Lancens Technology

What Lancens Technology does

Lancens Technology (深圳市揽胜科技有限公司) is a privately-held Shenzhen-based designer and supplier of low-power wireless IoT modules and vertically integrated smart-home video solutions, founded in 2011. The company's core technology stack covers embedded firmware, a proprietary video cloud platform, and cross-platform mobile applications (the DingDing Smart / 叮叮智能 app for iOS and Android), with technical emphasis on microamp-level standby current, fast network wake (1 second), and 2-second push notification on battery-powered devices. Its product catalog spans low-power WiFi modules (LS3200M1, LS3861M3, LS806M1, LS600M1 with WiFi 6), Bluetooth Low Energy modules (BTLE220, LS2640M01, LS2640MR2), and complete PCBAs / solutions for video doorbells (LS1688), battery WiFi cameras (LS688M02), HD-screen video peephole viewers (LS308), and a 2024-launched baby monitor (LSV002), all backed by a global cloud with data centers in Frankfurt, Silicon Valley, Singapore, Dubai, and multiple Chinese regions.

Lancens sells exclusively B2B into OEMs and ODMs — primarily smart lock manufacturers, battery camera makers, and broader IoT device manufacturers — through three regional direct-sales contacts in South China, East China, and headquarters, plus an English-language website for international inquiries. Revenue is generated through hardware module sales (PCBAs and bare modules) bundled with firmware/SDK access, plus cloud service and mobile-app services sold as part of integrated solution packages; pricing is not publicly disclosed. The company's stated differentiator is 15+ years of "specialized, refined, and innovative" R&D in low-power wireless communications, with claimed patents on wireless devices and systems, and a vertical-integration value proposition that lets traditional lock and camera OEMs add WiFi video intercom and cloud connectivity without building RF, cloud, and app stacks internally.

The founder and General Manager is Liu Zongzhang (刘宗长), and there is no public record of institutional investment, parent company, M&A activity, or named anchor customers. Operating geographies span China, the US, Germany, Singapore, and the UAE through the cloud platform footprint and named website markets, but the company's underlying revenue base, headcount, and equity structure are not disclosed in available sources.

Name

Lancens Technology

Legal name

深圳市揽胜科技有限公司

Website

https://lancens.com

Company type

Private

Founded year

2011

Operating status

Operating

Short description

Lancens Technology is a Shenzhen-based, privately-held IoT module and smart-home video solution provider. Founded in 2011, it sells low-power WiFi and BLE modules plus PCBAs and cloud/app bundles to smart lock, video doorbell, battery camera, and IoT device OEMs globally.

Ownership category

akta.pro rank

Product category

Wireless IoT Modules

NAICS

Other Communications Equipment Manufacturing (33429)

SIC

Computer Communications Equipment (3576)

akta.pro industry

PRIMARYHDACAHAG

Network Adapters (Ethernet/Wi‑Fi/Bluetooth)

Hardware, Technology & Telecom/Computing Hardware & Peripherals/Docking Stations, Adapters & Connectivity Peripherals

SECONDARYHSAPAQAG

Home Networking & Connected Home Infrastructure (Wi‑Fi Mesh, Routers, Matter/Thread/Zigbee Bridges)

Home & Personal Services/Residential Renovation Services/Smart Home & Consumer IoT

Keywords

• Low-power wireless modules
• IoT WiFi modules
• Bluetooth BLE modules
• Smart lock solutions
• Video doorbell PCBA

Headquarters

HQ city

Shenzhen

HQ country

China

HQ region

Asia

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Infrastructure, Marketing or Sales, Operations

Revenue model

1. Wireless module sales: Sale of low-power WiFi, BLE, and IoT wireless modules (LS3200M1, LS600M1, LS806M1, LS3861M3, LS2640M01, BTLE220 series) to smart lock, doorbell, and camera OEMs as PCBA or bare modules.
2. Smart video device solutions: Complete solution sales including PCBA modules, firmware, cloud services, and app integration for video doorbells, battery cameras, and smart peephole products. Solutions include hardware design files, SDK, and cloud platform access.
3. Cloud service and APP services: Cloud platform services and mobile app (叮叮智能) providing video streaming, cloud storage, P2P communication, and device management as part of the integrated solution package.

Go-to-market motion1 record

Distribution channels4 records

Marketing channels4 records

Core offering

Lancens Technology designs and manufactures ultra-low-power wireless IoT communication modules (WiFi and BLE) and integrated smart-home device solutions for OEMs. Its offerings span PCBA modules, bare wireless modules, video doorbell and battery camera reference solutions, a proprietary video cloud service platform, and companion mobile applications, serving smart lock, video doorbell, and battery camera manufacturers seeking rapid integration of wireless video/audio and cloud features.

Product overview

Lancens Technology (深圳市揽胜科技有限公司) is a 15-year-old IoT wireless communication company specializing in low-power wireless solutions for smart home devices including smart locks, video doorbells, battery cameras, and door viewers. The company offers a modular product portfolio comprising low-power WiFi modules (LS3200M1, LS3861M3, LS806M1, LS600M1 supporting WiFi 6), Bluetooth modules (BTLE220, BTLE220-A, LS2640M01, LS2640MR2), and an IoT WiFi module (LS87F03). These wireless modules serve as the core technology layer powering finished device solutions including a low-power WiFi video doorbell (LS1688), 1080P battery WiFi camera (LS688M02), HD-screen video intercom door viewer (LS308), and Baby monitor (LSV002). The product line is supported by a proprietary video cloud service platform with global data centers, and companion mobile apps (叮叮智能 DingDing Smart for iOS and Android) for device management, family protection, and remote monitoring.

Differentiator

Problem solved

Functional benefit

Brands

• 叮叮智能 (DingDing Smart): Mobile application brand for Lancens wireless low-power products, used for office, home security, outdoor monitoring, communication alerts, video doorbells, and remote management and control.

Products and services

• Low-power WiFi Module LS3200M1 Low-power WiFi module using TI CC3200 chip with ARM Cortex-M4 80MHz CPU, 256KB RAM, standby current of 275µA, supporting 802.11b/g/n, hardware AES/DES/3DES/SHA/MD5 encryption, parallel camera interface, and UDP throughput up to 16Mbps, intended for OEM integration into smart home and IoT devices.
• Low-power WiFi Module LS3861M3 Low-power WiFi module with 32-bit high-performance microprocessor, hardware encryption engine (SHA256/HMAC-SHA256/ECC), IEEE 802.11b/g/n, IPv4/IPv6 support, ultra-deep sleep current of 45µA, transmit power up to 19dBm, and receive sensitivity down to -97dBm, for OEM IoT device integration.
• Low-power WiFi Module LS806M1 Low-power WiFi module with 32-bit 160MHz microprocessor, 320KB SRAM, 160KB ROM, 2MB Flash, hardware encryption (AES/DES/3DES/MD5/SHA/Secure Boot), WPA/WPA2/WPA3, BLE 5.0, ultra-sleep current of 10µA, and operating voltage 2.5-5.5V, for OEM IoT device integration.
• Low-power WiFi 6 Module LS600M1 Low-power WiFi module supporting 802.11b/g/n/ax (WiFi 6), 22nm chip design with 32-bit 240MHz processor, 512KB SRAM, 48KB ROM, 32KB cache, 2MB Flash, hardware AES256 encryption, BLE 5.1, and ultra-sleep current of 3mA @DTIM=1, for OEM IoT device integration.
• IoT WiFi Module LS87F03 IoT WiFi module using Realtek 8711AF chip, supporting 802.11b/g/n with up to 150Mbps receive rate at 40MHz, compatibility with Amazon Cloud and Alibaba Cloud, WEP/WPA/WPA2/WPS encryption, 8.16KHz PCM sampling, and built-in 1MB ROM and 2.5MB RAM, for OEM IoT device integration.
• Bluetooth 4.0 Module BTLE220-A Bluetooth 4.0 module using TI CC2541 chip, supporting transparent transmission (UART) or direct drive mode without external MCU, transmit power +0dBm, receive sensitivity -94dBm, sleep current 0.4µA, transmission distance up to 30m line-of-sight, dimensions 18.1×12.05×2.3mm, for OEM wireless connectivity integration.
• Bluetooth 4.0 Module BTLE220 Bluetooth 4.0 module using TI CC2540/CC2541 chip, BQB certified, supporting UART and USB interfaces, adjustable transmit power +4dBm to -23dBm, receive sensitivity -93dBm, transmission distance up to 50m, conforming to BQB and RoHS standards, for OEM lock and IoT device integration.
• Bluetooth 4.1 BLE Module LS2640M01 Bluetooth 4.1 BLE module with ARM Cortex-M3 + ARM Cortex-M0 + coprocessor tri-core SOC architecture, master/slave mode support, integrated BLE protocol stack (GAP/GATT/L2CAP/SMP), TX power +5dBm, RX sensitivity -97dBm, deep sleep current 1µA, meeting ETSI EN 300 328 and FCC CFR47 Part 15 standards, for OEM low-power smart lock and IoT integration.
• Bluetooth 4.2/5 Module LS2640MR2 Bluetooth 4.2/5 module listed in the Lancens product catalog for OEM wireless connectivity integration.
• Low-power WiFi Video Doorbell Solution LS1688 Ultra-low-power WiFi video doorbell solution with 1-second quick network connection, 2-second push notification, two-way audio intercom, PIR human body thermal infrared detection, H.264 video compression at 800×600@15FPS, remote unlock, and 3.7V lithium battery with 120-day standby on 2000mAh, designed as a PCBA/complete solution for smart lock and doorbell OEMs.
• Battery WiFi Camera Solution LS688M02 1080P low-power WiFi battery camera solution offered as PCBA or complete solution, with 400µA networked standby, 1s network connection, 2s push notification, PIR human thermal detection, IR night vision (850nm LED), Sony IMX323 CMOS 2MP sensor, TF card storage, remote wake-up, and built-in antenna with 50m open-air range, for battery camera OEM product development.
• Baby Monitor Solution LSV002 Baby monitor/care device solution using low-power WiFi+RF dual-mode transmission, 5-inch display receiver, pairing with up to 4 monitoring units, motion detection, sound detection, temperature measurement, two-way audio intercom, night vision, micro SD card local storage and remote recording, available as PCBA or complete solution including SDK, hardware documentation, and cloud services for OEM integration.
• HD Screen Video Intercom Peephole Module LS308 HD screen video intercom door viewer/peephole module with automatic bilingual screen switching, global weather display, temporary password functions, remote unlock, P2P real-time audio/video intercom, battery level detection, support for 4.0–10 inch TN/IPS LCD screens, 4200mAh battery lasting 6 months, and dual-mode network standby under 400µA, for OEM smart lock peephole integration.
• Video Cloud Service Platform Video cloud service platform supporting custom development, distributed globally with data centers in Europe (Frankfurt), US (Silicon Valley), China (North/East/South/West regions), Asia Pacific (Singapore), and Middle East (Dubai), supporting NAT P2P penetration, 100+ service clusters for instant video communication, millions-level concurrent streaming and cloud storage, user management, and big data analytics, sold as part of the integrated solution package for OEM customers.
• Smart Lock Video Intercom Solution Smart lock video intercom solution featuring front and rear dual cameras, three-way intercom (indoor, outdoor, and APP), family call functionality, support for LCD screens TN/IPS 4.0–5 inch, operating temperature -20~60°C, provided as a vertical solution for smart lock OEMs.
• Wireless Peephole Display Solution Wireless door viewer display solution with H.264 video encoding at 1920×1080 resolution, supports local area network operation without external network and direct connection without WiFi router, USB Type-C charging, time and WiFi signal display, and weather information, for smart lock OEM display unit integration.
• Dual-mode VBM Solution Dual-mode VBM solution supporting full VBM scheme cooperation and open APP SDK for self-developed customer applications, offered as an OEM integration package.
• DingDing Smart (叮叮智能) Mobile Application - iOS Mobile app for wireless low-power products supporting office, home security, outdoor monitoring, communication alerts, video doorbells, and remote device management, with two-way audio/video communication using telecom-grade voice processing, device management, family protection, message records, and user profile center; iOS version available.
• DingDing Smart (叮叮智能) Mobile Application - Android Android version of the DingDing Smart mobile application for Lancens smart home devices including cameras, door locks, and video doorbells, supporting remote monitoring, two-way communication, and family/device management.
• Bluetooth Hidden Lock Android App Android app for Bluetooth invisible lock remote control and management, companion to Lancens Bluetooth hidden lock products.

Quantifiable outcome

• WiFi module standby current as low as 275uA (LS3200M1 LPDS mode), enabling months of battery life in connected devices
• +4 more outcomes

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Scale indicators5 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• Realtek Semiconductor: Taiwanese fabless semiconductor leader whose Ameba, RTL8710, and WiFi/BLE chipsets (including the Realtek 8711AF used in Lancens' LS87F03 module) power many WiFi IoT modules. Realtek operates broadly across networking, audio, and PC peripherals but overlaps materially with Lancens in the WiFi IoT module supply chain.
• Qualcomm: US semiconductor leader providing WiFi/BLE/Thread/Matter silicon platforms for IoT OEMs through its Connectivity and IoT businesses. Sits upstream of, and competes conceptually with, Lancens' WiFi/BLE IoT connectivity offerings in the broader connected device ecosystem.
• Texas Instruments: US semiconductor major whose CC3200 and CC2540/CC2541 wireless platforms are the silicon foundation for multiple Lancens modules. TI is the upstream incumbent supplier in industrial and consumer WiFi/BLE wireless.

Direct peers

• Espressif Systems: Shanghai-headquartered designer of WiFi and WiFi/BLE SoCs (ESP32, ESP8266) and modules that compete directly with Lancens' WiFi/BLE module portfolio across the same smart-home IoT OEM channel. Both companies sell PCB modules targeting battery-powered connected devices.
• Tuya Smart: Tuya offers an IoT PaaS that combines WiFi/BLE modules with a global cloud platform and developer apps — a near-identical stack architecture to Lancens' module + DingDing Smart cloud + DingDing Smart app. Tuya is the dominant scaled competitor in OEM-enablement for smart home devices globally.
• Shenzhen Hi-Link Electronic: Shenzhen-based WiFi module and IoT connectivity specialist serving smart home, industrial, and consumer OEMs. Directly comparable product line (HLK-WFi modules) and overlapping customer base of Chinese OEM device makers.
• MXCHIP (Shanghai MXCHIP Information Technology): China-based WiFi/BLE module and embedded IoT platform vendor targeting smart home, industrial, and appliance OEMs. MXCHIP is a head-to-head competitor in the WiFi module market and overlaps in low-power wireless for connected devices.

Others

• MediaTek: Taiwanese semiconductor giant whose AIROHA Technology subsidiary supplies WiFi and BLE SoCs for smart home, IoT, and router applications. A broad incumbent whose wireless connectivity silicon competes at the upstream layer used by Lancens and other module vendors.
• Sonoff (ITEAD Intelligent Systems): Shenzhen-based smart home device maker (WiFi switches, plugs, sensors) that historically built its own wireless modules/connectivity rather than sourcing Lancens-grade solutions. Adjacent rather than directly competing in the OEM module space.

Emerging players

• Bouffalo Lab: Shanghai-based fabless designer of RISC-V WiFi/BLE SoCs (BL602, BL616) and reference modules targeting battery-powered IoT. An emerging competitor in the same low-power wireless module niche Lancens occupies.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat3 records

Key risks6 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Lancens Technology