers (V-One, NOVA) targeting rapid prototyping and low-volume production. Comparable as an emerging additive PCB equipment maker, though focused on a different (smaller-scale) segment than Elephantech's industrial customers.
- BotFactory: BotFactory offers desktop additive PCB printing systems for prototyping and short-run manufacturing. Comparable to Elephantech as an emerging player in additive PCB printing, but operates at a much smaller scale and in a different customer segment (R&D labs vs. mass production).
Market position
Strengths5 records
Weaknesses5 records
Competitive moat7 records
Key risks7 records
Key highlights7 records
Customer concentration
Elephantech Inc. social profiles
Digital presenceElephantech Inc. compliance and trust
Trust signalCompliance3 records
Elephantech Inc. financial estimates
Financial estimateRevenue estimate
Valuation estimate
Elephantech Inc. leadership team
Management profileNumber of profiles
Profiles10 records
Elephantech Inc. funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Elephantech Inc. M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Elephantech Inc.
What does Elephantech Inc. do?
Elephantech develops and manufactures low-environmental-impact printed circuit boards using its proprietary SustainaCircuits additive platform, which combines metal inkjet printing with selective copper plating to replace conventional subtractive etching. The company sells flexible printed circuits (P-Flex), multilayer rigid PCBs, industrial inkjet printing equipment (ELP04 series), advanced copper nano-paste materials (SAphire), and seed-layer solutions (DeepVia, DS-SAP) for semiconductor packaging, primarily to enterprise electronics manufacturers worldwide.
Is Elephantech Inc. a public or private company?
Elephantech Inc. is a private company. It is classified as venture growth investor backed and is currently operating.
When was Elephantech Inc. founded?
Elephantech Inc. was founded in 2014. It employs 11 to 50 people.
Where is Elephantech Inc. based?
Elephantech Inc. is headquartered in Tokyo, Japan, in the Asia region.
How does Elephantech Inc. make money?
Four revenue lines are on record. Flexible Printed Circuit (FPC) Sales - P-Flex is the primary driver. The others are inkjet Printing Equipment Sales - ELP04 Series, advanced Materials - Copper Nano-Paste and sustainaCircuits Technology Licensing and Solutions.
Who are Elephantech Inc.'s main competitors?
Broad incumbents on record are Unimicron Technology, Tripod Technology, TTM Technologies, Nippon Mektron, AT&S (Austria Technologie & Systemtechnik), Ibiden Co., Ltd. and Zhen Ding Technology Holding. Nano Dimension is listed as a direct peer. Emerging players are Voltera and BotFactory.
Does Elephantech Inc. have an API?
No public API is recorded for Elephantech Inc..
What industry is Elephantech Inc. in?
Elephantech Inc.'s product category is Electronic Manufacturing Services (PCB manufacturing equipment and materials). Its primary akta.pro industry code is HDAHAOAJ, PCB Materials & Laminates (Copper Clad, Prepreg, Cores), with a secondary code of IMAEAHAI, Digital & Specialty Inks (Inkjet, UV, Conductive). Its NAICS code is 334412 and its SIC code is 3672.