Terecircuits

What Terecircuits does

Terecircuits is a privately held materials and process company founded in 2015 by Dr. Jayna Sheats and headquartered in Mountain View, California. The company develops photopolymer materials and a chemical-based mass-transfer process for advanced semiconductor packaging and microassembly, targeting the manufacturing gap left by the diminishing returns of Moore's Law scaling. Its core offering, the Photo-Polymer Mass Transfer process built around the proprietary Terefilm® photopolymer, is designed to replace mechanical pick-and-place for components in the 2-40 micron range where Van der Waals and electrostatic forces overwhelm conventional tooling.

The company's technology claims include sub-micron placement accuracy, throughput exceeding 400,000 units per hour, and operation reportedly 1000x faster and 10x more accurate than conventional pick-and-place. Terefilm® vaporizes cleanly at ~60°C under deep-UV activation with no carbon residue, with thermal stability up to ~180°C prior to UV exposure. Target applications span MicroLED display manufacturing, System-in-Package (SiP) assembly for IoT and wearables, die-on-wafer stacking, AR/VR optics, and foldable displays. The IP portfolio also includes encapsulation materials and liquid metal interconnects for "More than Moore" products.

Terecircuits operates with a small team (1-10 employees) and goes to market via direct B2B sales to industrial tool partners and their OEMs, who integrate the materials and process into lithography-based tooling. Revenue mechanics are based on materials licensing/sales with no publicly disclosed pricing. The company has raised approximately $1.4 million in disclosed equity via a 2022 SEC Form D filing from 68 investors, supplemented by a 2020 NSF grant ($256K), angel-group support from New York Angels, Golden Seeds, Excelestar Ventures, and TCA Venture Group, and selection for NATO DIANA in 2025.

Name

Terecircuits

Legal name

Terecircuits Corporation

Website

https://terecircuits.com

Company type

Private

Founded year

2015

Operating status

Operating

Headcount range

1–10 employees

Short description

Terecircuits is a Mountain View, California-based materials company that develops Terefilm® photopolymer and a Photo-Polymer Mass Transfer process enabling sub-micron placement accuracy at 400K+ units per hour, targeting MicroLED, SiP, and advanced semiconductor packaging applications for display and IoT manufacturers.

Ownership category

akta.pro rank

Product category

Semiconductor Advanced Packaging Materials

NAICS

Plastics Packaging Materials and Unlaminated Film and Sheet Manufacturing (32611)

SIC

Plastics Products, Nec (3089)

akta.pro primary industry

Polymer 3D Printers (FDM/FFF, SLA/DLP/LCD, SLS, Material Jetting) (IMAAAAAA)

akta.pro secondary industries

Micro/Nanoscale & Precision 3D Printers (Two-Photon, Micro-SLA) (IMAAAAAI), Plastic Compounding & Masterbatch (IMANAOAB)

Keywords

• Microassembly materials
• Mass transfer processes
• Semiconductor packaging
• Photopolymer materials
• Advanced electronics manufacturing

Headquarters

HQ city

Mountain View

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Materials Sales: Sale of proprietary photopolymer materials (Terefilm®) and related process solutions to semiconductor manufacturers and advanced packaging companies.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

Terecircuits develops and sells Terefilm®, a proprietary photopolymer material, along with a Photo-Polymer Mass Transfer process for microassembly and mass transfer of components smaller than 10 microns in semiconductor advanced packaging and MicroLED display manufacturing. The company works directly with industrial tool partners and their OEMs to deliver sub-micron placement accuracy at throughputs exceeding 400,000 units per hour, replacing traditional mechanical pick-and-place assembly with a chemical-based, lithography-inspired process.

Product overview

Terecircuits provides materials and processes for advanced semiconductor manufacturing. Their core product is Terefilm® photopolymer, which enables precision mass transfer, high-resolution photolithography, and temporary bonding-debonding for semiconductor advanced packaging. The company offers a Photo-Polymer Mass Transfer Process that replaces traditional mechanical Pick & Place assembly methods. Their technology targets applications in MicroLED displays and System in Package (SiP) solutions for advanced electronics and IoT devices, achieving sub-micron placement accuracy and high throughput assembly of micron-scale components.

Differentiator

Problem solved

Functional benefit

Brands

• Terefilm®: A breakthrough photopolymer material solution for semiconductor advanced packaging efficiency, designed for precision mass transfer, high-resolution photolithography, and temporary bonding-debonding applications. Features thermal stability up to ~180°C prior to UV exposure and clean residue-free vaporization upon activation.

Products and services

• Terefilm® Photopolymer A proprietary photopolymer material that vaporizes entirely upon deep-UV activation at ~60°C with no carbon residue, enabling precision mass transfer, high-resolution photolithography, and temporary bonding-debonding for semiconductor advanced packaging. Sold to industrial tool partners and OEMs building advanced microassembly equipment.
• Photo-Polymer Mass Transfer Process A chemical-based microassembly process that uses a thin layer (1 µm or less) of Terefilm® photo-polymer on a transparent plate to simultaneously place thousands of components (2-40 microns) with sub-500 nm placement accuracy and throughput exceeding 400,000 units per hour. Sold as a process solution to industrial tool partners and OEMs as a replacement for mechanical pick-and-place.

Quantifiable outcome

• 1000x faster throughput compared to conventional pick-and-place
• +5 more outcomes

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Scale indicators6 records

Recent moves5 records

Expansion highlights4 records

Direct peers

• VueReal: VueReal develops proprietary microLED mass-transfer technology (MicroSolid Printing) for display and micro-assembly applications. It is a direct competitor to Terecircuits in the MicroLED transfer and advanced packaging microassembly space.
• Rohinni: Rohinni builds high-speed microLED placement equipment for display and lighting applications. It directly competes with Terecircuits on the throughput-versus-precision tradeoff for placing micron-scale components.
• X-Celeprint (XDisplay Company): X-Celeprint pioneered elastomer-stamp micro-transfer printing for microLEDs, heterogeneous integration, and advanced microelectronics. It is the leading alternative micro-assembly method to Terecircuits' photopolymer mass-transfer process.
• PlayNitride: PlayNitride is a Taiwan-based MicroLED display developer with proprietary mass-transfer technology (PixeLED). It is one of the most direct global peers competing in MicroLED assembly processes that overlap with Terecircuits' target application.

Broad incumbents

• Kulicke & Soffa Industries: Kulicke & Soffa is one of the largest manufacturers of pick-and-place and advanced packaging assembly equipment for semiconductor and LED customers. Terecircuits explicitly positions its photopolymer process as a replacement for conventional K&S-style pick-and-place tooling.
• ASM Pacific Technology: ASM Pacific Technology is a global leader in semiconductor assembly equipment, including advanced packaging tools for Terecircuits' target customers. It represents the entrenched incumbent stack that any novel microassembly process must displace.
• BE Semiconductor Industries (Besi): Besi supplies die-bonding and advanced packaging assembly equipment used in hybrid bonding, fan-out, and 2.5D/3D packaging — adjacent application areas that Terecircuits' mass-transfer process targets.
• EV Group (EVG): EVG is a leading supplier of wafer bonding, nanoimprint lithography, and advanced packaging equipment. Its lithography-adjacent equipment and processes overlap with Terecircuits' lithography-derived photopolymer transfer approach.
• SÜSS MicroTec: SÜSS MicroTec manufactures lithography, coating, and bonding equipment used in advanced semiconductor packaging and MEMS. Its photolithography-coating toolchain is the closest installed-base analog to Terecircuits' photopolymer mass-transfer process.

Others

• JSR Corporation: JSR is a major supplier of photoresists, photopolymers, and electronic materials to the semiconductor industry. It is a materials-side analog to Terecircuits — both sell formulated specialty polymers into lithography-based semiconductor workflows, though JSR's customer base is lithography rather than packaging.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xtwitter.com/Terecircuits1
• LinkedInlinkedin.com/company/terecircuits
• Instagraminstagram.com/terecircuits

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Funding overview

Funding rounds8 records

Investors6 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Terecircuits