Frore Systems
Frore Systems designs and manufactures proprietary thermal management hardware—AirJet solid-state cooling chips and LiquidJet direct-to-chip liquid cooling coldplates—for AI data centers and compact consumer/edge devices. Its cooling platforms are integrated by 20+ major OEMs including Intel, NVIDIA, AMD, Qualcomm, Lenovo, Samsung, and ZOTAC.
- Company typePrivate
- Founded2018
- HeadquartersSan Jose, United States
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
What Frore Systems does
Frore Systems designs, manufactures, and sells proprietary thermal management hardware for high-performance electronic systems. The company's portfolio is built on two flagship cooling platforms: AirJet, the world's first solid-state active cooling chip that uses vibrating membrane technology to generate high-velocity air jets without fans or moving parts; and LiquidJet, a direct-to-chip liquid cooling coldplate that uses multi-stage 3D short-loop jetchannels manufactured via semiconductor processes adapted to metal wafers. AirJet modules (Mini, Mini Slim, Mini G2, and the PAK 1C/3C/5C/G2 family) range from 5W to 33W of heat removal per chip and target ultra-thin, silent, dustproof, water-resistant designs. LiquidJet and LiquidJet Nexus target AI data center GPUs, with claimed 75% higher heat removal, 2x hotspot power density, and demonstrated cooling of 1950W NVIDIA Rubin 2 SoCs and 1400W Blackwell Ultra GB300 chips.
Frore sells primarily through OEM embedded integrations, with 20+ brand integrations including Intel, NVIDIA, AMD, Qualcomm, Lenovo, ZOTAC, Phison, iodyne, Samsung, Sonim/AT&T (FirstNet), OWC, and Sabrent. Products reach end customers via partner devices such as the ZOTAC ZBOX PI430AJ Mini PC, iodyne Pro Mini, Sonim MegaConnect 5G hotspot, and Phison PCIe Gen5 SSDs. The SnowGoose AirJet Development Kit supports a land-and-expand sales motion from evaluation to volume production. Pricing is quote-based and not publicly disclosed; contracts are multi-year with OEM/system-builder customers. The company maintains offices in San Jose, CA (HQ), Suwon, South Korea (regional), and Hsinchu County, Taiwan (manufacturing via Frore Systems Taiwan Co. Ltd.).
Founded in 2018 by former Qualcomm engineers Seshu Madhavapeddy (CEO) and Surya Ganti (CTO), Frore has raised approximately $340M in cumulative venture funding (Series B, C, D) and achieved unicorn status at a $1.64B post-money valuation in March 2026, led by MVP Ventures with Fidelity, Mayfield, Qualcomm Ventures, and others. Headcount is 51–100 employees. The company has won three consecutive CES Innovation Awards (2024 Best of Innovation, 2025 Honoree, 2026 Honoree) and the COMPUTEX 2023 Golden Award, and is actively targeting the AI data center thermal stack as a foundational infrastructure layer for AI compute scaling.
Frore Systems firmographics
Firmographics- Name
- Frore Systems
- Legal name
- Frore Systems, Inc.
- Website
- https://froresystems.com
- Company type
- Private
- Founded year
- 2018
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Short description
- Frore Systems designs and manufactures proprietary thermal management hardware—AirJet solid-state cooling chips and LiquidJet direct-to-chip liquid cooling coldplates—for AI data centers and compact consumer/edge devices. Its cooling platforms are integrated by 20+ major OEMs including Intel, NVIDIA, AMD, Qualcomm, Lenovo, Samsung, and ZOTAC.
- Ownership category
- akta.pro rank
Frore Systems industry classification
Industry- Product category
- Thermal management hardware (semiconductor cooling)
- NAICS
- Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing (333415), Ventilation, Heating, Air-Conditioning, and Commercial Refrigeration Equipment Manufacturing (33341), Industrial and Commercial Fan and Blower and Air Purification Equipment Manufacturing (333413)
- SIC
- Air-Cond & Warm Air Heatg Equip & Comm & Indl Refrig Equip (3585), Industrial & Commercial Fans & Blowers & Air Purifing Equip (3564)
- akta.pro primary industry
- AI Datacenter Power, Cooling & Racks (liquid cooling, power delivery) (HDAAAAAH)
- akta.pro secondary industry
- Cooling Systems & Thermal Management (CRAC/CRAH, Chillers, Liquid Cooling) (HDABAKAD)
Keywords
Where Frore Systems is headquartered
LocationHeadquarters
- HQ city
- San Jose
- HQ country
- United States
- HQ region
- North America
Offices3 records
Markets served
Frore Systems business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Supply Chain, Operations, Personnel, Marketing or Sales, Infrastructure
Revenue model
- Hardware sales (chips and coldplates): Frore generates revenue by selling proprietary cooling silicon and coldplate hardware — AirJet solid-state cooling chips (Mini, Mini Slim, Mini G2, PAK family) for consumer/industrial/edge devices, and LiquidJet liquid cooling coldplates (LiquidJet DLC, LiquidJet Nexus) for AI data centers. Products are sold to OEMs and system builders who integrate them into their end products; demonstrated shipping in ZOTAC ZBOX PI430AJ, iodyne Pro Mini, Sonim MegaConnect, Phison SSDs, and Lenovo (announced) systems.
- SnowGoose AirJet Development Kit: Frore offers the SnowGoose AirJet Development Kit, enabling device manufacturers to evaluate and integrate AirJet technology into their products, supporting a land-and-expand path from prototype to volume production.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Quote-based pricing for OEMs and system builders |
Go-to-market motion4 records
Distribution channels5 records
Marketing channels8 records
Frore Systems product offering
Product offeringCore offering
Frore Systems designs, manufactures, and sells proprietary thermal management hardware for AI compute platforms and compact electronic devices. Its AirJet® solid-state active cooling chips (Mini, Mini Slim, Mini G2, and PAK module family) replace mechanical fans in ultra-thin consumer and industrial devices, while its LiquidJet™ direct-to-chip liquid cooling coldplates (LiquidJet DLC Coldplate and LiquidJet Nexus integrated system) cool high-TDP AI GPUs in hyperscale data centers. Products are sold primarily to OEMs, ODMs, and system builders for integration into laptops, mini PCs, SSDs, edge AI SoM modules, 5G hotspots, and AI server systems.
Product overview
Frore Systems offers a platform-plus-modules architecture consisting of two flagship product lines: LiquidJet™ for direct-to-chip liquid cooling in AI data centers and AirJet® for solid-state active air cooling in edge devices. LiquidJet encompasses the LiquidJet DLC Coldplate (the base coldplate) and LiquidJet Nexus (an integrated lightweight coldplate system for 1/2 U compute trays). AirJet encompasses multiple modules including AirJet Mini Slim, AirJet Mini G2, the SnowGoose AirJet Development Kit, AirJet PAK (with sub-variants 1C, 3C, 5C), AirJet PAK G2, and AirJet PAK 5C-G2. Together, these products address thermal management for high-performance AI compute platforms (NVIDIA, Qualcomm, AMD SoMs) and consumer/industrial devices, with manufacturing operations in Taiwan and headquarters in Silicon Valley.
Differentiator
Problem solved
Functional benefit
Brands
- AirJet: The world's first solid-state active cooling chip used in consumer, industrial, and IoT markets, delivering higher performance in ultra-compact, silent, light, dustproof and water-resistant edge devices.
- LiquidJet
Products and services
- LiquidJet DLC Coldplate Direct-to-chip liquid cooling coldplate for AI data centers built using semiconductor manufacturing processes adapted to metal wafers. Uses customizable multi-stage 3D short-loop jetchannels to remove 75% more heat and support 2x higher hotspot power density than mainstream coldplates, futureproofing data centers handling high-power GPUs.
- LiquidJet Nexus Integrated lightweight coldplate system for ½ U compute trays in AI factories and hyperscale data centers, integrating multiple multistage 3D short-loop jetchannel LiquidJet coldplates. Supports inlet temperature of 53°C, weighs 2.5 kg, eliminates all connectors and hoses, and delivers 2x higher hotspot power density and 75% higher KW/LPM. Designed for next-generation AI server systems including NVIDIA Kyber for Vera Rubin Ultra GPUs.
- AirJet Mini The world's first solid-state active cooling chip for consumer, industrial, and IoT devices. Uses vibrating membrane technology to generate high-velocity air jets with no moving parts, fans, or noise. The original AirJet Mini is 2.8mm thick, 27.5mm x 41.5mm, weighs approximately 9 grams, and removes 5W of heat per chip with 1750 Pascals of backpressure; multiple chips can be added to scale heat removal.
- AirJet Mini Slim Thinner, lighter solid-state active cooling chip launched for the thinnest electronic devices, featuring the same solid-state active cooling design as AirJet Mini with three additional features while remaining silent and delivering superior heat removal compared to traditional fans.
- AirJet Mini G2 Second-generation fanless solid-state cooling chip removing 7.5W of heat in a compact 27mm x 41.5mm x 2.65mm form factor (50% higher performance than its predecessor). Silent, thin, light, dustproof, water-resistant, and vibration-free; winner of three consecutive CES Innovation Awards (2024, 2025, 2026).
- AirJet PAK family (1C / 3C / 5C / G2 / 5C-G2) Ultra-compact, plug-and-play solid-state active cooling modules for Embedded AI Systems including NVIDIA Jetson, Qualcomm, NXP, and AMD/Xilinx SoMs. Configurations include AirJet PAK 1C (9W heat removal, 28 TOPS, 30x65x5.8mm), AirJet PAK 3C (24W heat removal, 80 TOPS, 100x65x5.8mm), AirJet PAK 5C (33W heat removal, 100 TOPS, 100x65x9.3mm), AirJet PAK G2 (second generation), and AirJet PAK 5C-G2. Delivers same performance as traditional passive solutions but 85% smaller and lighter.
- SnowGoose AirJet Development Kit A development kit for AirJet solid-state active cooling technology that enables OEMs, ODMs, engineers, and device manufacturers to evaluate, integrate, and prototype AirJet cooling chips before committing to volume production. Supports a land-and-expand sales motion from prototype evaluation to volume hardware orders.
Quantifiable outcome
- Up to 3x performance improvement vs. throttled/fan-based designs; eliminates thermal throttling
- +6 more outcomes
Companies that use Frore Systems
Customer profileNamed customers13 records
Segments5 records
Ideal customer profiles3 records
Frore Systems technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Integration21 records
Feature8 records
Frore Systems partnerships and signals
Strategic signalPartnerships
Eleven partnerships are on record, tiered flagship strategic partner, major technology partner, major oem partner, flagship technology partner, flagship ai/data center partner, flagship oem launch partner and oem partner.
- Lenovoflagship strategic partnerFrore Systems announced a collaboration with Lenovo's Innovation Accelerator to integrate its AirJet Mini G2 solid-state active cooling chip into future Lenovo products (slim notebooks, tablets, wearables). AirJet Mini G2 removes 7.5W of heat in a compact 27mm × 41.5mm × 2.65mm form factor, enabling ultra-compact AI-enabled devices without thermal throttling. The partnership provides Frore access to one of the world's largest PC makers.
- Qualcommmajor technology partnerAirJet Mini G2 powers silent, sustained AI performance in Qualcomm 2-in-1 Notebook and Mini PC reference designs. AirJet supports Qualcomm Dragonwing IQ9 and Snapdragon Ride4 SoM platforms.
- Sonim Technologies / FirstNet (Built with AT&T)major oem partnerFrore Systems teams up with Sonim Technologies and FirstNet (Built with AT&T) to deliver Sonim MegaConnect — the world's first Power Class 1, ultra-compact 5G mobile hotspot powered by AirJet cooling. Built for First Responders, it delivers 6x transmission power, IP53-rated, and unmatched portability for frontline connectivity.
- Intelflagship technology partnerEngineering collaboration between Intel and Frore Systems to ready AirJet technology for future Intel Evo laptops. Josh Newman, VP & GM Mobile Platforms at Intel, stated: 'Frore Systems' AirJet technology offers a new and novel approach to help achieve thin, light, stylish laptop designs that offer great performance while remaining cool and quiet. Intel is excited about the engineering collaboration with Frore Systems.' Most recently, Intel's Wildcat Lake reference design at Computex 2026 integrates AirJet solid-state cooling for 15W sustained fanless operation in an 11.3mm notebook.
- NVIDIAflagship ai/data center partnerLiquidJet Nexus is purpose-built for NVIDIA Kyber and Vera Rubin platforms (NVIDIA Grace Blackwell superchips). AirJet is integrated into NVIDIA Jetson Orin Nano / NX / AGX system-on-modules for edge AI. LiquidJet coldplate demonstrated cooling 1950W Nvidia Rubin 2 SoCs at CES 2026.
- AMD (Xilinx)major technology partnerAirJet supports AMD/Xilinx embedded platforms including Kria KV260 and Versal VEK280 system-on-modules.
- ZOTACflagship oem launch partnerZOTAC's ZBOX PI430AJ is the world's first solid-state actively cooled Mini PC, powered by AirJet. Doubled performance and added features previously only in larger systems. Tony Wong, CEO of ZOTAC Technology: 'The new AirJet® powered ZBOX PI430AJ delivers superior performance in a silent, miniaturized form, and we're proud that this solid-state actively cooled mini-PC will be a trailblazer in the industry.' Won Japan GOOD DESIGN AWARD.
- Phisonmajor technology partnerAirJet powers Phison's PCIe Gen5 SSD products for gaming. Michael Wu, GM & President of Phison Technology Inc. (USA): 'Phison is ecstatic to be showcasing product performance milestones... Leveraging AirJet, a truly groundbreaking innovation in thermal solutions, we are continuing our legacy of leaning into technology that can bring enhanced experiences to market.'
- iodynemajor oem partnerDeep engineering collaboration between iodyne and Frore Systems to integrate AirJet into iodyne Pro Mini, a smart portable SSD drive for on-set, edit, VFX, virtual production, broadcast, and live event workflows.
- OWC (Other World Computing)major oem partnerOWC integrates AirJet into the first high-performance compact 64TB storage device. Larry O'Conner, CEO of OWC: 'It is very exciting to see the application and benefits for our solutions that the Frore Airjet system presents.'
- Sabrentoem partnerSabrent integrates AirJet into compact portable 8TB SSD accessories, achieving 3x speed performance. William Harmon, CTO of Sabrent: 'Frore Systems AirJet technology will allow Sabrent to create more compact portable storage designs so we can give users more data capacity in a smaller enclosure.'
Scale indicators11 records
Recent moves7 records
Expansion highlights6 records
Frore Systems competitors and assessment
Company assessmentDirect peers
- CoolIT Systems: Direct competitor in direct-to-chip liquid cooling for AI servers and HPC data centers. CoolIT's CHx and Rack offerings overlap with Frore's LiquidJet/LiquidJet Nexus products and serve similar hyperscaler and GPU-accelerated workloads.
- Asetek: Competitor in liquid cooling for high-performance compute. Historically focused on PC/gaming, Asetek has expanded into data-center and AI-server liquid cooling, overlapping with Frore's LiquidJet platform in target use cases.
Emerging players
- ZutaCore: Emerging player in two-phase direct liquid cooling for data centers, addressing the same high-TDP AI server thermal challenges as Frore's LiquidJet.
- Iceotope Technologies: Emerging player in precision liquid cooling for AI and edge data centers, targeting the same hyperscaler and high-density GPU-server workloads as Frore's LiquidJet Nexus.
- Asperitas: Emerging player in immersion cooling for AI and HPC data centers, an alternative thermal architecture competing with Frore's direct-to-chip liquid cooling in the same hyperscale AI thermal-management category.
- Submer: Emerging player in immersion and single-phase liquid cooling for hyperscale and AI data centers, competing for the same high-density AI-server thermal management spend as Frore.
Broad incumbents
- Vertiv: Broad data-center infrastructure incumbent with a substantial thermal management portfolio (LIEBERT coolant distribution, direct-to-chip systems). Vertiv overlaps with Frore's data-center liquid-cooling ambition as a much larger, established supplier.
- Boyd (Boyd Thermal): Broad thermal management incumbent supplying coldplates, heat exchangers, and liquid cooling components to data-center and electronics OEMs, overlapping with Frore's LiquidJet coldplate business.
- Rittal: Broad data-center and enclosure thermal management incumbent (Rittal Liquid Cooling Packages), offering established direct-to-chip and CDU solutions that overlap with Frore's LiquidJet target market.
Regional players
- Auras Technology: Taiwan-based thermal management supplier (vapor chambers, heat pipes, liquid cooling) serving PC, server, and AI customers — a regional peer with comparable thermal-component capabilities, though broader in scope and primarily serving Asia-based OEMs.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat4 records
Key risks7 records
Key highlights7 records
Customer concentration
Frore Systems social profiles
Digital presenceFrore Systems compliance and trust
Trust signalCompliance9 records
Frore Systems financial estimates
Financial estimateRevenue estimate
Valuation estimate
Frore Systems leadership team
Management profileNumber of profiles
Profiles2 records
Frore Systems subsidiaries and ownership
Company hierarchySubsidiaries1 record
Frore Systems funding detail
Funding detailFunding overview
Funding rounds5 records
Investors11 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Frore Systems M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Frore Systems
What does Frore Systems do?
Frore Systems designs, manufactures, and sells proprietary thermal management hardware for AI compute platforms and compact electronic devices. Its AirJet® solid-state active cooling chips (Mini, Mini Slim, Mini G2, and PAK module family) replace mechanical fans in ultra-thin consumer and industrial devices, while its LiquidJet™ direct-to-chip liquid cooling coldplates (LiquidJet DLC Coldplate and LiquidJet Nexus integrated system) cool high-TDP AI GPUs in hyperscale data centers. Products are sold primarily to OEMs, ODMs, and system builders for integration into laptops, mini PCs, SSDs, edge AI SoM modules, 5G hotspots, and AI server systems.
Is Frore Systems a public or private company?
Frore Systems is a private company. It is classified as venture growth investor backed and is currently operating.
When was Frore Systems founded?
Frore Systems was founded in 2018. It employs 101 to 250 people.
Where is Frore Systems based?
Frore Systems is headquartered in San Jose, United States, in the North America region.
How does Frore Systems make money?
Two revenue lines are on record. Hardware sales (chips and coldplates) is the primary driver. The others are snowGoose AirJet Development Kit.
Who are Frore Systems's main competitors?
Direct peers on record are CoolIT Systems and Asetek. Emerging players are ZutaCore, Iceotope Technologies, Asperitas and Submer. Broad incumbents are Vertiv, Boyd (Boyd Thermal) and Rittal. Auras Technology is listed as a regional player.
Does Frore Systems have an API?
No public API is recorded for Frore Systems.
What industry is Frore Systems in?
Frore Systems's product category is Thermal management hardware (semiconductor cooling). Its primary akta.pro industry code is HDAAAAAH, AI Datacenter Power, Cooling & Racks (liquid cooling, power delivery), with a secondary code of HDABAKAD, Cooling Systems & Thermal Management (CRAC/CRAH, Chillers, Liquid Cooling). Its NAICS code is 333415 and its SIC code is 3585.