Yield Engineering Systems
- Company typePrivate
- Founded2004
- HeadquartersFremont, United States
- Headcount251–500
- GTM typeB2B
- OfferingHardware or Manufacturing
Yield Engineering Systems firmographics
Firmographics- Name
- Yield Engineering Systems
- Legal name
- Yield Engineering Systems, Inc.
- Website
- https://yieldengineering.com
- Company type
- Private
- Founded year
- 2004
- Operating status
- Operating
- Headcount range
- 251–500 employees
- Ownership category
- akta.pro rank
Yield Engineering Systems industry classification
Industry- Product category
- Semiconductor Process Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Industrial Process Furnaces & Ovens (3567)
- akta.pro primary industry
- Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)
- akta.pro secondary industries
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Thermal Processing Equipment (Furnaces/RTP/Anneal) (HDAHAEAE), Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)
Keywords
Where Yield Engineering Systems is headquartered
LocationHeadquarters
- HQ city
- Fremont
- HQ country
- United States
- HQ region
- North America
Offices9 records
Markets served
Yield Engineering Systems business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Operations, Technology or R&D, Supply Chain, Marketing or Sales, Infrastructure
Revenue model
- Semiconductor Process Equipment Sales: Sale of dry process and wet process systems to semiconductor manufacturers, including VeroTherm, VertaCure, TersOnus, and related platforms. Equipment is sold directly to fabs and through channel partners.
- Parts and Service: Replacement parts, maintenance, and global service solutions for installed equipment base. Support services include technical assistance and spare parts supply.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Custom quotation for semiconductor process equipment |
Go-to-market motion2 records
Distribution channels3 records
Marketing channels4 records
Yield Engineering Systems product offering
Product offeringCore offering
Yield Engineering Systems designs, manufactures, and services semiconductor process equipment for advanced packaging applications, including dry-process systems (fluxless reflow, low-temperature cure, adhesion promotion, bonding, coating) and wet-process systems (through-glass-via etching, electroless metal deposition, edge zone removal), plus lab-to-fab transition tools and the RapidCure UV/thermal exposure system. Equipment is sold to AI/HPC chipmakers, memory suppliers, foundries, and OSATs to enable 2.5D and 3D integration, glass core substrates, microbumping, and fan-out wafer-level packaging.
Product overview
Yield Engineering Systems (YES) offers a comprehensive portfolio of semiconductor process equipment organized into Dry Process systems (VeroTherm FAR XP, VertaCure XP G2/G3/PLP/LX, VeroFlex FAR PLP, UltraCoat, VertaPrime PLP, VertaBond), Wet Process systems (TersOnus Platform with TGV etch and ENEPIG capabilities, SURE Wet Processing Tool, Chemical Delivery Units, TersOra Edge Zone Removal), and Radix Lab-to-Fab product series (G Series, RF Series, SRF Series, EcoClean, TA Series, PB Series, EcoCoat, RapidCure). These equipment solutions enable advanced packaging for AI and HPC applications, including 2.5D and 3D integration, glass core substrates, through-glass via (TGV) etching, micro-bumping, and fan-out wafer-level packaging. The company also offers strategic technology platforms including Single Panel Vacuum Processing, Integrated Metrology, Novel Adhesion Technologies, and High Temperature Processing.
Differentiator
Problem solved
Functional benefit
Brands
- VeroTherm: Reflow systems including VeroTherm FAR XP, VeroTherm FAR, VeroFlex FAR PLP for solder reflow processing in advanced packaging
- VertaCure
- TersOnus
- TersOra
- VertaPrime
- VertaBond
- UltraCoat
- EcoCoat
- EcoClean
- RapidCure
- Radix Lab to Fab
Products and services
- VeroTherm FAR XP Reflow system for advanced packaging applications used for solder balls, C4 bumps, and µbumps needed for advanced packages, supporting sub-10 micron micro-bump structures with fluxless solder and mass reflow.
- VertaCure XP G2 Cure process system offering precise low-temperature curing, annealing, and degassing for both build-up layers and interposers in 2.5D and 3D packaging.
- VertaCure XP G3 Next-generation VertaCure curing system for advanced semiconductor packaging for AI and HPC, enabling precise low-temperature curing, annealing, and degassing to support next-generation 2.5D and 3D packaging technologies.
- VertaCure PLP Panel-level processing cure system for advanced packaging applications supporting 2.5D and 3D integration on glass and panel substrates.
- VertaCure LX Low-temperature curing and annealing system for advanced semiconductor packaging supporting next-generation Edge devices.
- VeroFlex FAR PLP Reflow system for panel-level processing applications supporting fluxless solder reflow on panel-format substrates.
- UltraCoat Coating process system used for uniform monolayer deposition in semiconductor manufacturing and advanced packaging.
- VertaPrime PLP Adhesion enhancement system that improves bonding needed for build-up layers and substrate cores in advanced packaging.
- VertaBond Bonding solution for semiconductor packaging applications supporting advanced packaging workflows.
- TersOnus Platform Wet processing platform providing precise through glass via (TGV) etching for substrates and electroless Cu-less and ENEPIG metal deposition critical for advanced packaging build-up layer connectivity.
- SURE Wet Processing Tool Wet processing tool for semiconductor manufacturing supporting wet chemistry steps in advanced packaging production.
- Chemical Delivery Units Chemical delivery units that supply chemistries to wet processing systems such as TersOnus.
- TersOra Edge Zone Removal Edge zone removal system that yields uniform edges in advanced package build-up layers.
- EcoCoat Coating system providing a highly uniform interface layer for stable coupling chemistry required for chemical synthesis on wafer or glass substrates.
- RapidCure UV and direct thermal exposure system for Fan Out Wafer Level Packaging, based on exclusive license to a process created by Deca Technologies, significantly reducing process cycle time.
- Radix Lab-to-Fab G Series Lab-to-fab transition product series for scaling semiconductor processes from development to production.
- Radix Lab-to-Fab RF Series Lab-to-fab product series for semiconductor manufacturing scale-up.
- Radix Lab-to-Fab SRF Series Lab-to-fab product series for semiconductor manufacturing scale-up.
- Radix Lab-to-Fab TA Series Lab-to-fab product series for semiconductor manufacturing scale-up.
- Radix Lab-to-Fab PB Series Lab-to-fab product series for semiconductor manufacturing scale-up.
- EcoClean Lab-to-fab cleaning system for semiconductor process cleaning used in transitioning processes from laboratory to fabrication.
Quantifiable outcome
- Sub-10 µm micro-bump structures with fluxless solder and mass reflow
- +2 more outcomes
Companies that use Yield Engineering Systems
Customer profileNamed customers6 records
Segments3 records
Ideal customer profiles3 records
Yield Engineering Systems technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature6 records
Yield Engineering Systems partnerships and signals
Strategic signalPartnerships
One partnership is on record.
- Deca TechnologiescoreYES holds an exclusive license to the RapidCure process created by Deca Technologies. The RapidCure tool combines UV and direct thermal exposure technology for fan-out wafer level packaging, significantly reducing process cycle time compared to conventional approaches.
Scale indicators6 records
Recent moves10 records
Expansion highlights5 records
Yield Engineering Systems competitors and assessment
Company assessmentDirect peers
- ASMPT: ASMPT is a Hong Kong-headquartered global leader in semiconductor assembly equipment, offering die bonding, flip-chip, TCB, and advanced packaging systems. Directly comparable to YES as a competing supplier of advanced packaging process equipment to the same foundry, OSAT, and IDM customers.
- BE Semiconductor Industries (Besi): Besi is a Dutch-headquartered specialist in hybrid bonding, thermocompression bonding, and advanced packaging assembly equipment. Directly comparable to YES's VeroTherm reflow and VertaCure platforms given shared focus on sub-micron interconnect and 2.5D/3D packaging workflows.
- Süss MicroTec: Süss MicroTec manufactures advanced packaging equipment including photolithography, coating, bonding, and plasma processing tools. Directly comparable to YES as a mid-sized European-headquartered specialist serving the same advanced packaging customer base, including through glass via and bonding process steps.
- Kulicke & Soffa Industries: Kulicke & Soffa is a Singapore-headquartered semiconductor and LED assembly equipment supplier with deep penetration in wire bonding, advanced packaging, and adjacent process tools. Comparable to YES as a competing supplier of back-end packaging equipment, though K&S is significantly larger and more diversified.
- Evatec: Evatec is a Swiss-headquartered specialist in advanced packaging thin film deposition (PVD, PECVD) and is owned by Besi. Directly comparable to YES's TersOnus deposition capabilities and similar customer base in advanced packaging and photonics.
- Plasma-Therm: Plasma-Therm is a US-headquartered private company specializing in plasma etch and deposition equipment for advanced packaging, MEMS, and power devices. Directly comparable to YES in dry process and TGV etch for advanced packaging applications.
- SCREEN Holdings: SCREEN Holdings is a Japanese-headquartered semiconductor equipment maker specializing in single-wafer cleaning, coating, and developing systems. Comparable to YES's EcoClean and coating product lines, serving similar customers in back-end packaging and front-end cleaning.
- Ulvac: Ulvac is a Japanese-headquartered manufacturer of vacuum, thin-film, and thermal processing equipment serving semiconductor, display, and industrial markets. Comparable to YES in vacuum-based curing, reflow, and advanced packaging deposition systems, particularly in panel-level processing.
Broad incumbents
- Tokyo Electron (TEL): Tokyo Electron is a top-3 global semiconductor equipment manufacturer with broad coverage of deposition, etch, lithography, cleaning, and packaging. Comparable to YES as a broad incumbent that overlaps in advanced packaging, curing, and wet process tools, though TEL is far larger and serves wafer fab as well as packaging.
- Applied Materials: Applied Materials is the largest semiconductor equipment manufacturer globally, with growing exposure to advanced packaging through its Black Diamond division and ICAPS products. Comparable to YES as a broad incumbent competing in advanced packaging workflows, particularly in deposition and etch.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
Yield Engineering Systems social profiles
Digital presenceYield Engineering Systems financial estimates
Financial estimateRevenue estimate
Valuation estimate
Yield Engineering Systems leadership team
Management profileNumber of profiles
Profiles6 records
Yield Engineering Systems funding detail
Funding detailFunding overview
Funding rounds1 record
Investors1 record
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Yield Engineering Systems M&A and investment
M&A and investmentM&A1 record
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Yield Engineering Systems
What does Yield Engineering Systems do?
Yield Engineering Systems designs, manufactures, and services semiconductor process equipment for advanced packaging applications, including dry-process systems (fluxless reflow, low-temperature cure, adhesion promotion, bonding, coating) and wet-process systems (through-glass-via etching, electroless metal deposition, edge zone removal), plus lab-to-fab transition tools and the RapidCure UV/thermal exposure system. Equipment is sold to AI/HPC chipmakers, memory suppliers, foundries, and OSATs to enable 2.5D and 3D integration, glass core substrates, microbumping, and fan-out wafer-level packaging.
Is Yield Engineering Systems a public or private company?
Yield Engineering Systems is a private company. It is classified as management employee owned and is currently operating.
When was Yield Engineering Systems founded?
Yield Engineering Systems was founded in 2004. It employs 251 to 500 people.
Where is Yield Engineering Systems based?
Yield Engineering Systems is headquartered in Fremont, United States, in the North America region.
How does Yield Engineering Systems make money?
Two revenue lines are on record. Semiconductor Process Equipment Sales are the primary driver. The others are parts and Service.
Who are Yield Engineering Systems's main competitors?
Direct peers on record are ASMPT, BE Semiconductor Industries (Besi), Süss MicroTec, Kulicke & Soffa Industries, Evatec, Plasma-Therm, SCREEN Holdings and Ulvac. Broad incumbents are Tokyo Electron (TEL) and Applied Materials.
Does Yield Engineering Systems have an API?
No public API is recorded for Yield Engineering Systems.
What industry is Yield Engineering Systems in?
Yield Engineering Systems's product category is Semiconductor Process Equipment. Its primary akta.pro industry code is HDAHAEAL, Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB), with a secondary code of HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets). Its NAICS code is 333242 and its SIC code is 3567.