Developer docs
API playgroundTry for free, no card

Search company profiles

Kandou

Full company profile

uuid00gp8xu

Namestring
Kandou
Legal namestring
Kandou Bus, S.A.
Websiteurl
kandou.ai
Company typeenum
Private
Founded yearint
2011
Short descriptiontext

Kandou AI is a fabless semiconductor company that designs high-speed connectivity chips and IP — including retimers, SerDes, and chiplet interconnects — using proprietary Copper MIMO and Chord Signaling technology, serving hyperscale AI infrastructure, PC OEMs, and semiconductor manufacturers.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
101–250
akta.pro rankint
HeadquartersLausanne, Switzerland
HQ citystring
Lausanne
HQ countrystring
Switzerland
HQ regionstring
Europe
Markets served

Serves global market

Offices6 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
high-speed interconnect IP, semiconductor retimer chips, SerDes IP licensing, AI fabric connectivity, chiplet interconnect solutions
Industry4 codes
1Silicon IP Subsystems & Chiplet IP (Die-to-Die, UCIe, NoC, I/O chiplets)
CodeHDAHAFAHPrimaryYes
2Compute & Acceleration ICs (CPU/GPU/AI/FPGA/ASIC)
CodeHDAHABACPrimaryNo
3Memory Interface & PHY ICs (DDR/HBM/SerDes PHY)
CodeHDAHAKAEPrimaryNo
4AI Hardware IP & Chiplet/Packaging for Accelerators (EDA/IP, advanced packaging)
CodeHDAAAAALPrimaryNo
NAICS code2 codes
  • Semiconductor and Other Electronic Component Manufacturing33441
  • Semiconductor and Other Electronic Component Manufacturing3344
SIC code1 code
  • Computer Communications Equipment3576
Product category
Semiconductor Connectivity IP
GTM motion3 records

Each record includes

Type, Description, Source

Revenue model3 records
1Semiconductor Chip Sales
TypeHardware Sales
Description

Fabless semiconductor company selling physical chips including PCIe retimers (Regli), USB4 retimers (Matterhorn), and PCIe switches (Zetti). Revenue from unit sales to OEM customers.

kandou.ai
2IP Licensing
TypeLicensing Royalties
Description

Licensing of proprietary IP including Glasswing chiplet interconnect technology, Tigerwing SerDes, and Chord Signaling technology to semiconductor manufacturers and system designers.

kandou.ai
3AI Fabric Solutions
TypeHardware Sales
Description

Chiplet-based AI fabric products built using Copper MIMO links for AI system builders. Next-generation products targeting AI infrastructure and rack connectivity.

kandou.ai
Marketing channels7 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels2 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure
Pricing details1 tier
1Enterprise semiconductor products with custom pricing
ModelOtherBilling cadenceMulti-year contract
Notes

Quote-based / Not publicly disclosed. Products include Regli PCIe retimers, Matterhorn USB4 retimers, Glasswing IP solutions, Zetti PCIe switches, and AI fabric products.

kandou.ai
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Brand1 of 7 records shown
1Regli
Description

Industry-leading PCIe 5.0 and CXL 2.0 retimer for signal optimization in data center applications.

kandou.ai
+6 more records
Core offering1 text field

Kandou AI is a fabless semiconductor company that designs and sells high-speed wired connectivity chips and SerDes IP for AI infrastructure, data center, and consumer electronics applications. Its product portfolio includes PCIe 5.0/CXL 2.0 retimers (Regli), USB4 retimers (Matterhorn), PCIe Gen 5 switches (Zetti), chip-to-chip SerDes IP (Glasswing, Tigerwing), error-correction IP (DIMMGuard), and PCIe diagnostics software (Besso), all built on its proprietary Copper MIMO and Chord Signaling technology. The company also licenses its silicon IP to semiconductor manufacturers and supplies chiplet interconnect building blocks for hyperscale AI cluster builders.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 8 values shown
  • Reduces AI inference system costs by up to 12x
+7 more records
Product overview1 text field

Kandou AI is a fabless semiconductor design company offering a portfolio of high-speed connectivity solutions for AI infrastructure. The core portfolio includes Regli (PCIe 5.0/CXL 2.0 retimer), Matterhorn (USB4 retimer), Glasswing (chip-to-chip SerDes IP using CNRZ-5 Chord signaling), Besso (diagnostic software), and Zetti (PCIe Gen 5 switch). All products are powered by proprietary Copper MIMO technology. Next-generation offerings include Tigerwing (260 Gbps chip-to-chip interconnect) and DIMMGuard (error correction IP). The company leverages Tier 1 supply chain partnerships with TSMC for fabrication and ASECL Taiwan for assembly/testing, having shipped over 20 million silicon units to date.

Product and service1 record
1Regli
Scale indicator8 records

Each record includes

Type, Value, Description, Source

Partnership4 partners
Strategic tierStrategicTypeStrategic or Co-development PartnerAnnounced on2026-07-14
Description

Strategic IP licensing agreement announced July 2026. Kandou AI licensed Baya's WeaveIP fabric and WeaverPro software platform for developing next-generation 448G copper AI connectivity platforms. Collaboration aims to address AI memory wall problem combining Copper MIMO with Baya's software-defined fabric platform.

Strategic tierCoreTypeTechnology or Integration
Description

Manufacturing partner for over a decade. Kandou AI utilizes TSMC's 4nm and leading-edge process nodes. TSMC's unique chiplet stitching allows up to 40 chiplets in one package. Over decade of partnership utilizing expertise beyond industry standards.

3ASECL Taiwan
Strategic tierCoreTypeTechnology or Integration
Description

Assembly and testing partner. Performs electrical tests on all die surpassing industry thresholds, flip-chip CSP assembly, and 100% parametrical and functional tests on every packaged part with random QA testing.

kandou.ai
Strategic tierPrimaryTypeChannel Partner/ Reseller/ Distributor
Description

Franchised distributor established 1999. Distributes Kandou products for data networking and storage, virtualization, cloud, and IoT markets. Located at epsglobal.com/manufacturers/kandou.

Recent move8 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight6 records

Each record includes

Type, Description

Peers10 records
TypeDirect peer
Description

Specialist in high-speed memory interface and SerDes IP, including HBM/GDDR PHY and chiplet subsystems. Overlaps with Kandou's DIMMGuard, Glasswing, and Tigerwing IP offerings for memory and chip-to-chip connectivity.

TypeDirect peer
Description

Fabless supplier of high-speed SerDes, chiplet IP, and connectivity silicon targeting AI, networking, and storage. Directly comparable in product portfolio, IP licensing model, and hyperscaler customer focus.

TypeBroad incumbent
Description

Largest EDA and silicon IP vendor with broad multi-market SerDes, UCIe, and memory PHY IP. Strategic investor in Kandou's Series A but also a competitor in the IP licensing market.

TypeEmerging player
Description

Emerging IP and software-defined fabric company whose WeaveIP fabric and WeaverPro platform were licensed by Kandou in July 2026 for 448G copper AI connectivity — a strategic co-development partner with adjacent IP exposure to the same hyperscaler market.

TypeDirect peer
Description

Fabless supplier of high-speed SerDes, retimers, and AECs for cloud, AI, and hyperscale data centers. Competes head-to-head with Kandou in optical/electrical connectivity for AI fabric and rack-scale deployments.

TypeDirect peer
Description

Fabless semiconductor company focused on connectivity/retimer ICs and fabric solutions for AI/cloud infrastructure, with Aries retimers and Taurus/Aries Smart Cable Modules. Direct competitor in hyperscaler AI SerDes and PCIe retimer sockets where Kandou also competes.

TypeBroad incumbent
Description

EDA and IP vendor offering a growing portfolio of SerDes, memory, and connectivity IP. Strategic investor in Kandou and customer/supplier partner (Kandou uses Cadence EDA), while also competing in select IP categories.

TypeBroad incumbent
Description

Diversified incumbent with the dominant SerDes, custom silicon, and networking silicon franchises for hyperscalers. Provides the primary competitive benchmark across Ethernet, PCIe, and now AI fabric.

TypeDirect peer
Description

Major fabless supplier of SerDes, custom silicon, and chiplet platforms; a named Kandou Glasswing customer and a direct competitor in custom-silicon and interconnect IP for data center and AI workloads.

TypeBroad incumbent
Description

Mixed-signal and connectivity IC vendor with retimer, PCIe, and signal-conditioning product lines serving industrial, automotive, and data center customers. Broad incumbent with overlap in Kandou's Regli/Matterhorn PCIe/USB retimer space.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses4 records

Each record includes

Headline, Details, Source

Competitive moat5 records

Each record includes

Type, Details

Key risks6 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers3 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment5 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile3 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
Yes
API detail
Has APIbool
No

Docs URL, Description

Integration1 record

Each record includes

Title, Type, Description, Source

AI maturity
App detail

Has app

Feature9 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles9 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
Compliance1 record

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds13 records

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors20 records

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Kandou

Semiconductor Connectivity IPkandou.ai

Kandou AI is a fabless semiconductor company that designs high-speed connectivity chips and IP — including retimers, SerDes, and chiplet interconnects — using proprietary Copper MIMO and Chord Signaling technology, serving hyperscale AI infrastructure, PC OEMs, and semiconductor manufacturers.

Kandou firmographics

Firmographics
Name
Kandou
Legal name
Kandou Bus, S.A.
Website
https://kandou.ai
Company type
Private
Founded year
2011
Operating status
Operating
Headcount range
101–250 employees
Short description
Kandou AI is a fabless semiconductor company that designs high-speed connectivity chips and IP — including retimers, SerDes, and chiplet interconnects — using proprietary Copper MIMO and Chord Signaling technology, serving hyperscale AI infrastructure, PC OEMs, and semiconductor manufacturers.
Ownership category
akta.pro rank

Kandou industry classification

Industry
Product category
Semiconductor Connectivity IP
NAICS
Semiconductor and Other Electronic Component Manufacturing (33441), Semiconductor and Other Electronic Component Manufacturing (3344)
SIC
Computer Communications Equipment (3576)
akta.pro primary industry
Silicon IP Subsystems & Chiplet IP (Die-to-Die, UCIe, NoC, I/O chiplets) (HDAHAFAH)
akta.pro secondary industries
Compute & Acceleration ICs (CPU/GPU/AI/FPGA/ASIC) (HDAHABAC), Memory Interface & PHY ICs (DDR/HBM/SerDes PHY) (HDAHAKAE), AI Hardware IP & Chiplet/Packaging for Accelerators (EDA/IP, advanced packaging) (HDAAAAAL)

Keywords

  • High-speed interconnect IP
  • Semiconductor retimer chips
  • SerDes IP licensing
  • AI fabric connectivity
  • Chiplet interconnect solutions

Where Kandou is headquartered

Location

Headquarters

HQ city
Lausanne
HQ country
Switzerland
HQ region
Europe

Offices6 records

Markets served

Kandou business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure

Revenue model

  1. Semiconductor Chip Sales: Fabless semiconductor company selling physical chips including PCIe retimers (Regli), USB4 retimers (Matterhorn), and PCIe switches (Zetti). Revenue from unit sales to OEM customers.
  2. IP Licensing: Licensing of proprietary IP including Glasswing chiplet interconnect technology, Tigerwing SerDes, and Chord Signaling technology to semiconductor manufacturers and system designers.
  3. AI Fabric Solutions: Chiplet-based AI fabric products built using Copper MIMO links for AI system builders. Next-generation products targeting AI infrastructure and rack connectivity.

Pricing tiers

ModelBillingPrice
OtherMulti-year contractEnterprise semiconductor products with custom pricing

Go-to-market motion3 records

Distribution channels2 records

Marketing channels7 records

Kandou product offering

Product offering

Core offering

Kandou AI is a fabless semiconductor company that designs and sells high-speed wired connectivity chips and SerDes IP for AI infrastructure, data center, and consumer electronics applications. Its product portfolio includes PCIe 5.0/CXL 2.0 retimers (Regli), USB4 retimers (Matterhorn), PCIe Gen 5 switches (Zetti), chip-to-chip SerDes IP (Glasswing, Tigerwing), error-correction IP (DIMMGuard), and PCIe diagnostics software (Besso), all built on its proprietary Copper MIMO and Chord Signaling technology. The company also licenses its silicon IP to semiconductor manufacturers and supplies chiplet interconnect building blocks for hyperscale AI cluster builders.

Product overview

Kandou AI is a fabless semiconductor design company offering a portfolio of high-speed connectivity solutions for AI infrastructure. The core portfolio includes Regli (PCIe 5.0/CXL 2.0 retimer), Matterhorn (USB4 retimer), Glasswing (chip-to-chip SerDes IP using CNRZ-5 Chord signaling), Besso (diagnostic software), and Zetti (PCIe Gen 5 switch). All products are powered by proprietary Copper MIMO technology. Next-generation offerings include Tigerwing (260 Gbps chip-to-chip interconnect) and DIMMGuard (error correction IP). The company leverages Tier 1 supply chain partnerships with TSMC for fabrication and ASECL Taiwan for assembly/testing, having shipped over 20 million silicon units to date.

Differentiator

Problem solved

Functional benefit

Brands

  • Regli: Industry-leading PCIe 5.0 and CXL 2.0 retimer for signal optimization in data center applications.
  • Matterhorn
  • Glasswing
  • Besso
  • Tigerwing
  • Zetti
  • DIMMGuard

Products and services

  • Regli

Quantifiable outcome

  • Reduces AI inference system costs by up to 12x
  • +7 more outcomes

Companies that use Kandou

Customer profile

Named customers3 records

Segments5 records

Ideal customer profiles3 records

Kandou technology and API

Technology

Technology focussed Yes

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Integration1 record

Feature9 records

Kandou partnerships and signals

Strategic signal

Partnerships

Four partnerships are on record, tiered strategic, core and primary.

  • Baya SystemsstrategicStrategic or Co-development Partner · 14 July 2026Strategic IP licensing agreement announced July 2026. Kandou AI licensed Baya's WeaveIP fabric and WeaverPro software platform for developing next-generation 448G copper AI connectivity platforms. Collaboration aims to address AI memory wall problem combining Copper MIMO with Baya's software-defined fabric platform.
  • TSMCcoreTechnology or IntegrationManufacturing partner for over a decade. Kandou AI utilizes TSMC's 4nm and leading-edge process nodes. TSMC's unique chiplet stitching allows up to 40 chiplets in one package. Over decade of partnership utilizing expertise beyond industry standards.
  • ASECL TaiwancoreTechnology or IntegrationAssembly and testing partner. Performs electrical tests on all die surpassing industry thresholds, flip-chip CSP assembly, and 100% parametrical and functional tests on every packaged part with random QA testing.
  • EPS GlobalprimaryChannel Partner/ Reseller/ DistributorFranchised distributor established 1999. Distributes Kandou products for data networking and storage, virtualization, cloud, and IoT markets. Located at epsglobal.com/manufacturers/kandou.

Scale indicators8 records

Recent moves8 records

Expansion highlights6 records

Kandou competitors and assessment

Company assessment

Direct peers

  • Rambus: Specialist in high-speed memory interface and SerDes IP, including HBM/GDDR PHY and chiplet subsystems. Overlaps with Kandou's DIMMGuard, Glasswing, and Tigerwing IP offerings for memory and chip-to-chip connectivity.
  • Alphawave Semi: Fabless supplier of high-speed SerDes, chiplet IP, and connectivity silicon targeting AI, networking, and storage. Directly comparable in product portfolio, IP licensing model, and hyperscaler customer focus.
  • Credo Technology: Fabless supplier of high-speed SerDes, retimers, and AECs for cloud, AI, and hyperscale data centers. Competes head-to-head with Kandou in optical/electrical connectivity for AI fabric and rack-scale deployments.
  • Astera Labs: Fabless semiconductor company focused on connectivity/retimer ICs and fabric solutions for AI/cloud infrastructure, with Aries retimers and Taurus/Aries Smart Cable Modules. Direct competitor in hyperscaler AI SerDes and PCIe retimer sockets where Kandou also competes.
  • Marvell Technology: Major fabless supplier of SerDes, custom silicon, and chiplet platforms; a named Kandou Glasswing customer and a direct competitor in custom-silicon and interconnect IP for data center and AI workloads.

Broad incumbents

  • Synopsys: Largest EDA and silicon IP vendor with broad multi-market SerDes, UCIe, and memory PHY IP. Strategic investor in Kandou's Series A but also a competitor in the IP licensing market.
  • Cadence Design Systems: EDA and IP vendor offering a growing portfolio of SerDes, memory, and connectivity IP. Strategic investor in Kandou and customer/supplier partner (Kandou uses Cadence EDA), while also competing in select IP categories.
  • Broadcom: Diversified incumbent with the dominant SerDes, custom silicon, and networking silicon franchises for hyperscalers. Provides the primary competitive benchmark across Ethernet, PCIe, and now AI fabric.
  • Microchip Technology: Mixed-signal and connectivity IC vendor with retimer, PCIe, and signal-conditioning product lines serving industrial, automotive, and data center customers. Broad incumbent with overlap in Kandou's Regli/Matterhorn PCIe/USB retimer space.

Emerging players

  • Baya Systems: Emerging IP and software-defined fabric company whose WeaveIP fabric and WeaverPro platform were licensed by Kandou in July 2026 for 448G copper AI connectivity — a strategic co-development partner with adjacent IP exposure to the same hyperscaler market.

Market position

Strengths5 records

Weaknesses4 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

Kandou social profiles

Digital presence

Kandou compliance and trust

Trust signal

Compliance1 record

Kandou financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Kandou leadership team

Management profile

Number of profiles

Profiles9 records

Kandou funding detail

Funding detail

Funding overview

Funding rounds13 records

Investors20 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Kandou M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Kandou

What does Kandou do?

Kandou AI is a fabless semiconductor company that designs and sells high-speed wired connectivity chips and SerDes IP for AI infrastructure, data center, and consumer electronics applications. Its product portfolio includes PCIe 5.0/CXL 2.0 retimers (Regli), USB4 retimers (Matterhorn), PCIe Gen 5 switches (Zetti), chip-to-chip SerDes IP (Glasswing, Tigerwing), error-correction IP (DIMMGuard), and PCIe diagnostics software (Besso), all built on its proprietary Copper MIMO and Chord Signaling technology. The company also licenses its silicon IP to semiconductor manufacturers and supplies chiplet interconnect building blocks for hyperscale AI cluster builders.

Is Kandou a public or private company?

Kandou is a private company. It is classified as venture growth investor backed and is currently operating.

When was Kandou founded?

Kandou was founded in 2011. It employs 101 to 250 people.

Where is Kandou based?

Kandou is headquartered in Lausanne, Switzerland, in the Europe region.

How does Kandou make money?

Three revenue lines are on record. Semiconductor Chip Sales are the primary driver. The others are IP Licensing and AI Fabric Solutions.

Who are Kandou's main competitors?

Direct peers on record are Rambus, Alphawave Semi, Credo Technology, Astera Labs and Marvell Technology. Broad incumbents are Synopsys, Cadence Design Systems, Broadcom and Microchip Technology. Baya Systems is listed as an emerging player.

Does Kandou have an API?

No public API is recorded for Kandou.

What industry is Kandou in?

Kandou's product category is Semiconductor Connectivity IP. Its primary akta.pro industry code is HDAHAFAH, Silicon IP Subsystems & Chiplet IP (Die-to-Die, UCIe, NoC, I/O chiplets), with a secondary code of HDAHABAC, Compute & Acceleration ICs (CPU/GPU/AI/FPGA/ASIC). Its NAICS code is 33441 and its SIC code is 3576.

Unlock the full company data

50 free credits on sign-up, no credit card required.

Contact sales
Live signals
HpcwireSince 1987 – Covering the Fastest Computers in the World and the People Who Run ThemBaya Systems and Kandou AI announced a strategic IP licensing agreement on July 14, 2026, under which Kandou AI licensed Baya's WeaveIP fabric and WeaverPro software platform for developing next-generation 448G copper AI connectivity platforms. The collaboration aims to address the AI "memory wall" problem, where memory bandwidth has failed to keep pace with compute scaling that has grown 60,000x over two decades versus just 30x for interconnect. Kandou AI's Copper MIMO technology combined with Baya's software-defined fabric platform is expected to accelerate development cycles and enable faster, denser, and more cost-effective AI systems.Pulse 2.0Kandou AI: $225 Million Raised For AI Connectivity And Memory Bottleneck SolutionsKandou AI, a fabless semiconductor design company focused on high-speed connectivity solutions for AI infrastructure, announced it has raised $225 million in an oversubscribed Series A funding round led by Maverick Silicon, with participation from SoftBank Group Corp., Synopsys, Cadence Design Systems, and Alchip Technologies. The funding will support scaling production of AI connectivity chips, expanding customer relationships with hyperscale and enterprise buyers, and accelerating development of next-generation chip and IP solutions designed to address data movement bottlenecks in AI systems. The company has already shipped over 20 million silicon units using its technology and recently completed tapeout of next-generation SerDes technology while expanding its global engineering footprint with a new design center in Hyderabad.The Next WebRecap: Europe’s top funding rounds this week (23–29 March)This article summarizes European technology funding rounds from March 23–29, covering 20 companies across sectors including semiconductors, AI, biotech, space, and defense that collectively raised hundreds of millions in venture capital and EU grants. Notable rounds include Kandou AI's $225 million Series A for copper interconnect technology, Granola's $125 million Series C valuing it at $1.5 billion, and PAVE Space's $40 million seed for orbital transfer vehicles. The article suggests a broader trend of European investors funding hard technology infrastructure in space, defense, and deep materials science without waiting for US validation.Tech.euKandou AI bags $225M Series A, Kobalt is sold for €1.3B, and meet Europe's Microsoft alternativeThis article summarizes European tech funding activity, tracking over 55 funding deals worth more than €850 million and more than 15 exits and M&A transactions across the region over a single week. Notable deals include Kandou AI raising a $225 million Series A round and Kobalt being acquired for €1.3 billion, alongside multiple fund launches by Air Street Capital ($232 million), futurepresent ($300 million), and Credo Ventures ($88 million). The roundup also covers strategic moves such as Unifly's acquisition of EuroUSC-Benelux and the opening of Europe's first industrial-scale battery recycling plant by tozero.FinSMEsKandou AI Closes USD225M Series A FundingKandou AI, a fabless semiconductor design company based in Saint-Sulpice, Switzerland, closed a $225 million Series A funding round led by Maverick Silicon with participation from SoftBank Group, Synopsys, Cadence Design Systems, and Alchip Technologies. The company plans to use the proceeds to accelerate its chip and IP portfolio for multi-terabit connectivity, ramp up manufacturing of AI connectivity chips, and deepen partnerships with hyperscale and AI infrastructure customers. Kandou AI, which has shipped over 20 million silicon units using its technology, recently expanded its global engineering footprint with a new design center in Hyderabad, India.SiliconANGLEChip interconnect startup Kandou AI raises $225M in funding - SiliconANGLEKandou AI Inc., a Swiss developer of copper-based interconnects for artificial intelligence chips, has raised $225 million in funding from a syndicate including Synopsys Inc., Cadence Design Systems Inc., AIchip Technologies Ltd., SoftBank Group PBC, and Maverick Silicon, valuing the company at $400 million. The company offers two products: a cost-efficient copper-based interconnect alternative to fiber optics for AI clusters, and Glasswing, a chip component interconnect using CNRZ-5 Chord technology that transmits data using six wires while consuming half the power of competing technologies. Kandou AI reportedly shifted focus to the AI infrastructure market after CEO Srujan Linga joined last year, having previously concentrated on components for connected devices such as industrial computers.startupticker.chExecutive reshuffle in ICT and Biotech startupsFour Swiss startups in ICT and biotech sectors have appointed new executive leaders to drive their next phases of growth and clinical development. Payrexx AG appointed Anja Traum as CEO effective January 2026 to lead its DACH region and European expansion, including an application for a payment institution license through its subsidiary Payrexx Europe AG. Biotech firms Topadur Pharma AG and MUVON Therapeutics promoted internal candidates—Matthias Schäfer as CEO and Christine Günther as CTO respectively—to advance their clinical trials, while Kandou AI brought in Taher Madraswalaa as COO to oversee its silicon and operations functions.GlobeNewswireKandou’s CFO, Jeff Winzeler, to Present at the 26th Annual Needham Growth ConferenceKandou's CFO Jeff Winzeler will present the company's vision and chip communications solutions at the 26th Annual Needham Growth Conference on January 17-18 in New York. The conference features one-on-one meetings with qualified institutional, private equity, and venture capital investors.GlobeNewswireKandou will be sharing Its Vision and Market-Leading Solutions Strategy at the Morgan Stanley European Technology, Media & Telecom ConferenceKandou's CEO Dr. Amin Shokrollahi and CFO Jeff Winzeler will present the company's vision and chip communications solutions at the Morgan Stanley European Technology, Media & Telecom Conference in Barcelona from November 15-17. The company, a fabless semiconductor firm, offers low-power interconnect technology for USB, PCIe, and datacenter applications.GlobeNewswireUPDATE – Kandou will be presenting Its Vision, Market-Leading Solutions Strategy at the JP Morgan Tech Stars ConferenceKandou's CEO Dr. Amin Shokrollahi will present the company's vision and chip communications solutions at the JP Morgan Tech Stars conference in London from October 2-4. The event includes an exclusive afternoon for 100 CEOs and investors, plus one-on-one meetings with institutional investors.