What Biwin does

Biwin Storage Technology Co., Ltd. (Shanghai Stock Exchange STAR Market: 688525) is a Chinese semiconductor memory company founded in 2010 and headquartered in Shenzhen, China. The company designs, manufactures, and sells flash storage products and memory modules across five product lines: embedded storage (eMMC, UFS, ePOP, BGA SSD, LPDDR), PC storage (consumer SSD, memory modules), industrial and automotive storage, enterprise storage (enterprise SSDs, RDIMM server memory), and mobile storage (portable SSDs, memory cards). Biwin operates a vertically integrated R&D-Packaging-Testing business model spanning storage media characteristics research, firmware algorithm development, in-house controller IC design (eMMC and UFS controllers), advanced packaging (BGA, LGA, QFN, SiP, TSOP), wafer-level advanced packaging (FOWLP/FIWLP, 2.5D with 16/32-layer stacked Die and 30-40μm ultra-thin Die processing), and self-developed storage test equipment. Per Frost & Sullivan, Biwin is the world's only independent storage solution provider with wafer-level packaging capability, ranked #2 globally in embedded storage among independent providers and #1 globally in AI emerging end-side device storage.

The company generates revenue through hardware sales of self-designed and packaged memory/storage products, advanced packaging and testing OEM/ODM services for third-party semiconductor customers (10-year cumulative packaging volume exceeding 1 billion units), exclusive brand licensing from HP for SSD and memory products (since 2016-2017), and customized storage solutions. Key customers include Google, Meta, Xiaomi, Lenovo, ASUS, Acer, GIGABYTE, One-Netbook, GPD, and 20+ domestic Chinese automakers and Tier-1 suppliers. The company reports serving 500+ customers across 60+ countries, with subsidiaries and offices in Huizhou (manufacturing), Dongguan (wafer-level packaging), Chengdu, Hangzhou, Beijing, Wuhan, Shanghai, Hong Kong, Taipei, Miami, and Fremont. Biwin benefits from strategic backing by the National IC Industry Investment Fund Phase II ("Big Fund"), China Internet Investment Fund, and CAS Investment.

The company's go-to-market combines direct enterprise sales to OEMs, exclusive brand licensing (HP, Predator), authorized distributors, and own-brand e-commerce (佰微/biwintech on Tmall/JD). Notable product lines include the BIWIN Mini SSD (TIME Best Inventions 2025, Edison Award Bronze 2026), ePOP5x embedded storage integrating eMMC+LPDDR5X, TAU208 automotive-grade UFS 3.1 (AEC-Q100 Grade 2), TGE408 industrial wide-temperature eMMC with self-developed controller, SP406 enterprise SSD, and M560 PCIe 5.0 consumer SSD. FY2025 revenue reached RMB 11.302 billion (+429% YoY net profit growth) with 2020-2024 revenue CAGR of 42.1%; Q1 2026 revenue was RMB 6.814 billion (+341.53% YoY), reflecting explosive AI/memory upcycle dynamics.

Name

Biwin

Legal name

深圳佰维存储科技股份有限公司 (BIWIN STORAGE TECHNOLOGY CO., LTD.)

Website

http://www.biwin.com.cn

Company type

Public

Founded year

1995

Operating status

Operating

Headcount range

1,001–5,000 employees

Short description

Biwin is a Chinese vertically integrated semiconductor memory company designing and manufacturing flash storage (embedded, PC, enterprise, automotive) and memory modules for OEM customers including Google, Meta, Xiaomi, Lenovo, and 20+ automakers, serving 500+ customers across 60+ countries with proprietary controllers and wafer-level packaging capability.

Ownership category

akta.pro rank

Product category

Semiconductor Memory Storage

NAICS

Computer Storage Device Manufacturing (334112), Semiconductor and Related Device Manufacturing (334413), Computer and Peripheral Equipment Manufacturing (33411)

SIC

Computer Storage Devices (3572), Semiconductors & Related Devices (3674), Electronic Components, Nec (3679)

akta.pro primary industry

Embedded & Managed NAND (eMMC/UFS/eMCP) (HDAHAKAG)

akta.pro secondary industries

Memory Modules & Subsystems (DIMM/SO-DIMM/HBM stacks) (HDAHAKAH), Storage/IO Controllers & Bridge ICs (USB/PCIe/SATA/NVMe) (HDAHAJAI), Storage Controllers (SSD/UFS/eMMC) (HDAHAKAD), DRAM (DDR/LPDDR/HBM) (HDAHAKAA)

Keywords

• Semiconductor memory storage
• Embedded flash storage
• Enterprise SSD solutions
• IC packaging and testing
• Memory modules DRAM

Headquarters

HQ city

Shenzhen

HQ country

China

HQ region

Asia

Offices15 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Technology or R&D, Infrastructure, Personnel, Operations, Marketing or Sales

Revenue model

1. Semiconductor memory product sales: Primary revenue driver. Sales of self-designed and packaged memory/storage products across five categories: embedded storage (eMMC, UFS, ePOP, BGA SSD, LPDDR), PC storage (consumer SSD, memory modules), industrial & automotive storage, enterprise storage (SP406/SP416/SP506/SP516 enterprise SSDs, RDIMM server memory), and mobile storage (portable SSDs, CFexpress cards, SD cards). Hardware sales with multi-year LTA-based procurement contracts (e.g., $1.86 billion two-year NAND supply agreement signed June 2026 to lock Q3 2026–Q2 2028 supply).
2. Advanced packaging & testing services: Revenue from IC packaging/testing OEM/ODM services offered to third-party semiconductor customers. Biwin operates as one of South China's leading rapid packaging enterprises, offering product selection, feasibility assessment, custom design/development, test validation, and production manufacturing services with engineering samples delivered within 24 hours. 10-year cumulative packaging volume exceeding 1 billion units.
3. Brand licensing (HP authorized brand operation): Exclusive brand authorization from HP for SSD and memory products, rapidly expanding global market channels with reputation and sales ranking among industry leaders. Brand-licensed HP-branded portable SSDs, overclocked memory modules and other products marketed under HP and Predator (掠夺者) sub-brands.
4. Customized storage solutions ("千端千面"): Customer-specific custom storage design services including firmware customization, hardware design, and packaging modifications. Includes rapid-turn IC packaging engineering services for external semiconductor customers. Custom design services for industrial, automotive, AI-end-side, and enterprise customers.

Pricing tiers

Go-to-market motion1 record

Distribution channels9 records

Marketing channels13 records

Core offering

Biwin designs, manufactures, and packages semiconductor memory and storage products, including embedded storage (eMMC, UFS, ePOP, BGA SSD, LPDDR, uMCP, SPI NAND/NOR), consumer and enterprise SSDs, memory modules (SODIMM, UDIMM, RDIMM), automotive-grade storage (AEC-Q100 UFS), industrial wide-temperature eMMC, portable SSDs, and storage cards (CFexpress, SD, microSD, CF). The company also provides third-party IC advanced packaging and testing services with 24-hour rapid sample turnaround and self-developed BiwinSight server test software.

Differentiator

Problem solved

Functional benefit

Brands

• 佰微 (biwintech): Consumer-facing brand for scenario-based customized storage solutions launched in 2020-2021 to serve end consumers with personalized storage products.
• HP (Hewlett-Packard) authorized SSD and memory brand
• Predator (掠夺者) authorized brand

Products and services

• BIWIN eMMC Embedded MultiMediaCard (eMMC) storage with integrated controller supporting eMMC 5.0/5.1 protocols. Capacity 4GB-256GB, sequential read up to 320 MB/s, write up to 260 MB/s. Validated on Qualcomm, MediaTek, and Spreadtrum SoCs for smartphones, tablets, smart wearables, smart speakers, networking, and video surveillance.
• BIWIN UFS Universal Flash Storage (UFS) supporting UFS 2.1/2.2/3.1 standards with speeds up to 3x faster than eMMC 5.1. Sequential read 2,100 MB/s, write 1,200 MB/s. Capacity 64GB-1TB. Targeted at automotive, laptops, and domestic Chinese IT (Xinchuang) storage.
• BIWIN ePOP / ePOP5x Package-on-Package (ePOP / ePOP5x) combining eMMC and Mobile LPDDR (LPDDR4X or LPDDR5X) in a single ultra-thin package. ePOP5x is the next-generation variant (8.0x9.5x0.54mm) doubling transfer rate versus predecessor while reducing power ~25% and thickness ~32%. Targets smart wearables, AI glasses, smart watches, and education electronics.
• BIWIN eMCP Multi-chip package (eMCP) combining eMMC and LPDDR4X, integrating flash and low-power DRAM in a single package to simplify device manufacturing. Capacities from 8GB+512MB up to 128GB+6GB.
• BIWIN uMCP (LPDDR5 / LPDDR4X) Integrated UFS 3.1 (or UFS 2.2) and LPDDR5X (or LPDDR4X) in a single chip, saving 55% motherboard space versus discrete solutions. Capacities up to 256GB+8GB. Targeted at smartphones.
• BIWIN BGA SSD (PCIe and SATA) Embedded SATA or PCIe BGA SSD family supporting SATA III, PCIe Gen3.0 x2, and PCIe Gen4.0 x2. Up to 3,500 MB/s read and 2,700 MB/s write. Capacities 128GB-1TB. Validated on Qualcomm, MediaTek, and Intel platforms.
• BIWIN EP410 PCIe Gen4x4 BGA SSD PCIe Gen4x4 BGA SSD supporting NVMe 2.0. Sequential read/write up to 7,300/4,600 MB/s. Capacity 256GB-2TB. 16x12x1.4mm form factor. Targeted at high-performance thin laptops, flagship smartphones, autonomous driving, and drones.
• BIWIN LPDDR4 / LPDDR4X Memory Low Power DDR4/DDR4X memory with 50% performance improvement over LPDDR3. Capacity 4Gb-64Gb. Up to 1,600 MHz. Validated on Qualcomm, MediaTek, Spreadtrum, HiSilicon, and Rockchip SoC platforms.
• BIWIN LPDDR5 (EX500) LPDDR5 memory supporting multi-Bank Group mode. Data rate from 4,266 Mbps up to 6,400 Mbps with multi-voltage dynamic regulation reducing power consumption by 30%. 12.4x15.0mm package. Validated on MediaTek MT6983, MT6877V/ZA, MT6877T platforms.
• BIWIN LPDDR5X Next-generation high-efficiency LPDDR5X memory using 1bnm process technology. Data transfer rate up to 8,533 Mbps (33% improvement), power consumption reduced 25%. Capacity 8GB/12GB/16GB. Certified on Rockchip RK3576 platform.
• BIWIN SPI NOR Flash (TGN298 series) Industrial-grade wide-temperature SPI NOR Flash supporting single, dual, and quad SPI interfaces. Data throughput up to 480 Mb/s. Capacity 32Mb-128Mb. 100,000 write/erase cycles. 3.3V. -40C to +85C. Targeted at industrial, automotive, audio/video entertainment, smart home.
• BIWIN SPI NAND Serial Peripheral Interface NAND Flash using industrial-grade SLC NAND. 128MB/512MB density. 80 MHz clock. 8x6x0.8mm or 10.3x10.6x1.5mm packages. -40C to +85C. Data retention 10 years, 100,000 erase cycles. Validated on MediaTek and ZTE platforms.
• BIWIN DMMC (Discrete eMMC) Discrete Mobile MMC with low-power controller and hardware ECC engine supporting TLC and MLC NAND. Supports eMMC 5.1 and eMMC 4.51. 9.00x11.00x1.00mm form factor. Capacity 4GB-16GB. BGA132/BGA152/TSOP48 packages. -20C to +70C.
• BIWIN Mini SSD Ultra-compact SSD with 15x17x1.4mm form factor (~40% the volume of an M.2 2230 SSD, ~1 gram weight). PCIe Gen4x2 interface. Sequential read/write up to 3,700/3,400 MB/s. 3D TLC NAND. Capacity 512GB-2TB. <5W power. IP68 dust/water resistance, 3-meter drop resistance, 12,000+ insertion cycles. SIM-card-style slot. Supports dynamic SLC cache, wear leveling, TRIM, GC, HMB, S.M.A.R.T. -40C to +85C. MTBF >1.5 million hours.
• BIWIN M560 PCIe 5.0 SSD PCIe 5.0x4 SSD with NVMe 2.0 protocol for laptops and handheld AI devices. Sequential read/write 11,000/10,000 MB/s. 2TB version random read/write 1,700K IOPS. 1,500 TBW write endurance. Uses 6nm low-power main controller with full-load power under 5.2W (>35% lower than typical Gen5 SSDs). 5-year warranty.
• Amber PX4000 USB4 Portable SSD USB4 Gen3x2 portable SSD for professional creators and mobile workers. Compatible with Thunderbolt 4/3. Transfer rate up to 40 Gbps. Up to 8TB capacity. IP67 dust/water resistance. 3-meter drop protection. Aluminum alloy heat dissipation + high-strength silicone shell. Compatible with Windows, macOS, iOS, Android.
• BIWIN TAU208 Automotive UFS 3.1 Automotive-grade UFS 3.1 storage. M-PHY 4.1, UniPro 1.8, dual-channel architecture. 23.2 Gbps theoretical bandwidth. Sequential read/write 2,150/1,650 MB/s. Random R/W 300K+ IOPS. 6x faster than eMMC. -40C to +105C. AEC-Q100 Grade 2. LDPC-based ECC + NAND-level redundancy. MTBF >30 million hours. Targeted at smart cockpit, autonomous driving, IVI, digital dashboard/center console.
• BIWIN TGE408 Industrial Wide-Temperature eMMC Industrial wide-temperature eMMC with proprietary self-developed main controller chip and firmware algorithm. eMMC 5.1 protocol, HS400 high-speed mode. -40C to +85C. 8-16GB (pSLC mode) / 64-128GB (TLC mode). 330 MB/s read, 220 MB/s write. Win-pSLC technology (100K P/E cycles). MTBF >3 million hours. Applications: industrial automation, power/energy, industrial robots, smart security, rail transit, AIoT, smart medical.
• BIWIN SP406 Enterprise SSD 2.5-inch U.2 PCIe 4.0 enterprise SSD supporting NVMe 1.4 protocol. SK Hynix V6 4D TLC NAND. Sequential read/write 7,050/4,200 MB/s. Random 4KB read/write 1,350K/200K IOPS. Capacity 960GB/1.92TB/3.84TB/7.68TB. Power 8.5W-14.5W. 1 DWPD. AES256 encryption, Sanitize, End-to-End Data Path Protection, Internal Die RAID, Secure Boot, TCG Opal 2.0. 5-year warranty. MTBF 2.5 million hours.
• BIWIN RD100 RDIMM Server Memory RDIMM server memory module with operating frequency up to 3,200 Mbps. Capacity 16GB/32GB. ECC error correction, smart thermal control, low voltage operation. Validated via BiwinSight Server testing software and Intel AVL certification for compatibility with mainstream CPUs, motherboards, and operating systems.
• BIWIN DDR4 / DDR5 SODIMM and UDIMM Memory Modules Memory module product line including industrial wide-temperature ECC DDR4 SODIMM modules and consumer/enterprise DDR5/DDR4 SODIMM and UDIMM modules. DDR4 SODIMM offers data rate up to 3,200 Mbps, 4GB-16GB capacity, 260-pin, 1.2V, -40C to +85C wide temperature, and anti-sulfuration testing for power, telecom, industrial PC, rail transit, self-service terminal, and medical applications.
• Amber CB500 CFexpress Type B Card CFexpress Type B card with VPG800 certification from the CompactFlash Association, guaranteeing sustained write speeds of 800 MB/s. Supports 4K, 6K, 8K, and 12K high-bitrate video recording; up to 40Gb/s with compatible card readers. First CFexpress Type B card in the world to receive VPG800 certification.
• BIWIN SD Card, microSD Card, CF Card, and CFast Card Removable storage card product line spanning industrial and consumer applications. Includes SD cards, microSD cards (e.g., TGC209 for multi-channel video stable write without dropped frames), CF cards, and CFast cards for cameras, surveillance, and embedded systems.
• BIWIN Xinchuang SSD (Domestic Substitution Storage) Xinchuang (domestic substitution / 信创) SSD product line including 2.5-inch SATA SSD, M.2 SATA SSD, and M.2 NVMe SSD variants for domestic Chinese IT platforms. Compatible with domestic CPU platforms (Loongson, Kunpeng, Phytium, Zhaoxin, Hygon, Sunway) and operating systems (UOS, Kylin).
• IC Advanced Packaging and Testing Services Third-party IC advanced packaging and testing services offered by Biwin's Huizhou manufacturing subsidiary (Guangdong Tailai Packaging and Testing Technology Co., Ltd.). Includes product selection, feasibility assessment, custom design and development, test validation, and production manufacturing. Engineering samples delivered within 24 hours. Capabilities span BGA, LGA, QFN, SiP, TSOP packaging and wafer-level advanced packaging (FOWLP/FIWLP, 2.5D). 10-year cumulative packaging volume exceeding 1 billion units. One of South China's leading rapid packaging enterprises.
• Biwin Intelligence SSD Management Software Proprietary SSD management software bundled with partner SSDs (e.g., Acer MA200, FA300 Gen5) for drive cloning, data migration, and performance monitoring.

Quantifiable outcome

• 2025 revenue RMB 11.302 billion, +429% net profit YoY
• +9 more outcomes

Named customers27 records

Ideal customer profiles5 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration7 records

Feature7 records

Partnerships

23 partnerships are on record, tiered flagship technology partner, flagship strategic customer, flagship oem partner, flagship ecosystem partner, flagship brand licensing partner, core us grassroots marketing partner, core technology partner, mid-tier ecosystem partner, mid-tier technology partner, industry peer, regional channel partner, talent pipeline partner and industry association partner.

• Intelflagship technology partnerStrategic or Co-development PartnerCo-host of BIWIN Mini SSD Ecosystem Application Seminar at Intel Greater Bay Area Innovation Center in Shenzhen; Biwin Mini SSD ecosystem partner accelerating standards compatibility, technical adaptation and solution implementation. Joint roadmap for Mini SSD ecosystem expansion and AI storage integration.
• Lenovo (联想)flagship strategic customerStrategic or Co-development PartnerLong-term strategic partner in PC storage (consumer SSDs, memory modules); deepening cooperation in enterprise storage for data centers and cloud computing since May 2026 senior executive visit. Lenovo's "global resources, local delivery" supply chain model leverages Biwin's storage supply.
• ASUS (ROG)flagship oem partnerOEM/ Whitelabel/ Licensing PartnerBiwin co-developed and manufactured the ASUS ROG Phantom Blade 48GB DDR5-6000 20th Anniversary Edition memory kit using SK Hynix M-Die chips. Also part of ASUS ROG Certified Memory Program alongside Corsair, G.SKILL, Kingston, and Silicon Power for compatibility certification on ASUS gaming motherboards.
• GIGABYTEflagship ecosystem partnerStrategic or Co-development PartnerOne of seven memory partners in GIGABYTE's CQDIMM ecosystem for Z890 Plus series motherboards; collaboration to validate high-frequency DDR5 performance up to 10,400 MT/s for AI computing, gaming, and content creation workloads.
• HP (Hewlett-Packard)flagship brand licensing partnerOEM/ Whitelabel/ Licensing PartnerExclusive brand authorization for SSD and memory products including HP and Predator (掠夺者) sub-brands since 2016-2017. Rapid global market channel build-out, with reputation and sales rankings among industry leaders.
• BYD Electronics (比亚迪电子)flagship ecosystem partnerStrategic or Co-development PartnerMini SSD ecosystem partner; co-building industry standards, technical adaptation, and solution implementation for accelerated mass production in key vertical applications.
• Luxshare Precision (立讯精密)flagship ecosystem partnerStrategic or Co-development PartnerMini SSD ecosystem partner co-building industry standards, technical adaptation, and solution implementation; major Apple supply chain partner expanding into storage.
• Longcheer (龙旗)flagship ecosystem partnerStrategic or Co-development PartnerMini SSD ecosystem partner co-building industry standards and accelerating technical adaptation; major ODM in mobile devices.
• LANFestcore us grassroots marketing partnerGTM or Marketing PartnerNonprofit organization promoting grassroots PC gaming communities. Co-sponsorship of 24+ LAN events across the U.S. starting March 2026 with product demos, giveaways, and educational content.
• Silicon Motion Technology (慧荣科技)core technology partnerTechnology or IntegrationBiwin uses Silicon Motion PCIe Gen5 SSD controllers (SM2508, SM2269XT, SM2268XT2) across consumer and enterprise product lines. Joint showcase at CES 2025; co-presentation with ADATA, Lexar, and Fanxiang to expand PCIe Gen5 applications into USB and external SSDs.
• One-Netbook (壹号本)flagship ecosystem partnerStrategic or Co-development PartnerMini SSD deployed in One-Netbook three-in-one AI PC products; ecosystem partner co-building Mini SSD industry standards.
• GPDflagship ecosystem partnerStrategic or Co-development PartnerMini SSD integrated into GPD gaming handheld products; flagship consumer commercialization partner for AI PC and gaming handheld segments.
• Innogrit (英韧科技)core technology partnerStrategic or Co-development PartnerStrategic partnership on storage controller technology since 2019. Co-development of storage solutions leveraging Innogrit's controller technology.
• Sixunited Intelligentmid-tier ecosystem partnerStrategic or Co-development PartnerMini SSD ecosystem participant at the BIWIN-Intel co-hosted seminar in Shenzhen for Mini SSD integration and collaboration discussions.
• Maxio Technology (联芸科技)mid-tier technology partnerTechnology or IntegrationController chip partner (Maxio controller used in Biwin server SSDs); Mini SSD ecosystem participant at the BIWIN-Intel co-hosted seminar in Shenzhen.
• Corsairindustry peerStrategic or Co-development PartnerOne of seven memory partners in GIGABYTE CQDIMM ecosystem (alongside BIWIN, G.SKILL, KINGSTON, TeamGroup, V-COLOR, XPG) and ASUS ROG Certified Memory Program (alongside BiWin, G.SKILL, Kingston, Silicon Power). Co-validating high-frequency DDR5 performance.
• G.SKILLindustry peerStrategic or Co-development PartnerCo-partner in GIGABYTE CQDIMM ecosystem and ASUS ROG Certified Memory Program validating high-frequency DDR5 performance for AI computing, gaming, and content creation workloads.
• Kingston Technologyindustry peerStrategic or Co-development PartnerCo-partner in GIGABYTE CQDIMM ecosystem and ASUS ROG Certified Memory Program validating high-frequency DDR5 performance.
• Silicon Powerindustry peerStrategic or Co-development PartnerCo-partner in ASUS ROG Certified Memory Program validating compatible RAM for ASUS gaming motherboards.
• Fortune Marketing Private Limitedregional channel partnerChannel Partner/ Reseller/ DistributorAuthorized distributor of Acer FA300 PCIe Gen5 SSD (with Biwin Intelligence software platform) in India market.
• Xi'an Electronic Science and Technology University (西安电子科技大学)talent pipeline partnerOthers"Talent Joint Training" cooperation agreement signed; supports Biwin's pipeline of integrated circuit talent and joint research initiatives in storage technology.
• Southwest Jiaotong University (西南交通大学)talent pipeline partnerOthers"Biwin Scholarship" partnership; supports industry-university integration in integrated circuit education and research.
• Shenzhen Auto Electronics Industry Association (深圳市汽车电子行业协会)industry association partnerOthersBiwin serves as Vice-Chairman Unit (副会长单位); promotes automotive data storage development and serves as platform for industry collaboration with automakers and Tier-1s.

Scale indicators15 records

Recent moves12 records

Expansion highlights6 records

Direct peers

• Kingston Technology: Largest independent memory module and storage products company globally. Direct competitor in DRAM modules, SSDs, embedded storage, and USB drives with comparable enterprise/consumer channel reach. Co-partner with Biwin in GIGABYTE CQDIMM and ASUS ROG Certified Memory programs.
• ADATA Technology: Taiwan-listed memory and storage company with overlapping DRAM modules, SSDs, and embedded storage products. Co-presented PCIe Gen5 products with Biwin and Silicon Motion at CES 2025 and participates in the same GIGABYTE CQDIMM ecosystem.
• Phison Electronics: Leading Taiwanese NAND flash controller and storage solution provider. Comparable in controller IP and SSD module design; competes in embedded (eMMC/UFS) and PCIe Gen5 SSD markets with similar customer overlap (Silicon Motion ecosystem).
• Longsys (江波龙电子): Shenzhen-headquartered Chinese memory storage company (Shenzhen-listed) competing directly in embedded storage, SSDs, and memory modules. Closest Chinese domestic peer to Biwin in product mix, customer base, and target markets (mobile, PC, automotive, industrial).
• Lexar (Longsys-owned brand): Consumer storage brand under Longsys competing in portable SSDs, memory cards (CFexpress, SD), and DRAM modules. Co-presented with Biwin at CES 2025 and overlaps in the same retail and channel partnerships.
• Silicon Motion Technology: Taiwanese NAND flash controller specialist (NASDAQ: SIMO) supplying controllers to Biwin and many peers. Direct overlap in controller IP for eMMC, UFS, and PCIe SSDs, and joint ecosystem partner in Mini SSD initiatives and CES 2025 PCIe Gen5 showcase.

Broad incumbents

• Samsung Semiconductor (Memory Division): Global #1 memory manufacturer with vertically integrated NAND, DRAM, controllers, and packaging. Broad incumbent offering eMMC, UFS, SSDs, and memory modules across consumer, enterprise, and automotive — Biwin competes against Samsung at the high end of every product line.
• SK hynix: Global #2 memory manufacturer supplying NAND wafers (likely counterparty in Biwin's $1.86B LTA) and competing in enterprise SSDs (SK hynix V6 4D TLC used in Biwin SP406) and DRAM. Vertical integration makes SK hynix a key supplier and a structural competitor.
• Western Digital (Sandisk): Global incumbent in NAND flash and storage products (post Sandisk spin-off). Competes with Biwin in retail SSDs, portable SSDs, memory cards, and embedded storage; co-recognized alongside Biwin at GMIF2025 Awards.
• Micron Technology: Global memory manufacturer with vertically integrated NAND/DRAM, competing with Biwin in enterprise SSDs, automotive storage (AEC-Q100 portfolio), and embedded solutions. Sets the competitive ceiling on pricing and technology for the broader memory industry.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks7 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/biwin-inc-

Compliance15 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles6 records

Subsidiaries12 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments5 records

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Biwin