Bosch semiconductors and sensors

What Bosch semiconductors and sensors does

Robert Bosch GmbH's Semiconductors and Sensors division is an Integrated Device Manufacturer that designs and produces automotive-grade semiconductors and MEMS sensors, headquartered operationally out of Reutlingen and Dresden in Germany with additional fabrication in Roseville, California. The division's portfolio centers on four product lines: MEMS sensors (accelerometers, gyroscopes, pressure, inertial, and magnetic-field sensors) manufactured via the proprietary DRIE 'Bosch Process' that the company itself invented; silicon carbide (SiC) power semiconductors — including MOSFETs as bare dies, discretes, and power modules (DSL, CSL, PM6.2) at 750V, 1,200V and 1,700V voltage classes — serving EV traction inverters, onboard chargers, and DC-DC converters; application-specific automotive ICs for engine management, airbag, stability, and ADAS functions, including SX601/SX600 single-chip 76-81 GHz FMCW radar SoCs in 22nm FD-SOI RF-CMOS; and IP modules covering the CAN, CAN FD, and CAN XL protocol family, which Bosch licenses royalty-bearing to other semiconductor vendors under ISO 11898-1:2024.

The division monetizes primarily through direct hardware sales to automotive OEMs and Tier-1 suppliers plus consumer-electronics manufacturers, complemented by CAN-protocol licensing royalties. Distribution runs through direct sales offices in seven countries (Germany, USA, China, Japan, Korea, India, Taiwan) plus a network of eleven authorized distributors including Arrow, Rutronik, Future Electronics, and regional specialists. The business targets two principal segments: automotive OEMs and Tier-1s (primary, with use cases spanning airbag deployment, electronic stability control, TPMS, ADAS, and autonomous driving) and consumer-electronics manufacturers (motion sensing, image stabilization, gesture recognition). Third-party MEMS foundry services provide a secondary service revenue stream leveraging the proprietary manufacturing process.

The division operates a globally distributed manufacturing footprint: the 200mm Reutlingen fab transitioning SiC production to 200mm wafers, the 300mm Dresden fab (opened 2021) producing automotive ICs and power semiconductors, the recently acquired 200mm SiC fab in Roseville, California, plus test centers in Suzhou (China) and Penang (Malaysia). The division employs 5,001-10,000 staff and operates as a strategic business unit of the privately-held Robert Bosch GmbH, with no external venture funding. Bosch holds the #1 position in the global MEMS market and has cumulatively produced over 26 billion MEMS sensors, with penetration into roughly half of new smartphones worldwide and approximately seven MEMS sensors per vehicle on average.

Name

Bosch semiconductors and sensors

Legal name

Robert Bosch GmbH

Website

https://bosch-semiconductors.com

Company type

Private

Founded year

1886

Operating status

Operating

Headcount range

5,001–10,000 employees

Short description

Bosch Semiconductors and Sensors is the IDM division of Robert Bosch GmbH that designs and manufactures automotive MEMS sensors, silicon carbide (SiC) power semiconductors, automotive ICs, and CAN protocol IP, serving global automotive OEMs, Tier-1 suppliers, and consumer-electronics manufacturers from fabs in Germany and the USA.

Ownership category

akta.pro rank

Product category

Automotive Semiconductors

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441), Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (33451)

SIC

Semiconductors & Related Devices (3674), Electronic Components, Nec (3679)

akta.pro primary industry

Sensors, MEMS & Imaging ICs (HDAHAAAG)

akta.pro secondary industries

Automotive Sensors Manufacturing (Position/Pressure/Temp/IMU/Radar/LiDAR Cameras) (IMACAJAD), Semiconductors for Industrial Control & Power (MCUs, DSPs, FPGAs, ASICs, IGBTs, MOSFETs, diodes) (IMAGAJAE), Sensor Fusion, Interface ICs & Modules (AFE/Readout/Packaging/Calibration) (HDAHALAO)

Keywords

• Automotive semiconductors
• MEMS sensors
• Silicon carbide power
• Radar SoC chips
• Automotive ICs

Headquarters

HQ city

Pointe-claire

HQ country

Canada

HQ region

North America

Offices13 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Infrastructure, Operations

Revenue model

1. SiC Power Semiconductors Sales: Bosch operates as an IDM (Integrated Device Manufacturer) selling silicon carbide power semiconductors including MOSFETs (bare dies, discrete devices) and power modules to automotive OEMs and Tier-1 suppliers for electric vehicle applications including traction inverters, onboard chargers, and DC-DC converters.
2. MEMS Sensors Sales: Bosch sells MEMS sensors including accelerometers, gyroscopes, pressure sensors, and inertial sensors to automotive and consumer electronics manufacturers. With over 26 billion MEMS sensors produced to date, Bosch is one of the world's largest suppliers.
3. Automotive ICs Sales: Bosch manufactures and sells application-specific integrated circuits (ASICs) and automotive ICs for engine management, safety systems, and ADAS applications from its wafer fabs.
4. CAN Protocol Licensing: Bosch licenses CAN FD, CAN FD Light, TTCAN, and CAN XL protocols to semiconductor companies implementing these protocols. A CAN Protocol License is required for all implementations.

Go-to-market motion1 record

Distribution channels12 records

Marketing channels4 records

Core offering

Bosch semiconductors and sensors is a division of Robert Bosch GmbH that develops and manufactures application-specific integrated circuits (ASICs), microelectromechanical systems (MEMS) sensors, silicon carbide (SiC) power semiconductors, and radar system-on-chip (SoC) solutions. Its products serve automotive OEMs and Tier-1 suppliers as well as consumer electronics manufacturers. The division also licenses IP modules to third parties.

Product overview

Bosch semiconductors and sensors offers a comprehensive automotive semiconductor portfolio organized into four core product categories: MEMS sensors (manufactured using the proprietary Bosch Process DRIE for acceleration, inertial, pressure, angular rate, and magnetic field sensing), SiC power devices (including MOSFETs as bare dies, discretes, and power modules in DSL/CSL/PM6.2 configurations at 750V-1700V), Automotive ICs (ASICs for safety and control systems), and IP modules (CAN/CAN FD/CAN XL protocol controllers and licenses). The company operates as an IDM with global manufacturing facilities (Reutlingen, Dresden, Roseville) and provides MEMS foundry services alongside direct sales offices and distribution partner networks worldwide.

Differentiator

Problem solved

Functional benefit

Products and services

• MEMS Sensors
• Silicon Carbide (SiC) Power Semiconductors
• Automotive ASICs
• Radar System-on-Chip (SoC)
• Semiconductor IP Modules

Quantifiable outcome

• Traction inverter efficiency of 95-98%
• +3 more outcomes

Named customers1 record

Segments2 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability6 records

Feature5 records

Partnerships

21 partnerships are on record, tiered core, minor and flagship.

• Genesis ConsortiumcoreStrategic or Co-development Partner · 1 May 2025GENESIS (Generate in Europe a Sustainable Industry for Semiconductor) - project mission to reduce environmental footprint of semiconductor manufacturing while enabling innovation across materials, monitoring, and reuse. Project duration: 05/2025 - 04/2028.
• FastLane ConsortiumcoreStrategic or Co-development Partner · 1 June 2024FastLane targets a full, highly competitive and sustainable European value chain for Silicon Carbide (SiC) based power electronics. 29 partners from seven European countries under lead of Valeo. Project duration: 06/2024 - 04/2027.
• Semiconductor-X ConsortiumcoreStrategic or Co-development Partner · 1 May 2024Project aims to strengthen resilience and security of semiconductor supply chains through digitalization and secure data sharing via digital twins and privacy-preserving technologies (homomorphic encryption). Funded by German Federal Ministry for Economic Affairs and Climate Protection. Project duration: 05/2024 - 04/2026.
• Fuji ElectriccoreStrategic or Co-development Partner · 1 January 2024Bosch and Fuji Electric partnered to create a dual-source opportunity for power modules, providing automotive customers with alternative sourcing options for SiC-based power modules used in electric vehicle applications.
• FA2IR ConsortiumminorStrategic or Co-development Partner · 1 January 2024FA2IR focuses on making FA-databases AI-ready and developing AI-based methods for image and measurement data analysis following FAIR-data principles. Includes FA-ontology for standardization. Project duration: 01/2024 - 12/2026.
• EECONE ConsortiumcoreStrategic or Co-development Partner · 1 July 2023European Ecosystem for Green Electronic (EECONE) aims to reduce e-waste through the 6R concept (Reduce, Reliability, Repair, Reuse, Refurbish, Recycle). Focus on ecodesign guidelines, circularity, and waste valorization. Project duration: 07/2023 - 06/2026.
• e2lead ConsortiumcoreStrategic or Co-development Partner · 1 March 2023Driven by EV and autonomous driving needs, e2lead develops automotive supercomputing ECUs based on chiplet technology. Bosch is overall project coordinator. Focus on optical/electrical/thermal interfaces, heterogeneous integration, and digital twin chips. Project duration: 03/2023 - 02/2026.
• PowerizeD ConsortiumcoreStrategic or Co-development Partner · 1 January 2023Focuses on improving energy generation and transmission through digitized and intelligent electronic power for decarbonization. Develops simulation-driven co-design, digital twins, and virtual release through referencing for power modules. Project duration: 01/2023 - 12/2025.
• Mannheim - CeCaSminorStrategic or Co-development Partner · 1 December 2022CeCaS enables connected vehicles with high automation level through centralized software function control, convolutional neural networks, and zonal/redundant high-availability architecture. Project duration: 12/2022 - 11/2025.
• Mannheim - FlexKIminorStrategic or Co-development Partner · 1 September 2022FlexKI aims to break hardware dependency of AI application development through open reference approach for AI deployment on commercial platforms and customized energy-efficient AI platforms. Project duration: 09/2022 - 08/2025.
• IPCEI ME/CTflagshipStrategic or Co-development Partner · 1 June 2022Important Project of Common European Interest on Microelectronics and Communication Technologies. Bosch participates with innovative semiconductor technology developments at locations in Baden-Württemberg, Saxony and Bavaria. Supported by Federal Ministry for Economic Affairs and Climate Protection, EU NextGenerationEU. Project duration: 06/2022 - 12/2026.
• Tech4Trust ConsortiumminorStrategic or Co-development Partner · 1 April 2022Trustworthy Electronics project enabling secure supply chains through distributed manufacturing (split manufacturing), quantum-safe cryptographic keys, and secure distributed production of wafer-based components. Project duration: 04/2022 - 03/2026.
• TRISTAN ConsortiumminorStrategic or Co-development Partner · 1 January 2022KDT-JU funded project to expand and industrialize RISC-V architecture in Europe to compete with commercial alternatives. Holistic approach covering EDA tools and full software stack for Automotive, Industrial, Aerospace, Mobile, Wearables and Health domains.
• Scale4Edge ConsortiumminorStrategic or Co-development Partner · 1 May 2020Joint project funded by BMBF to reduce development times and costs for application-specific edge components through scalable edge computing platform ecosystem created by SMEs, industry and research. Project duration: 05/2020 - 04/2026.
• IPCEI MEflagshipStrategic or Co-development Partner · 1 January 2017European initiative to strengthen Europe's position in microelectronics through research, development and production of advanced semiconductor materials, design and manufacturing processes. Enabled Bosch to build its semiconductor fab in Dresden.
• AENEAScoreStrategic or Co-development Partner · 1 January 2006Association for European NanoElectronics ActivitieS - industrial association providing networking opportunities, policy influence and access to funding for RD&I participants in micro and nanoelectronics enabled components and systems.
• EPoSScoreStrategic or Co-development PartnerEuropean Technology Platform on Smart Systems Integration - industry-driven policy initiative defining R&D and innovation needs related to Smart Systems Integration and integrated Micro- and Nanosystems.
• TRANSFORM ConsortiumcoreStrategic or Co-development PartnerDevelops complete and competitive power electronics value chain based on SiC semiconductors from wafers to inverters/converters for 5 applications. 33 partners from 7 EU countries including STMicroelectronics, Infineon, Soitec, Danfoss, Semikron. Focus on model-based system engineering and digital twins.
• LOTUS ConsortiumminorStrategic or Co-development PartnerFinanced by ERDF (European Regional Development Fund), objective to investigate low-voltage circuit designs for ultra-low-power sensors. Partners: Bosch Sensortec Dresden, Racyics GmbH, TU Dresden.
• METIS ConsortiumminorStrategic or Co-development PartnerMicroElectronics Training Industry and Skills - 4-year EU funded project with 20 partners evaluating microelectronics education trends and defining next generation of microelectronics education. Establishes European Microelectronics Observatory.
• ARAMID ConsortiumminorStrategic or Co-development PartnerRADAR for autonomous driving project financed by ERDF. Partners: Bosch Sensortec Dresden, Globalfoundries Dresden, Semitec, Fraunhofer IKTS, Fraunhofer IIS/EAS. Develops robust RADAR test chip for mainstream ADAS applications.

Scale indicators8 records

Recent moves9 records

Expansion highlights6 records

Direct peers

• ROHM Semiconductor: Japanese IDM with one of the strongest SiC MOSFET and power module portfolios globally. Direct rival in EV traction inverter SiC and discrete power devices.
• Infineon Technologies: Germany-headquartered IDM and the leading automotive power semiconductor supplier. Direct overlap with Bosch in SiC MOSFETs, automotive ICs, and MEMS/sensor portfolios serving the same OEM and Tier-1 customers.
• Renesas Electronics: Japanese automotive semiconductor leader with overlapping MCU, ASIC, and sensor fusion offerings. Competes with Bosch in automotive ECUs, ADAS, and in-vehicle networking.
• NXP Semiconductors: Automotive semiconductor leader in networking, microcontrollers, and radar. Competes with Bosch across CAN connectivity IP, automotive ASICs, and ADAS radar SoCs.
• ON Semiconductor (onsemi): US-based automotive semiconductor IDM with rapidly scaling SiC capacity and a strong image-sensor franchise. Competes directly with Bosch in EV power semiconductors and sensing.
• STMicroelectronics: European IDM with a major SiC traction-inverter franchise and broad automotive MEMS/ASIC portfolio. Closest like-for-like competitor on SiC power devices and automotive microcontrollers.

Emerging players

• ams OSRAM: European sensor and optical semiconductor specialist covering automotive and consumer sensing. Comparable to Bosch in MEMS/optical sensor categories, though smaller scale.
• Allegro MicroSystems: US-based automotive sensor and power IC specialist focused on magnetic sensing and motor driver ICs. Niche competitor to Bosch's automotive ASIC and sensor portfolio.
• Wolfspeed: Pure-play SiC substrate and device specialist. As a focused emerging competitor, Wolfspeed pressures Bosch specifically in SiC wafer sourcing and discrete MOSFET supply.

Broad incumbents

• Texas Instruments: Largest US analog and embedded IDM with a substantial automotive franchise. Competes broadly across automotive ICs and analog signal conditioning but is not a direct MEMS or SiC specialist.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds1 record

Investors1 record

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M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Bosch semiconductors and sensors