Asmpt Nexx
ASMPT NEXX supplies advanced packaging deposition equipment (PVD sputtering and ECD plating systems) to semiconductor manufacturers, OSATs, and RF/power device producers, supporting wafer-level and panel-level packaging for AI, 5G, and high-bandwidth chip applications.
- Company typePrivate
- Founded2001
- HeadquartersBillerica, United States
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
What Asmpt Nexx does
ASMPT NEXX, Inc. is a US-headquartered (Billerica, Massachusetts) supplier of advanced packaging deposition equipment for the semiconductor industry, operating as a subsidiary of Hong Kong-listed ASMPT (0522.HK) until its 2026 divestiture to Applied Materials for a $120 million base transaction value. The company designs and manufactures physical vapor deposition (PVD) sputtering systems under the Apollo brand (Apollo 300 for 200-300mm wafers and Apollo 200 for 100-200mm wafers) and electrochemical deposition (ECD) plating systems under the Stratus brand (Stratus P300 for 300-200mm wafers, Stratus S200 for 100-200mm wafers, and Stratus P500 for 510x515mm panel-level processing). Its proprietary process technologies include Membrane Cell technology for long bath stability, ShearPlate Technology for thinnest boundary layer plating, True Bridge tool capability for flexible wafer-size handling, and chemistry-stabilizing cells, with claimed productivity rates 2-3x higher than alternative suppliers and <10 µm RDL L/S capability on the panel platform.
The company serves enterprise semiconductor manufacturers, advanced packaging assembly houses, RF filter producers (SAW/BAW), and power device manufacturers (SiC/GaN), addressing use cases across wafer-level packaging, bumping (Cu pillar and SnAg), redistribution layers, 2.5D/3D TSV, fan-out, embedded die, and EMI shielding. Applications are aligned with the More-than-Moore paradigm shift driven by AI chips, 5G communication infrastructure, and high-bandwidth memory packaging. Revenue is generated primarily through one-time capital equipment sales with multi-year contract cycles, supplemented by parts, consumables, and major upgrades, plus installation and ongoing technical support services. Distribution combines direct enterprise field sales from seven regional offices (USA, Singapore, China, Korea, Taiwan, Japan, Germany) with channel partners including CWI Technical Sales (Eastern USA/Canada, appointed January 2024), TELTEC, and SWAT (China).
ASMPT NEXX traces its origins to NEXX Systems, founded in 2001 by Richard Post with the Nimbus sputtering tool, expanded through the 2003 acquisition of All-Wet Technologies (Stratus S100 plating tool), and has shipped 300+ cumulative systems across multiple ownership transitions: Tokyo Electron (2012), ASMPT (2018), and Applied Materials (2026). The company holds ISO-9001:2015 and ISO-14001:2015 certifications, and operates with a workforce of 101-250 employees.
Asmpt Nexx firmographics
Firmographics- Name
- Asmpt Nexx
- Legal name
- ASMPT NEXX, Inc.
- Website
- https://nexx.semi.asmpt.com
- Company type
- Private
- Founded year
- 2001
- Operating status
- Acquired
- Headcount range
- 101–250 employees
- Short description
- ASMPT NEXX supplies advanced packaging deposition equipment (PVD sputtering and ECD plating systems) to semiconductor manufacturers, OSATs, and RF/power device producers, supporting wafer-level and panel-level packaging for AI, 5G, and high-bandwidth chip applications.
- Ownership category
- akta.pro rank
Asmpt Nexx industry classification
Industry- Product category
- Semiconductor Capital Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Semiconductors & Related Devices (3674)
- akta.pro primary industry
- Deposition Equipment (CVD/PVD/ALD/Epitaxy) (HDAHAEAB)
- akta.pro secondary industry
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)
Keywords
Where Asmpt Nexx is headquartered
LocationHeadquarters
- HQ city
- Billerica
- HQ country
- United States
- HQ region
- North America
Offices7 records
Markets served
Asmpt Nexx business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales
Revenue model
- Semiconductor Capital Equipment Sales: Sale of high-value PVD and ECD deposition equipment systems for advanced semiconductor packaging. Equipment includes Apollo sputtering tools and Stratus plating tools for wafer and panel level processing. Revenue is primarily one-time capital equipment sales with long sales cycles typical of semiconductor capital goods.
- Equipment Installation and Support Services: Technical support, customer support, and professional services associated with equipment deployment, process qualification, and ongoing maintenance. Customer Support available via TEL: 978-338-2900 TECH SUPPORT – ON CALL.
- Parts and Consumables: Replacement parts, consumables, and upgrades for existing equipment systems. Company offers major upgrades for ECD and PVD Tools.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Custom quotation-based pricing for semiconductor capital equipment |
Go-to-market motion2 records
Distribution channels3 records
Marketing channels5 records
Asmpt Nexx product offering
Product offeringCore offering
ASMPT NEXX designs and manufactures Advanced Packaging deposition equipment for the semiconductor industry, supplying Physical Vapor Deposition (PVD) sputtering systems (Apollo series) and Electrochemical Deposition (ECD) plating systems (Stratus series) for wafer-level and panel-level applications. The equipment supports wafer level packaging, 2.5D/3D IC, fan-out, embedded die, and heterogeneous integration processes used by semiconductor manufacturers and assembly houses.
Product overview
ASMPT NEXX is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, offering a unified portfolio of sputtering (PVD) and electroplating (ECD) tools. The product line consists of two PVD wafer systems—Apollo 300 for 200-300 mm wafers and Apollo 200 for 100-200 mm wafers—along with three ECD systems: Stratus P300 for 300-200 mm wafers, Stratus S200 for 100-200 mm wafers, and Stratus P500 for large panel-level processing (510 x 515 mm). These tools are used for wafer level packaging, 2.5D/3D integrated circuits, fan-out, embedded die, and heterogeneous integration processes in semiconductor manufacturing.
Differentiator
Problem solved
Functional benefit
Products and services
- Apollo 300 Physical vapor deposition (PVD) system for 200-300 mm wafer processing with true bridge tool capability, degas/anneal, and ICP/CCP etch functions. Handles warped and heavy wafers for applications including bumping, fan-out, and RDL.
- Apollo 200 Physical vapor deposition (PVD) system for 100-200 mm wafer processing configurable for up to 5 metals. Designed for SiC/power devices, EMI shielding, and fragile wafer processing including multiple wafer sizes.
- Stratus P300 Electrochemical deposition (ECD) system for 300-200 mm wafer processing with dual wafer size capability and membrane cells for long bath stability. Supports fan-out packaging with process RDLs, copper pillars, and TSVs.
- Stratus S200 Electrochemical deposition (ECD) system for 100-200 mm wafer processing configurable for up to 6 metals. Features ShearPlate technology for thinnest boundary layer and supports UBM/RDL, RF filters, and power devices.
- Stratus P500 Electrochemical deposition (ECD) panel plating system for 510 x 515 mm panels delivering wafer level precision on panel substrates. Supports multi-chip fan-out, SoC packages, and MicroLED with Cu, Sn(Ag), Ni and Au plating at less than 10 micron L/S.
Companies that use Asmpt Nexx
Customer profileNamed customers3 records
Segments4 records
Ideal customer profiles4 records
Asmpt Nexx technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature4 records
Asmpt Nexx partnerships and signals
Strategic signalPartnerships
Six partnerships are on record, tiered core, regional and minor.
- Applied MaterialscoreApplied Materials completed acquisition of ASMPT NEXX in 2026, expanding its presence in advanced semiconductor packaging for AI and high-bandwidth chips. The acquisition adds deposition equipment systems (PVD and ECD) for wafer-level and panel-level applications critical to 2.5D/3D chip stacking and heterogeneous integration.
- Applied MaterialscoreApplied Materials entered into share purchase agreement to acquire ASMPT NEXX, the U.S.-based subsidiary of Hong Kong-listed ASMPT, for base transaction value of $120 million with $18 million withheld as indemnity escrow. Closing conditions expected by July 29, 2026.
- CWI Technical SalesregionalCWI Technical Sales appointed as Manufacturers' Sales Representative for wafer level deposition equipment in Eastern USA and Eastern Canada effective January 2024. CWI manages sales for Stratus ECD Tools, Apollo PVD Tools, and major upgrades for existing systems.
- MacDermid Alpha Electronics SolutionsminorCo-authored technical paper 'RDL Copper Plating Process for Panel Level Packaging Application' presented at IMPACT 2022-US conference. Joint development of copper plating chemistry optimized for panel level packaging applications.
- TELTECregionalTELTEC serves as distribution partner in China with multiple locations. Provides semiconductor wet process equipment and services in the Chinese market.
- Semiconductor Wet Advanced Technology Co., Ltd. (SWAT)regionalSWAT serves as China-Wafer Systems distributor for ASMPT NEXX products in Jiangsu Province, China. Located in Suzhou City.
Scale indicators5 records
Recent moves9 records
Expansion highlights5 records
Asmpt Nexx competitors and assessment
Company assessmentDirect peers
- ACM Research: US-headquartered semiconductor equipment supplier focused on single-wafer wet cleaning, ECD plating, and stress-free polishing tools for advanced packaging. Directly comparable ECD platform competing with Stratus systems for UBM, RDL, copper pillar, and TSV plating applications.
- EV Group (EVG): Austrian specialist in wafer bonding, nanoimprint lithography, and advanced-packaging process equipment. Adjacent competitor in heterogeneous-integration process flows (2.5D/3D, fan-out wafer-level packaging) that share the same advanced-packaging customers as ASMPT NEXX.
- Veeco Instruments: US-based supplier of deposition and process equipment including PVD, ion beam, and advanced packaging lithography (via Ultratech acquisition). Directly competes with ASMPT NEXX in wafer-level PVD for advanced packaging, MEMS, RF filters, and power-device manufacturing.
Regional players
- NAURA Technology Group: China's largest domestic semiconductor equipment supplier offering PVD, CVD, etch, cleaning, and CMP tools. Comparable product portfolio in advanced-packaging deposition and a key regional competitor to ASMPT NEXX in the Chinese market served by the Chongqing office and TELTEC/SWAT distributors.
Broad incumbents
- Tokyo Electron (TEL): Large Japanese semiconductor equipment OEM with broad track, deposition, etch, and advanced-packaging offerings. Former owner of ASMPT NEXX (2012-2018) and a continuing competitor in PVD/ECD tools for advanced packaging and bumping applications.
- SCREEN Holdings: Japanese semiconductor equipment manufacturer specializing in single-wafer cleaning, coater/developer, and surface preparation systems. Adjacent competitor in the advanced-packaging process flow with overlap at the wafer-cleaning step that precedes and follows NEXX's deposition steps.
- Lam Research: Major semiconductor equipment manufacturer specializing in deposition (CVD/ALD), etch, and clean technologies. Competes with ASMPT NEXX in advanced-packaging deposition applications, particularly for copper interconnect, TSV, and fan-out processes at leading-edge foundries.
- Applied Materials: Global leader in semiconductor fabrication equipment with broad deposition (PVD/CVD/ALD), etch, CMP, and inspection portfolios. Directly comparable as the acquirer of ASMPT NEXX and as a competing supplier of advanced-packaging PVD and ECD solutions to the same foundry/OSAT customer base.
- ASMPT: Former parent of ASMPT NEXX and a global leader in semiconductor assembly equipment (die bonding, packaging, SMT). Highly comparable business model and customer base in advanced packaging, though ASMPT's portfolio focuses on assembly-side equipment rather than the deposition step where NEXX competes.
Others
- Disco Corporation: Japanese leader in wafer dicing, grinding, and polishing equipment for semiconductor back-end processing. Serves the same advanced-packaging and OSAT customer base as ASMPT NEXX and competes for capex allocations in the back-end packaging process flow.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat4 records
Key risks5 records
Key highlights7 records
Customer concentration
Asmpt Nexx social profiles
Digital presenceAsmpt Nexx compliance and trust
Trust signalCompliance2 records
Asmpt Nexx financial estimates
Financial estimateRevenue estimate
Valuation estimate
Asmpt Nexx leadership team
Management profileNumber of profiles
Profiles1 record
Asmpt Nexx funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Asmpt Nexx M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Asmpt Nexx
What does Asmpt Nexx do?
ASMPT NEXX designs and manufactures Advanced Packaging deposition equipment for the semiconductor industry, supplying Physical Vapor Deposition (PVD) sputtering systems (Apollo series) and Electrochemical Deposition (ECD) plating systems (Stratus series) for wafer-level and panel-level applications. The equipment supports wafer level packaging, 2.5D/3D IC, fan-out, embedded die, and heterogeneous integration processes used by semiconductor manufacturers and assembly houses.
Is Asmpt Nexx a public or private company?
Asmpt Nexx is a private company. It is classified as corporate owned and is currently acquired.
When was Asmpt Nexx founded?
Asmpt Nexx was founded in 2001. It employs 101 to 250 people.
Where is Asmpt Nexx based?
Asmpt Nexx is headquartered in Billerica, United States, in the North America region.
How does Asmpt Nexx make money?
Three revenue lines are on record. Semiconductor Capital Equipment Sales are the primary driver. The others are equipment Installation and Support Services and parts and Consumables.
Who are Asmpt Nexx's main competitors?
Direct peers on record are ACM Research, EV Group (EVG) and Veeco Instruments. NAURA Technology Group is listed as a regional player. Broad incumbents are Tokyo Electron (TEL), SCREEN Holdings, Lam Research, Applied Materials and ASMPT. Disco Corporation is listed as an others.
Does Asmpt Nexx have an API?
No public API is recorded for Asmpt Nexx.
What industry is Asmpt Nexx in?
Asmpt Nexx's product category is Semiconductor Capital Equipment. Its primary akta.pro industry code is HDAHAEAB, Deposition Equipment (CVD/PVD/ALD/Epitaxy), with a secondary code of HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets). Its NAICS code is 333242 and its SIC code is 3674.