Hermes Testing Solutions Inc.

What Hermes Testing Solutions Inc. does

Hermes Testing Solutions Inc. (HTSI; 漢民測試系統股份有限公司) is a Hsinchu-based, publicly listed (Taiwan Emerging Stock Board, code 7856, listed September 17, 2025) semiconductor testing solutions provider founded in 2004 by Ms. Sue Lin. The company develops and manufactures probe cards (WAT, Logic/cantilever and vertical, LCD Driver, RF membrane, and TF-MLC thin-film), customized capital equipment for wafer testing and inspection (Hprobe magnetic testers, FIMS probe-mark depth measurement, AOI Toolkit, TEMIC Mars electron microscopes, D-Sensor Bridge Beam, EasyCool thermal management, Laser Cleaner), and engineering services for installation, maintenance, and troubleshooting.

Its technology stack centers on proprietary MEMS-based wafer probing (Probing System for Discrete Wafer, patented in Taiwan and the US), independently-developed membrane probe card manufacturing capability (the only such capability in Taiwan), AI-enabled defect detection (deep-learning algorithms in FIMS and AOI Toolkit), and integrations with the Advantest V93k ATE platform.

HTSI operates a direct enterprise field-sales model with wholly-owned offices and subsidiaries in Taiwan (Hsinchu HQ, Tainan), China (Suzhou), Japan (Kumamoto engineering, Tokyo sales), Malaysia (Penang), Singapore, and the United States. Revenue is hardware-driven from probe cards and customized products plus recurring engineering services (FY2024 mix: probe cards 24%, engineering services 44%, customized products 32%). Named qualified suppliers include TSMC (F7 and F15B facility awards) and a leading international foundry. The MJC (Micronics Japan) strategic equity partnership (May 2025) extends technical and customer access to a top-3 global probe card manufacturer.

Name

Hermes Testing Solutions Inc.

Legal name

漢民測試系統股份有限公司

Website

https://hermes-testing.com.tw

Company type

Public

Founded year

2004

Operating status

Operating

Headcount range

11–50 employees

Short description

Hermes Testing Solutions Inc. (HTSI) is a Taiwan-based, publicly listed semiconductor testing solutions provider that designs and manufactures probe cards, customized wafer-test equipment, and engineering services for global semiconductor foundries, fabless companies, and ATEs across Taiwan, China, Japan, Malaysia, Singapore, and the U.S.

Ownership category

akta.pro rank

Product category

Semiconductor Test Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515), Testing Laboratories and Services (54138)

SIC

Services-Testing Laboratories (8734), Instruments For Meas & Testing Of Electricity & Elec Signals (3825), Laboratory Analytical Instruments (3826)

akta.pro primary industry

Test Services (Wafer Sort, Final Test, Burn-In) (HDAHADAD)

akta.pro secondary industries

Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ), Failure Analysis, Reliability & Qualification Services (HDAHADAH)

Keywords

• Semiconductor probe cards
• Wafer acceptance testing
• Semiconductor test equipment
• Defect detection solutions
• Magnetic wafer probing

Headquarters

HQ city

Hsinchu City

HQ country

Taiwan

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Personnel, Technology or R&D, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Probe Cards and Consumables: Core probe card products including WAT, Logic, LCD Driver, RF, and membrane probe cards. Also includes probe cleaning materials and consumables.
2. Engineering Services: Equipment installation, relocation, modification, quarterly/annual maintenance, troubleshooting support for wafer probe stations.
3. Customized Products and Agency Equipment: Customized testing solutions including thermal modules, AOI tools, FIMS, and distributed equipment from partners like Advantest.

Pricing tiers

Go-to-market motion2 records

Distribution channels1 record

Marketing channels3 records

Core offering

Hermes Testing Solutions Inc. (HTSI) designs, manufactures, and sells semiconductor wafer testing solutions including probe cards (WAT, Logic, LCD Driver, RF membrane, TF-MLC), customized testing products (Hprobe magnetic ATE tester, FIMS probe mark measurement, AOI Toolkit, EasyCool thermal management, Laser Cleaner, D-Sensor Bridge Beam, TEMIC Mars X8 electron microscope), and engineering services for wafer probe stations. The company serves semiconductor foundries and fabless companies with localized sales and technical support across Taiwan, China, Japan, Singapore, Malaysia, and USA.

Product overview

Hermes Testing Solutions Inc. (HTSI) offers a comprehensive semiconductor testing solutions portfolio centered on probe cards and customized testing products. The core probe card product line includes five specialized categories: WAT device (wafer acceptance testing), Logic device (cantilever and vertical probe cards for logic ICs), LCD Driver device (fine-pitch LCD driver IC testing), RF device (membrane probe cards for high-frequency testing over 67GHz), and TF-MLC (thin-film probe cards on MLC substrate for HPC/AI applications). These probe cards are complemented by the In-House Service module providing localized SMT production and RF/SI/PI simulation. The customized product portfolio expands the offering with Hprobe (magnetic device wafer-level testing), FIMS (automated probe mark depth measurement with AI), AOI Toolkit (AI-powered defect detection compatible with Mitutoyo Quick Vision), TEMIC Mars X8/X8 Plus (electron microscope inspection), D-Sensor Bridge Beam (probe card flatness monitoring for Advantest platforms), EasyCool (thermal management/air cooling systems), and Laser Cleaner (non-contact probe cleaning). Engineering services including quarterly/annual machine maintenance, troubleshooting, and installation/relocation/modification round out the complete semiconductor testing ecosystem.

Differentiator

Problem solved

Functional benefit

Products and services

• WAT Device Probe Card Probe card for Wafer Acceptance Testing (WAT), providing optimal probe marks and minimal leakage current solutions for confirming wafer pass/fail status, used by semiconductor foundries and fabs.
• Logic Device Probe Card Probe cards designed for Logic IC testing, available in cantilever and vertical configurations, supporting high voltage and high current with compatibility across major test platforms, for logic chip foundries and IDMs.
• LCD Driver Device Probe Card Probe cards for LCD Driver IC testing with fine-pitch, Au bump, and high-temperature resistant capabilities using durable probe materials, for display driver IC manufacturers.
• RF Device Membrane Probe Card Membrane probe cards for RF testing applicable to GSG probe configurations exceeding 67GHz with exclusive tip design for stable test performance and extended probe card life, used in high-frequency RF semiconductor testing.
• TF-MLC Thin-Film Probe Card Thin-film probe cards on MLC substrate for HPC, IoT, and AI devices, applicable to fine-pitch solutions under 100μm with lower Dk/Df and better thermal resistance.
• In-House Service Localized SMT production line providing circuit design, RF/SI/PI simulation services, flying-probe testing, and PCB/loadboard printing services, for semiconductor manufacturers and test equipment builders.
• Hprobe Magnetic ATE Wafer Probing System High-performance magnetic ATE wafer level probing system with patented multidimensional magnetic field generator for MRAM (STT, SOT, VCMA) and magnetic sensors (TMR, GMR) characterization and testing, used by memory and sensor R&D teams.
• AOI Toolkit AI-powered defect detection and classification toolkit compatible with Mitutoyo Quick Vision, using advanced AI detection without parameter setup and HTSI data generator for small database training, for semiconductor inspection operations.
• FIMS Probe Mark Depth Measurement Equipment Fully automated probe mark depth measurement equipment using WLI White Light Interferometry with deep learning adaptive measurement (20nm Z resolution), integrated with Prober for semiconductor factory full automation, for wafer probing and yield management operations.
• TEMIC Mars X8 / X8 Plus Electron Microscope Large-object, high-resolution electron microscope supporting inspection of all types of 15-inch parts with 10mm depth of field, EDX component analysis, and patented static electricity removal method, used for semiconductor failure analysis and inspection.
• D-Sensor Bridge Beam Automatic monitoring system for probe card flatness and horizontal shift, determining whether to issue warnings to prevent test anomalies, designed for Advantest V93k platform, used by semiconductor fabs.
• EasyCool Thermal Management System Air cooling temperature control system for testing environments, maintaining test stability with temperature range 23–26°C and uniformity of ±0.15°C, including EasyCool Plus for CP and EasyCool Duo for WAT variants, used by semiconductor fabs.
• Laser Cleaner Probe Cleaning System Non-contact probe cleaning system using laser technology to prevent probe wear, extend probe card service life, reduce consumable cleaning product usage, and automate cleaning of various probe cards, used by semiconductor fabs.
• Engineering Services for Wafer Probe Stations Engineering services including equipment installation, relocation, modification, quarterly/annual maintenance, and troubleshooting support for wafer probe stations, served to semiconductor foundries and fabs.

Quantifiable outcome

• Q1 2026 revenue grew 122.58% YoY to NT$985 million
• +3 more outcomes

Named customers2 records

Segments2 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration2 records

AI capability4 records

Feature7 records

Partnerships

Seven partnerships are on record, tiered core and minor.

• Micronics Japan Co., Ltd. (MJC)coreStrategic or Co-development Partner · 9 May 2025Strategic capital investment partnership where MJC acquired shares in HTSI as a strategic partner. Since January 2023, MJC has been providing technical support to HTSI as an alternative procurement source for cantilever-type probe cards. This investment strengthens MJC's business operations in Taiwan, a global semiconductor manufacturing center.
• Sentec E&E Co., Ltd.minorStrategic or Co-development PartnerEstablished cooperative relationship in 2022 to jointly invest in Titan Asia Inc. for supply chain and operational synergies.
• Titan Asia Inc.minorStrategic or Co-development PartnerJoint venture with Sentec E&E established in 2022 for strategic business development.
• Advantest Taiwan Inc.coreTechnology or IntegrationReal-time force monitoring and alarm system integration partnership for D-Sensor Bridge Beam product. Provides integrated monitoring solutions for semiconductor testing equipment.
• Industrial Technology Research Institute (ITRI)minorStrategic or Co-development PartnerCollaborated on laser cleaning project for probe card cleaning technology development.
• Get Control, Inc.minorChannel Partner/ Reseller/ DistributorDistribution partnership for E84 sensor products for FA test market since 2016.
• Hermes-EpitekcoreStrategic or Co-development PartnerParent company relationship. Hermes-Epitek is the parent group that founded HTSI. HTSI is an affiliated company within the Hermes-Epitek ecosystem.

Scale indicators15 records

Recent moves14 records

Expansion highlights5 records

Broad incumbents

• KLA Corporation: Dominant wafer inspection/metrology incumbent whose portfolio overlaps with HTSI's defect detection offerings (FIMS, AOI Toolkit). Comparable end customers in semiconductor manufacturing.
• Cohu: Broad semiconductor test equipment incumbent (handlers, ATE, interface solutions) serving global foundries/IDMs. Comparable end-market exposure to HTSI's wafer testing focus.
• Advantest: Global leader in semiconductor automatic test equipment (ATE) and HTSI's integration partner for D-Sensor Bridge Beam (Advantest V93k platform). Operates broadly in semiconductor test vs. HTSI's focused probe card/test equipment niche.

Direct peers

• Technoprobe: Italian-headquartered leading probe card manufacturer with strong MEMS and vertical probe card positions serving global foundries. Directly competes with HTSI in advanced probe cards for logic/HPC/RF wafer testing.
• FormFactor: Global leader in probe cards (especially advanced MEMS/vertical probe cards) and probe stations for semiconductor wafer testing. Directly comparable to HTSI across the same core probe-card product line, serving the same foundry/fabless customers.
• Micronics Japan Co., Ltd. (MJC): Top-3 global probe card manufacturer and HTSI's strategic capital partner since May 2025. Operates in the same cantilever/vertical probe card categories as HTSI and provides the technology-transfer baseline for HTSI's in-house cantilever production line.
• MPI Corporation: Taiwan-based probe station and probe card supplier; competes in wafer-level testing equipment and shares customer overlap with HTSI across foundries and OSATs in Asia.
• Chunghwa Precision Test Tech (CHPT): Taiwan-based probe card manufacturer directly competing with HTSI in the same domestic foundry ecosystem (TSMC, UMC, etc.) and offering vertical and MEMS probe cards for advanced nodes.

Others

• Tokyo Electron: Japanese semiconductor production equipment giant providing adjacent wafer-processing and inspection tools. Comparable end-market (Asia-Pacific foundries) but not a direct probe card competitor; serves as a broader ecosystem reference point for HTSI's test-equipment expansion.

Emerging players

• Onto Innovation: Specialized inspection/metrology provider with product overlap in defect detection and yield management (HTSI's AOI Toolkit and FIMS address adjacent use cases). Comparable customer base of advanced fabs.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/hermes-testing-solutions-inc

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles7 records

Subsidiaries4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Hermes Testing Solutions Inc.