What Skorpios Technologies does

Skorpios Technologies is a privately held U.S. semiconductor company that designs and manufactures heterogeneous silicon photonic integrated circuits (HPICs) and operates a vertically integrated silicon foundry. The company is built around its proprietary Tru-SiPh™ platform, which uses a Template Assisted Bonding (STAB) process to monolithically integrate III-V gain materials (lasers, SOAs, modulators) with silicon photonics at wafer scale, yielding compact, hermetically sealed, temperature-insensitive optical chips. Its silicon photonics product portfolio spans direct-detect transceivers from 100 Gb/s to 1.6 Tb/s, coherent 400G-ZR/ZR+ DWDM transceivers, co-packaged optics (3.2 Tbps and 6.4 Tbps) for next-generation switch ASICs, and chip-scale LiDAR subsystems.

Revenue is generated through three streams: (i) hardware sales of photonic ICs and optical engines to AI data center operators, telecom equipment vendors, and module manufacturers; (ii) foundry and microstructures services including 2.5D/3D integration (TSV, DBI, ZiBond), MEMS, microfluidics, and silicon photonics fabrication for third-party customers; and (iii) wafer solutions consisting of blanket and patterned test wafers sold to semiconductor equipment and materials suppliers. The company sells direct to hyperscalers and module integrators and uses regional distributors (MITS in Taiwan, EPS Global in China) for Asian market reach.

Skorpios is headquartered in Temecula, California, where it operates a 450,000 sq ft facility with 50,000+ sq ft of class 100 cleanroom and 125+ production tools across 200 mm and 300 mm wafer lines. It is ISO 9001:2015 and ITAR compliant, holds 125+ worldwide patents, and has secured design wins with ColorChip and LuxshareTech for high-volume module manufacturing. Following a 2024 strategic relocation and new financing, the company is positioned to begin hyperscaler sampling of its 1.6 Tbps and 6.4 Tbps optical engines in Q2 2026.

Name

Skorpios Technologies

Legal name

Skorpios Technologies Inc.

Website

https://skorpiosinc.com

Company type

Private

Founded year

1991

Operating status

Operating

Headcount range

101–250 employees

Short description

Skorpios Technologies is a U.S. semiconductor company that designs heterogeneous silicon photonic integrated circuits on its proprietary Tru-SiPh™ platform and operates a vertically integrated foundry serving hyperscale AI data centers, module manufacturers, telecom carriers, and semiconductor equipment customers.

Ownership category

akta.pro rank

Product category

Silicon Photonics

NAICS

Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Optoelectronic / Photonics Foundries (Silicon Photonics/LED/Laser) (HDAHACAG)

akta.pro secondary industries

Optoelectronic Emitters (LED/Laser/VCSEL) (HDAHALAL), RF & Compound Semiconductor Foundries (GaAs/GaN/SiGe) (HDAHACAD), Compound Semiconductor Wafers & Substrates (SiC/GaN/GaAs/InP/Sapphire) (HDAHAGAB)

Keywords

• Silicon photonics products
• Heterogeneous photonic integration
• Optical interconnect solutions
• Semiconductor foundry services
• Co-packaged optics modules

Headquarters

HQ city

Albuquerque

HQ country

United States

HQ region

North America

Offices2 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Infrastructure, Personnel, Operations, Supply Chain, Marketing or Sales

Revenue model

1. Silicon Photonics Products: Sale of integrated photonic ICs (PICs) and optical engines for data center, AI infrastructure, coherent communications, LiDAR, and biosensor applications. Products range from 100G to 6.4 Tbps capacity including bare-die HPICs, optical engines, and QSFP-DD/OSFP modules.
2. Foundry Services: Provides semiconductor fabrication services including test wafer manufacturing, custom wafer processing (over 7,000 different process flows), MEMS, microfluidics, sensors, and silicon photonics fabrication for third-party customers. Services include solution design, development, production, and analytics.
3. Wafer Solutions: Sale of blanket and patterned test wafers for semiconductor equipment and materials suppliers. Product line includes over 60 unique dielectric and conductive thin films, with more than 600 standard test wafer products for CMP, etch, litho, deposition, metrology, cleans and fills.

Go-to-market motion3 records

Distribution channels4 records

Marketing channels5 records

Core offering

Skorpios Technologies designs, manufactures, and sells heterogeneous silicon photonic integrated circuits (HPICs) and optical engines based on its proprietary Tru-SiPh™ platform, which monolithically integrates III-V gain materials (lasers, modulators, photodiodes) directly into silicon wafers. The company also operates a semiconductor microstructures foundry providing blanket and patterned test wafers, 2.5D/3D integration, MEMS, microfluidics, and custom silicon fabrication services.

Product overview

Skorpios Technologies offers a unified platform architecture centered on its proprietary Tru-SiPh™ heterogeneous silicon photonics technology, which monolithically integrates III-V gain materials (lasers, modulators, photodetectors) directly into silicon at wafer scale. The product portfolio spans four silicon photonics product lines: Direct Detect Products (100G to 1.6T for data center Ethernet modules), Coherent Products (400ZR/ZR+ DWDM transceivers), Co-packaged Optics Products (3.2T and 6.4T CPO solutions), and Lidar Products (chip-scale LiDAR systems). Supporting the core photonic products is a comprehensive Microstructures Foundry offering blanket and patterned wafers, 2.5D/3D integration services (TSV, DBI, bonding), MEMS, microfluidics, and analytical services. The modular macrocell approach—encompassing lasers, modulators, detectors, SOAs, and passive elements—enables rapid configuration of Customer Specific Standard Products (CSSPs) for varied applications including AI data centers, telecommunications, automotive LiDAR, and biomedical sensors.

Differentiator

Problem solved

Functional benefit

Brands

• Tru-SiPh™: Heterogeneous Photonic Integrated Circuit (HPIC) platform that enables wafer-scale integration of III-V materials with silicon for silicon photonics applications.

Products and services

• Tru-SiPh™ Platform Proprietary heterogeneous silicon photonics platform that monolithically integrates III-V gain materials with silicon to create Heterogeneous Photonic Integrated Circuits (HPICs) at wafer scale. Enables embedded lasers, modulators, and photodiodes on a single chip with native hermetic sealing for data center, telecom, LiDAR, and biosensor applications.
• Tru-SiPh 1.6 Tbps and 6.4 Tbps Optical Engines Heterogeneous photonic integrated circuit optical engines delivering 1.6 Tbps and 6.4 Tbps bandwidth for next-generation 102.4 Tbps Ethernet switches and AI GPU fabrics. Targets hyperscale AI data center operators requiring high-bandwidth, low-power optical interconnects.
• Direct Detect Products Silicon photonics products for the data center Ethernet module market including NRZ and PAM4 products from 100Gb/s to 1.6Tb/s, covering CWDM4, FR4, and DR8 variants. Targets optical module manufacturers and data center operators.
• Coherent Products Full C-band, 70 kHz linewidth, uncooled tunable laser-based DWDM coherent transceiver devices available as TROSA, Engine with DSP, or QSFP/OSFP module form factors for 400G-ZR and 400G-ZR+ applications. Targets telecom carriers and network equipment manufacturers.
• Co-packaged Optics Products Products for co-packaging optical interfaces on high-speed switch or processor chips including 3.2 Tb/s and 6.4 Tb/s CPO HPICs and Optical Engines for 51.2T and 102.4T CPO system applications. Targets networking ASIC and switch manufacturers.
• Lidar Products Chip-scale LiDAR solutions where all sub-systems including transmit, receive, and scanning can be implemented on a single CMOS chip using the Tru-SiPh platform. Targets autonomous vehicles, robotics, drones, smart cities, and agricultural automation.
• Heterogeneous Photonic Integrated Circuits (HPICs) Monolithically integrated silicon photonics chips combining the scale and economics of the silicon industry with the power and flexibility of optics, available up to 1.6Tbps for data center and AI infrastructure applications. Targets module manufacturers and system integrators.
• Optical Toolbox Components Building block components for photonic ICs including DBR lasers (C- and O-band, tunable with <70 kHz linewidth), electroabsorption modulators (<1.5V p-p drive), InP Mach-Zehnder modulators, high-bandwidth photodiodes, tuning-free mux/demux, gratings, couplers, splitters, and optical phased arrays. Used by photonic IC designers.
• Microstructures Foundry Services Silicon microstructure foundry providing 2.5D and 3D integration services including TSV technologies (BTSV, CuTSV, C-TSV, FSTSV), DBI, ZiBond bonding, MEMS fabrication, microfluidics, sensors, and novel materials processing. Targets third-party semiconductor companies requiring custom fabrication.
• Blanket Wafers High-quality test-grade and monitor wafers including ALD films, CVD films, LPCVD films, thermal oxides, PVD films, and spin coatings for semiconductor equipment and materials suppliers. Product line includes over 60 unique dielectric and conductive thin films.
• Patterned Wafers Patterned test wafers for planarity and defectivity evaluations including CMP test masks, STI CMP masks, electrical test vehicles, metrology patterns, TSV etch/fill patterns, and calibration wafers. Targets semiconductor equipment and materials suppliers.

Quantifiable outcome

• 0.35 FIT laser reliability - shifting reliability bottleneck from laser to packaging
• +3 more outcomes

Named customers2 records

Segments6 records

Ideal customer profiles7 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration1 record

Feature8 records

Partnerships

Five partnerships are on record, tiered core.

• BroadcomcoreTechnology or Integration · 16 March 2026Technical compatibility partnership ensuring Skorpios' Tru-SiPh Optical Engines (1.6 Tbps and 6.4 Tbps) are compatible with Broadcom Tomahawk 6 networking ASICs for 102.4 Tbps Ethernet switches in AI infrastructure.
• MITS Component & System Corp.coreChannel Partner/ Reseller/ DistributorRegional distributor for Taiwan market handling sales and support of Skorpios' silicon photonics products and foundry services in Taiwan. Enables broader market reach for Asian customers.
• EPS GlobalcoreChannel Partner/ Reseller/ DistributorRegional distributor for China market handling sales and support of Skorpios' silicon photonics products and foundry services. Enables market access in mainland China.
• ColorChipcoreStrategic or Co-development PartnerCollaboration since early 2021 on photonic module design and technology. ColorChip integrates Skorpios' Tru-SiPh technology into optical transceivers for multi-million unit annual capacity production, targeting 50 cents per gigabit pricing for 200G, 400G and beyond.
• LuxshareTechcoreStrategic or Co-development PartnerCollaboration since early 2021 on perfecting photonic module design and technology for customers. LuxshareTech opto-electronic business unit integrates Skorpios' silicon photonics technology.

Scale indicators8 records

Recent moves8 records

Expansion highlights6 records

Emerging players

• Innolight Technology: Innolight is a leading Chinese manufacturer of high-speed optical transceivers (400G, 800G, 1.6T) for data centers and telecom. While primarily a module assembler, Innolight is a key customer and potential competitor in the AI data center optical interconnect market where Skorpios is positioning its 1.6/6.4 Tbps engines.
• Aeva Technologies: Aeva develops chip-scale LiDAR sensors using silicon photonics for autonomous vehicles, robotics, and industrial applications. Comparable to Skorpios's LiDAR product line leveraging the Tru-SiPh platform, though Aeva focuses specifically on FMCW coherent LiDAR rather than the broader Skorpios product portfolio.

Direct peers

• Intel: Intel's Silicon Photonics division develops integrated optical transceivers and connectivity solutions for data centers using heterogeneous integration on silicon. Directly competes with Skorpios in wafer-scale silicon photonics platforms for AI and hyperscale data center interconnects, though Intel operates at substantially larger scale.
• MACOM Technology Solutions: MACOM designs and manufactures semiconductor products for data center, telecom, and industrial markets, including silicon photonics-based optical components and transceivers. Comparable to Skorpios in targeting high-speed optical interconnects for hyperscale and AI infrastructure.
• Coherent Corp: Coherent (formerly II-VI/Finisar) manufactures lasers, optical components, and transceivers including silicon photonics-based products for data centers and telecom. Directly comparable as a vertically integrated optical components manufacturer with overlapping product portfolio in lasers, transceivers, and photonic integrated circuits.
• GlobalFoundries: GlobalFoundries operates silicon photonics foundry services on 200mm and 300mm wafers (GF Fotonix), offering monolithic integration of III-V materials on silicon. Directly competes with Skorpios's Microstructures Foundry services for third-party silicon photonics fabrication and is a key alternative foundry option for fabless photonic IC designers.
• Marvell Technology (Inphi): Marvell's Inphi business designs DSPs and optical interconnect silicon for data center, AI, and telecom networks. Competes with Skorpios in high-speed optical engines for AI infrastructure and is a key incumbent in 400G/800G/1.6T pluggable modules alongside hyperscaler switch architectures.
• Lumentum: Lumentum designs and manufactures photonic products including lasers, optical components, and transceivers for data center, telecom, and 3D sensing applications. Comparable to Skorpios in laser and photonic integration technologies, particularly for coherent and high-speed optical interconnect markets.

Broad incumbents

• Broadcom: Broadcom is the dominant supplier of networking ASICs (including Tomahawk 6) for hyperscale switches and a strategic compatibility partner for Skorpios. As a broader incumbent, Broadcom also has internal silicon photonics capabilities and competing optical solutions, making it both a partner and potential competitor.
• Cisco (Acacia Communications): Cisco acquired Acacia Communications, which designs coherent optical interconnect technology including silicon photonics-based transceivers. A broad incumbent in networking equipment with silicon photonics capabilities that overlap with Skorpios's coherent and high-speed optical engine product lines.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/trusiph
• LinkedInlinkedin.com/company/skorpios-technologies-inc-
• Facebookfacebook.com/179188702794441

Compliance3 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles8 records

Funding overview

Funding rounds6 records

Investors6 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Skorpios Technologies