HANAWLS

What HANAWLS does

HANA WLS (HANA더블유엘에스 주식회사) is a South Korean OSAT (Outsourced Semiconductor Assembly and Test) provider and a wholly-owned subsidiary of HANA Micron (KOSDAQ: 067310), the largest OSAT company in South Korea and a global top-11 OSAT ranked company. Founded in 2001 as a spin-off from Samsung Electronics' Memory Business Division, HANA WLS specializes in Wafer Level Package (WLP) full turnkey solutions, covering bumping (WLCSP for 8"/12" wafers, solder bumping, Cu pillar bumping, high-performance RDL), electrical testing (wafer probe test, final test), die processing services (back grinding, sawing, laser marking, tape & reel), and engineering solutions (design and simulation, reliability, failure analysis, verification). The company also operates a System Semiconductor Test Support Center in Pangyo equipped with Teradyne and Advantest test platforms, serving fabless companies, design houses, and foundries.

HANA WLS serves a global enterprise customer base concentrated in memory and system semiconductors, including Samsung Electronics, SK Hynix, and Qualcomm, with end-markets spanning mobile, IoT/NB-IoT, and emerging AI semiconductor packaging. The company delivers through a four-country production footprint: Korea (Asan-si headquarters and Pangyo engineering/test center), Brazil (HT Micron for packaging and HANA Electronics for module production), Vietnam (HANA Micron VINA), and the USA. Manufacturing is delivered through direct enterprise sales with custom quotation based on wafer size, technology node, and volume; pricing is not publicly disclosed. The 2025 consolidated HANA Micron revenue was KRW 1.5344 trillion across ~4,000 employees globally, with HANA WLS positioned as the group's core WLP/bump/test/DPS operating unit.

The company's business model is B2B professional services for semiconductor back-end processing, with revenue generated per wafer/package processed rather than per software license or subscription. Differentiation rests on being described as the only OSAT with a dedicated in-house research institute, combined one-stop integration from bump through test and DPS, and capital-intensive test platform infrastructure. Recent strategic priorities have shifted toward non-memory and advanced packaging (2.5D by end-2025, Large Body in July 2026), geographic diversification (Brazil, Vietnam), and IoT/SiP ecosystem partnerships (Qualcomm, TIM Brasil).

Name

HANAWLS

Legal name

하나더블유엘에스 주식회사

Website

https://hanawls.com

Company type

Private

Founded year

2001

Operating status

Operating

Headcount range

1–10 employees

Short description

HANA WLS is a South Korean OSAT and wholly-owned subsidiary of HANA Micron, providing WLP full turnkey solutions — bumping, wafer/final test, die processing, and engineering — primarily to Samsung Electronics, SK Hynix, and global fabless semiconductor companies across Korea, Brazil, Vietnam, and the USA.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging and Test (OSAT)

NAICS

Testing Laboratories and Services (54138)

SIC

Services-Testing Laboratories (8734)

akta.pro primary industry

Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC)

Keywords

• Semiconductor packaging services
• OSAT backend processing
• Wafer level chip scale packaging
• Semiconductor test services
• Die processing services

Headquarters

HQ city

Asan-si

HQ country

South Korea

HQ region

Asia

Offices4 records

Markets served

GTM type

B2B

Offering type

Services

Cost components

Technology or R&D, Infrastructure, Personnel, Operations, Supply Chain

Revenue model

1. Semiconductor Assembly & Test Services: OSAT (Outsourced Semiconductor Assembly and Test) services including bumping, packaging, testing, and die processing for memory and system semiconductor customers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

HANA WLS is a semiconductor package and test total solution provider offering WLP full-turnkey services. Its core offering covers four integrated service lines: Bump (solder and Cu pillar bumping for WLCSP and flip-chip), Test (wafer probe test and final test on multiple tester platforms), DPS (die processing including back grinding, sawing, laser marking, and tape & reel), and Engineering Solution (design & simulation, reliability, failure analysis, verification). These services are delivered to memory and system-semiconductor manufacturers globally.

Product overview

HANA WLS is a semiconductor package and test total solution provider offering a comprehensive portfolio of back-end semiconductor services. The core offerings include Bump (solder/Cu pillar bumping for WLCSP and flip-chip), Test (wafer-level and final electrical testing), DPS (die processing services), and Engineering Solutions (design, simulation, reliability, failure analysis). HANA Micron, the parent company, provides Full Turnkey Solutions with multiple packaging technologies including Wafer Level Package, Flip Chip, Laminate, and Lead Frame packages. The company also operates a System Semiconductor Test Support Center in Pangyo providing test platforms and services to fabless and design houses. The portfolio integrates bumping, packaging, testing, and engineering capabilities into an end-to-end semiconductor back-end solution.

Differentiator

Problem solved

Functional benefit

Products and services

• Bump (Solder and Cu Pillar Bumping) Provides solder bumping and Cu pillar bumping solutions for WLCSP (8-inch and 12-inch wafers) and flip-chip packaging, including high-performance RDL (Redistribution Layer) technology, for semiconductor manufacturers.
• Test (Wafer Probe and Final Test) Provides electrical testing solutions for wafer-level chips (ICs) with molded bumps, including Wafer Probe Test and Final Test services, supported by multiple tester platforms (Teradyne I-Flex, U-Flex, J750EX; Advantest V93K, T2000).
• DPS (Die Processing Service) Provides post-test processing services including back grinding, sawing, laser marking, and tape & reel for electrically tested semiconductor products.
• Engineering Solution Provides comprehensive engineering services including design and simulation (electrical, mechanical stress, thermal), reliability testing, failure analysis, and verification for semiconductor packaging customers.
• System Semiconductor Test Support Center Provides test infrastructure and support services for system semiconductor companies (fabless, design houses, foundries) located in Pangyo, offering Probe Test through Final Test platforms along with development and education support.
• WLP Full Turnkey Solution End-to-end Wafer Level Package full-turnkey solution integrating bumping, wafer-level packaging (WLCSP), flip-chip, laminate, and lead-frame packaging through final test, with advanced 2.5D and Large Body packaging capabilities for AI and high-performance semiconductor applications.

Named customers3 records

Segments3 records

Ideal customer profiles3 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

Five partnerships are on record, tiered core.

• QualcommcoreStrategic or Co-development Partner · 28 December 2022Global semiconductor company Qualcomm providing LTE IoT modem chips for NB-IoT SiP (System-in-Package) product development with HT Micron and TIM Brazil. HANA Micron's Brazilian subsidiary HT Micron handles SiP production and sales, with circuit and package design jointly developed with HANA Micron.
• TIMcoreStrategic or Co-development Partner · 28 December 2022Brazil's leading telecommunications company TIM as the customer/channel partner for NB-IoT SiP products. TIM will distribute NB-IoT products developed through the partnership with Qualcomm and HT Micron.
• HANA Materials (하나머티리얼즈)coreOthersAffiliate company within HANA Micron Group providing complementary materials for semiconductor processing
• Samsung ElectronicscoreTechnology or IntegrationMajor customer receiving memory and system semiconductor backend processing including AP testing and packaging services
• SK HynixcoreTechnology or IntegrationMajor customer receiving memory semiconductor testing and packaging services

Scale indicators8 records

Recent moves9 records

Expansion highlights5 records

Direct peers

• ChipMOS Technologies: Taiwan-based OSAT providing bumping, WLP, gold bumping, and final test for memory and mixed-signal/display driver ICs; overlapping service mix and customer base with HANA WLS.
• ASE Technology Holding: World's largest OSAT provider offering bumping, wafer-level packaging, flip-chip, advanced packaging (2.5D/3D), and final test—directly comparable full-stack OSAT portfolio and customer base spanning memory and logic.
• Amkor Technology: Top-tier global OSAT serving IDMs and fabless customers with advanced packaging, WLP, bumping, and test services; a direct competitor for tier-1 customers such as Samsung, Qualcomm, and global fabless.
• JCET Group: China's largest OSAT offering bumping, WLP, flip-chip, SiP, and advanced packaging across memory and system semiconductor; comparable end-to-end backend service portfolio and global tier-1 customer engagement.
• Powertech Technology (PTI): Taiwan-based OSAT providing bumping, wafer-level packaging, flip-chip, and final test for memory and logic customers; competes with HANA WLS especially in WLP and DRAM/NAND backend services.
• Tongfu Microelectronics: Major China-based OSAT with bumping, WLP, flip-chip packaging, and final test capabilities serving memory and logic customers; competes for global tier-1 customers including Korean memory makers.
• King Yuan Electronics (KYEC): Taiwan-based OSAT specializing in semiconductor test services with advanced tester fleet (Teradyne, Advantest); directly comparable to HANA WLS's Test business and System Semiconductor Test Support Center.

Regional players

• Nepes Corporation: Korea-based OSAT and packaging company providing bumping, WLP, fan-out, and test for system semiconductors; competes with HANA WLS in the Korean domestic market.
• LB Semicon: Korea-based OSAT and wafer test service provider competing with HANA WLS for domestic Korean memory and system semiconductor backend demand.
• Shinko Electric Industries: Japanese OSAT focused on flip-chip BGA, WLP, bumping, and lead-frame packaging for logic and memory; comparable advanced packaging portfolio serving tier-1 Japanese and global customers.

Market position

Strengths5 records

Weaknesses3 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/hanawls

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about HANAWLS