Name

SemiDrive

Legal name

北京芯驰半导体科技股份有限公司

Website

http://www.semidrive.com/

Company type

Private

Founded year

2018

Operating status

Operating

Headcount range

101–250 employees

Ownership category

akta.pro rank

Product category

Automotive-grade semiconductors (cockpit, ADAS, gateway and zonal SoCs and MCUs)

NAICS

Precision Turned Product Manufacturing (332721), Search, Detection, Navigation, Guidance, Aeronautical, and Nautical System and Instrument Manufacturing (334511), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515), Machine Tool Manufacturing (333517)

SIC

Electronic Components, Nec (3679), Industrial Instruments For Measurement, Display, And Control (3823), Instruments For Meas & Testing Of Electricity & Elec Signals (3825), Measuring & Controlling Devices, Nec (3829)

akta.pro primary industry

Automotive & Safety-Certified Processors (ADAS/Domain/ASIL MCUs) (HDAHAJAJ)

akta.pro secondary industries

Automotive & Industrial-Grade IDMs (HDAHAAAI), Automotive & Industrial ICs (ADAS/Powertrain/Factory/Robotics) (HDAHABAD), Advanced SoCs & Application Processors (HDAHAAAB), Secure ICs, Smart Cards & Trusted Hardware (HDAHAAAJ)

Keywords

• Automotive semiconductors
• Smart cockpit SoCs
• Automotive grade MCUs
• Central gateway processors
• ADAS driving chips

Headquarters

HQ city

Beijing

HQ country

China

HQ region

Asia

Offices6 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Marketing or Sales, Operations, Infrastructure

Revenue model

1. Automotive Chip Hardware Sales: Primary revenue stream: one-time sale of automotive-grade SoCs (X9 cockpit, V9 ADAS, G9 gateway) and MCUs (E3 family) to OEMs and Tier-1 suppliers on a per-unit basis, with revenue scaling in line with mass-production vehicle volumes (12M+ chips shipped cumulatively by mid-2026).
2. Reference-Design and Co-Development Programs: Joint development and reference-design revenue with Tier-1 partners (Bosch, Aptiv, Desay SV, Huayang, Yanfeng) and PMIC partners (Rohm, Richtek), often paired with multi-year supply agreements for winning sockets.
3. Software Stack and Toolchain Licensing: Pre-integrated and licensed software (AUTOSAR Classic/Adaptive via Elektrobit and 普华基础软件, QNX via BlackBerry, Green Hills INTEGRITY, IAR/HighTec/TASKING toolchains, P3 SPARQ OS, 斑马智行 AI OS) bundled or licensed alongside chip sales.
4. Robotics / Industrial SoC Sales: Emerging revenue stream from sales of R1 robot-brain SoC, D9-Max robot-cerebellum SoC and E3119-R robot-joint MCU to embodied-AI and industrial-automation customers (e.g., 银河通用机器人), extending the platform beyond automotive.

Pricing tiers

Go-to-market motion4 records

Distribution channels6 records

Marketing channels6 records

Core offering

SemiDrive is a fabless designer and seller of automotive-grade SoCs and high-performance MCUs, organized into four product pillars: X-series smart cockpit processors (X9 family with X9E/M/H/S/HP/SP/U variants plus the 4nm X10 AI cockpit SoC), G-series central gateway and V2X SoCs (G9X/Q/H), E-series high-performance automotive MCUs (E3 family with E31/32/33/34/E3640/E3650 and powertrain/zone variants E3610/E3620P/E3620B plus AMU E3800/TwinStar E3650-E), and D-series / R1 / E3119-R embedded-intelligence and industrial SoCs. All products are qualified to AEC-Q100, ISO 26262 ASIL-D, ISO/SAE 21434 and China national/commercial cryptography standards, and are sold to Chinese automotive OEMs, Tier-1 suppliers, global OEMs via channel partners, and emerging embodied-AI/robotics customers.

Product overview

SemiDrive (芯驰科技) is a fabless automotive-grade chip designer offering a platform-plus-modules architecture covering three pillars: smart cockpit SoCs (X-series), central gateway/central-computing SoCs (G-series), and high-end automotive MCUs (E-series), plus a new D-series for embodied intelligence and industrial robots. The X9 cockpit family (X9E, X9M, X9H, X9S, X9HP, X9SP, X9U) spans entry to flagship cockpit SoCs and is complemented by the X10 next-generation 4nm AI cockpit SoC. The G9 family (G9S, G9X, G9Q, G9H, G9P) targets central gateways, V2X gateways, and central computing platforms. The E3 high-performance MCU family is organized into E31 (entry), E32/E33/E34 (high-reliability), E36 (E3640 flagship control MCU), and E3650 (22nm cross-domain flagship), with recent additions E3610 (IO-type zone controller), E3620P (powertrain), and E3620B (zone/body). AMU E3800 and TwinStar E3650-E extend the E-series into the "central intelligent control cerebellum." The D9 industrial/robotics processor family includes D9 and D9-Max (embodied-intelligence cerebellum), complemented by R1 (computing brain) and E3119-R (robot joint module MCU). All products are designed for AEC-Q100, ISO 26262, ISO/SAE 21434 and Chinese national cryptography compliance, with mass deployment across 260+ customers and 12 million+ cumulative chips shipped.

Differentiator

Problem solved

Functional benefit

Brands

• X9 Series (X9 智舱处理器): Family of intelligent cockpit processor SoCs (X9E, X9M, X9H, X9S, X9HP, X9SP, X9U) for instrument clusters, IVI, cockpit domain controllers and cabin-parking integration.
• G9 Series (G9 网关处理器)
• E3 Series (E3 智控 MCU)
• D9 Series (D9 工业/机器人处理器)
• X10 Series (AI Cockpit SoC)
• R1 Series (Robot Brain SoC)

Products and services

• X9 Series Smart Cockpit SoCs Family of automotive-grade smart cockpit SoCs (X9E, X9M, X9H, X9S, X9HP, X9SP, X9U) integrating ARM Cortex-A55 CPU, GPU, AI accelerators, video processors and hardware isolation. Sold to automotive OEMs and Tier-1 suppliers for instrument clusters, IVI, cockpit domain controllers and cockpit-parking integration. X9E/X9M/X9H/X9S/X9HP/X9SP are AEC-Q100 Grade 2 and ISO 26262 ASIL B certified. X9SP integrates a dedicated 8 TOPS NPU and automotive ISP for single-chip cockpit-parking integration.
• X10 Series AI Cockpit SoC Next-generation 4nm AI cockpit SoC built on ARMv9.2 CPU (200K DMIPS), 1800 GFLOPS GPU, 40 TOPS NPU and 154 GB/s LPDDR5X 9600 MT/s memory bandwidth. Supports end-side deployment of 7B-parameter multimodal large models, multi-OS hypervisor (QNX 8.0 + Android 16) and up to 12 cameras/16 microphones for AI cockpit scenarios. Sold to automotive OEMs building next-generation AI-driven cockpits.
• G9 Series Central Gateway SoCs Family of multi-core heterogeneous central gateway SoCs (G9X, G9Q, G9H) combining Cortex-A55 CPUs with lockstep Cortex-R5, integrated SDPE network acceleration engine, up to 20x CAN-FD, dual Gigabit TSN Ethernet, PCIe 3.0, hardware HSM with AES/RSA/ECC/SHA and Chinese national crypto SM2/3/4/9. Sold to OEMs and Tier-1s for central gateways, V2X gateways and central computing platforms. AEC-Q100 Grade 2 and ISO 26262 ASIL B certified.
• E3 Series High-Performance Automotive MCUs Family of high-performance automotive MCUs (E31, E32, E33, E34, E3640, E3650) built on ARM Cortex-R5 and Cortex-R52+ cores up to 800 MHz with up to 4 pairs of lockstep cores, ASIL-D, hardware virtualization, CAN-FD/LIN/FlexRay/USB/Gigabit Ethernet TSN, SM2/3/4/9 crypto acceleration and Evita Full+ HSM. Sold to automotive Tier-1s and OEMs for zone controllers, body/chassis, power domain, ADAS, BMS, LiDAR, HUD and display applications.
• E3800 AMU (Central Intelligent Control Cerebellum) Flagship AMU computing base for "central intelligent control cerebellum" — a 10+ core chip with aerospace-grade embedded storage (10-20x traditional eFlash performance for high-speed OTA), ultra-high-bandwidth multi-port Ethernet Switch, multi-layer network acceleration engine, high-performance NPU, and deep CPU+NPU co-pipeline collaboration. Sold to OEMs building next-generation central computing and zonal architectures.
• E3650-E TwinStar AMU Twin-chip AMU pairing two E3650 MCUs via SemiLink ultra-low-latency inter-chip communication (microsecond-level), enabling flexible 10-16 core scalability and physical isolation of different ASIL/security-class workloads. Sold to OEMs needing redundant central-computing MCU configurations for ASIL-D zonal controllers.
• R1 Robot Brain SoC Next-generation robot "brain" SoC based on ARM v9.2 CPU and a new high-performance NPU, enabling end-side deployment of MLLM/VLA end-to-end models at low power for humanoid and embodied-AI robots. Sold to robotics platform developers (e.g., Galactic General Robotics).
• D9-Max Cerebellum SoC Single-chip multi-system SoC for embodied-intelligence cerebellum; 8-core 2.0 GHz Cortex-A55 cluster + 4-core 2.0 GHz Cortex-A55 cluster + 3 pairs of dual-core lockstep 800 MHz Cortex-R5F. Deploys motion control, human-machine interaction and EtherCAT master station on one chip with ASIL B functional safety. Sold to robotics platform developers.
• E3119-R Robot Joint Module MCU Compact robot joint-module MCU with dual Cortex-R5F cores at 400 MHz, automotive-grade functional safety and information security, HSM with SM2/3/4/9 and AES, sub-9x9mm² package, supports IAR/AUTOSAR/FreeRTOS. Sold to robotics platform developers for humanoid robot joint modules.
• D9 Industrial/Robotics Processor Multi-core heterogeneous industrial/robotics SoC with high-performance Cortex-A55 + dual-core lockstep Cortex-R5, secure boot and OS, HSM with TRNG/AES/RSA/SHA/SM2/3/4/9, large 3-level Cache, PCIe 3.0/USB 3.0/Ethernet TSN/SDIO 3.0/CAN FD, ISO 26262 ASIL D process and ASIL B product certified. Sold to industrial automation, smart power, rail and robotics customers.

Quantifiable outcome

• 12M+ automotive-grade chips shipped cumulatively by mid-2026 (11M+ by end-2025)
• +4 more outcomes

Named customers20 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration24 records

AI capability18 records

Feature11 records

Partnerships

28 partnerships are on record, tiered flagship, core and minor.

• ZBO ElectronicsflagshipChannel Partner/ Reseller/ Distributor · 1 April 2026Strategic distribution agreement announced in April 2026 covering Europe, South America, Southeast Asia and India. ZBO provides local FAE, sales and logistics support for SemiDrive's X9, V9, G9 and E3 product families, accelerating customer engagement with global OEMs and Tier-1s outside China.
• 博世 Bosch (博世半导体)flagshipStrategic or Co-development Partner · 1 April 2025Strategic collaboration announced in April 2025 covering next-generation central-computing and zonal architectures. SemiDrive SoCs and MCUs are integrated into Bosch domain-controller reference designs and ecosystem programs. The partnership anchors SemiDrive's expansion into global Tier-1 platforms and complements joint work with Rohm and Richtek on PMIC pairings.
• Elektrobit (伊必)coreTechnology or IntegrationLong-standing AUTOSAR Classic and Adaptive software partner. Elektrobit's EB tresos, EB corbos and EB zenturios products are pre-integrated and reference-validated with SemiDrive X9, V9, G9 and E3 platforms, accelerating customer time-to-mass-production.
• Rohm (罗姆)coreTechnology or IntegrationPMIC reference-design partner. Joint PMIC + SoC reference designs combine Rohm PMICs with SemiDrive X9/V9/G9 cockpit, ADAS and gateway chips, providing OEMs with validated power solutions for mass-production vehicle programs.
• 立锜 RichtekcoreTechnology or IntegrationPMIC reference-design partner paired with Rohm to deliver validated power solutions for X9/V9/G9/E3 platforms, enabling Tier-1 and OEM customers to accelerate PCB bring-up and certification.
• QNX (BlackBerry QNX)coreTechnology or IntegrationOperating-system partner for safety-critical cockpit and ADAS platforms. QNX Neutrino RTOS and QNX Hypervisor are pre-integrated with X9 and V9 SoCs, supporting mixed-criticality multi-OS environments and ASIL-D isolation.
• Green Hills SoftwarecoreTechnology or IntegrationReal-time OS and safety-development toolchain partner. INTEGRITY RTOS and MULTI IDE are pre-validated on SemiDrive platforms to support safety-critical automotive and ADAS development.
• IAR SystemscoreTechnology or IntegrationDevelopment-toolchain partner. IAR Embedded Workbench is the lead compiler/IDE for SemiDrive MCU and SoC platforms, including functional-safety certified editions.
• Vector (Vector Informatik)coreTechnology or IntegrationAUTOSAR and MICROSAR software partner. Vector's classic and adaptive AUTOSAR stacks, CANoe and vADASdeveloper are integrated with SemiDrive platforms for OEM software development.
• 普华基础软件 (PuHua Basic Software)coreTechnology or IntegrationDomestic AUTOSAR software partner. Pre-integrated AUTOSAR Classic BSW supports Chinese OEMs requiring localised software stacks with SemiDrive chips.
• 伊世智能 (SecIC-HSM)coreTechnology or IntegrationInformation-security firmware partner. Provides HSM firmware and security services for the Xuanwu ultra-secure HSM, including China state cryptographic algorithm implementations.
• 华阳通用 ADAYO (Huayang General)coreOEM/ Whitelabel/ Licensing PartnerLong-standing Tier-1 cockpit-electronics partner. SemiDrive X9 and other SoCs are designed into ADAYO cockpit domain controllers shipped to Chinese OEMs; recognised as ADAYO Outstanding Supplier for five consecutive years.
• 德赛西威 Desay SVcoreOEM/ Whitelabel/ Licensing PartnerTier-1 cockpit and intelligent-driving partner. SemiDrive SoCs integrated into Desay SV cockpit and ADAS controllers serving Chinese OEMs.
• 延锋国际 Yanfeng InternationalcoreOEM/ Whitelabel/ Licensing PartnerGlobal cockpit-electronics Tier-1 customer/partner. SemiDrive chips integrated into Yanfeng cockpit platforms; recipient of Yanfeng Outstanding Supplier Award.
• 安波福 AptivcoreOEM/ Whitelabel/ Licensing PartnerGlobal Tier-1 partner integrating SemiDrive chips into next-generation cockpit and ADAS controllers for global OEM programs.
• 航盛集团 Hangsheng GroupminorOEM/ Whitelabel/ Licensing PartnerCockpit-electronics Tier-1 partner; recipient of Hangsheng Technology Innovation Award.
• 宏景智驾 Hongjing Smart DriveminorOEM/ Whitelabel/ Licensing PartnerADAS/AD Tier-1 partner using SemiDrive V9 SoCs in autonomous-driving controllers.
• 智华科技 Zhihua TechnologyminorOEM/ Whitelabel/ Licensing PartnerTier-1 cockpit partner integrating SemiDrive SoCs into OEM cockpit products.
• 上海金脉 Shanghai JinmaiminorOEM/ Whitelabel/ Licensing PartnerTier-1 partner for cockpit and ADAS controllers using SemiDrive platforms.
• 光庭信息 Guangting InformationminorImplementation/ SI/ Consulting PartnerSoftware engineering and digital-twin Tier-1 partner, contributing cockpit and ADAS application software on SemiDrive platforms.
• 天准科技 TZZ TechnologyminorOEM/ Whitelabel/ Licensing PartnerTier-1 vision-based ADAS partner integrating SemiDrive V9 SoCs into mass-production ADAS controllers.
• 东软睿驰 Neusoft Reach / 卓驭 Zhuoyu (DJI Automotive)coreOEM/ Whitelabel/ Licensing PartnerTier-1 intelligent-driving partners integrating SemiDrive V9 ADAS SoCs into mass-production L2+ controllers.
• 联想 LenovocoreStrategic or Co-development PartnerComputing-platform and robotics co-development partner; SemiDrive chips support Lenovo's edge-AI computing and robotics platform initiatives.
• 欣旺达 SunwodaminorOEM/ Whitelabel/ Licensing PartnerBattery-management partner; SemiDrive MCUs used in BMS solutions for EV battery packs.
• 银河通用机器人 (Galactic General Robotics)flagshipStrategic or Co-development PartnerStrategic robotics partner for embodied AI. SemiDrive provides R1 robot-brain SoC, D9-Max robot-cerebellum SoC and E3119-R robot-joint MCU, supporting Galactic General's humanoid-robot platform.
• 理想汽车 Li Auto (星环OS / Starry OS)flagshipStrategic or Co-development PartnerStrategic OS co-development partner. SemiDrive and Li Auto jointly developed the Starry OS (星环OS) ecosystem to run on SemiDrive cockpit and central-computing SoCs in Li Auto mass-production vehicles.
• 中国汽车芯片产业创新战略联盟 (China Automotive Chip Industry Innovation Strategic Alliance)coreOthersFounding/active member of the China Automotive Chip Industry Innovation Strategic Alliance. Recognised as an Outstanding Contributor in 2025; participates in industry standards, ecosystem development and policy advocacy.
• 国家新能源汽车技术创新中心 (NEVC / 国创中心)coreStrategic or Co-development PartnerR&D collaboration partner with the National New Energy Vehicle Technology Innovation Center, contributing to next-generation automotive chip architectures and ecosystem programs.

Scale indicators10 records

Recent moves7 records

Expansion highlights6 records

Direct peers

• Horizon Robotics: Chinese fabless automotive AI chip designer offering Journey-series ADAS SoCs and cockpit processors to Chinese OEMs. Direct competitor to SemiDrive's V9 ADAS and X9 cockpit SoCs, with overlapping customer base across Chinese passenger-vehicle OEMs and similar go-to-market through Tier-1 partners.
• Black Sesame Technologies: Hong Kong-listed Chinese automotive AI chip company providing Huashan-series ADAS SoCs and Wudang-series cross-domain compute chips. Direct peer competing for the same Chinese OEM ADAS and central-compute design wins that SemiDrive's V9 and G9/H-series target.
• SiEngine Technology: Chinese automotive-grade SoC designer (backed by Geely/Ecarx) offering Longying cockpit SoCs and ADAS solutions. Direct competitor to SemiDrive's X9 cockpit and gateway chips, particularly within Geely-affiliated OEM programs.

Broad incumbents

• Mobileye: Global incumbent in ADAS and autonomous-driving SoCs (EyeQ family), with deep penetration at Chinese and global OEMs. Competes with SemiDrive's V9 ADAS family in NOA/L2+ programs and represents the primary global benchmark SemiDrive must displace to grow V9 volumes.
• Qualcomm (Snapdragon Auto): Dominant foreign supplier of digital cockpit and ADAS SoCs to Chinese premium OEMs (SAIC, Geely, NIO, Li Auto tiers). Competes head-to-head with SemiDrive X9/X10 cockpit and V9 ADAS platforms for high-end multi-display and AI-cockpit sockets.
• NXP Semiconductors: Global automotive semiconductor leader with strong positions in gateway, body/chassis MCU and secure communications. Competes with SemiDrive's G9 gateway and E3 MCU families, particularly at global Tier-1s and for non-China production programs.
• Renesas Electronics: Japanese automotive MCU and SoC incumbent with R-Car cockpit family and RH850 MCU line. Direct benchmark for SemiDrive's E3 high-performance MCU family and competing cockpit offering in Japanese OEM and global Tier-1 designs.
• Infineon Technologies: Global leader in automotive MCUs (AURIX TC3xx) and power semiconductors, deeply embedded in Chinese and global OEM platforms. Primary foreign competitor to SemiDrive's E3/E3650 ASIL-D MCU family at Bosch, Continental and Chinese Tier-1s.
• Texas Instruments: Broad automotive analog and MCU incumbent (Jacinto cockpit, TMS570 MCU). Competes across multiple SemiDrive product lines, particularly at cost-sensitive Chinese OEM sockets and in body/chassis applications served by E3 MCU family.
• Nvidia (Automotive): Dominant high-end automotive AI compute platform (Drive Orin/Thor) used by many Chinese NEVs for autonomous-driving training and inference. Represents the high-end benchmark SemiDrive's 500+ TOPS V9 and future AMU E3800 platforms compete against in premium L2+/L3 programs.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat7 records

Key risks7 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/semidrive-semiconductor

Compliance13 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles7 records

Funding overview

Funding rounds7 records

Investors37 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about SemiDrive