Telink

What Telink does

Telink Semiconductor (Shanghai) Co., Ltd. is a fabless IC design company founded in 2010 and publicly listed on the Shanghai Stock Exchange (stock code 688591) since its 2023 IPO. The company designs multi-protocol wireless connectivity system-on-chips for IoT applications, built on RISC-V 32-bit MCU cores augmented by proprietary T-MCU cores. Telink's portfolio spans Bluetooth LE, Bluetooth Classic, Bluetooth Mesh, Zigbee, Thread, Matter, Wi-Fi 6, and proprietary 2.4GHz protocols, with flagship series including TL721x, TL322x, TL321x, TLSR922x, TLSR921x, TLSR827x for BLE; TL752x, TL751x, TLSR952x, TLSR951x for wireless audio; TLSR9118 for Wi-Fi 6; and TLSR836x/835x for 2.4GHz proprietary applications. The company complements its silicon with the TL-EdgeAI platform (LiteRT/TVM-compatible edge inference), pre-certified modules, and a developer tooling stack including Telink IoT Studio and an AI-enabled VS Code extension.

Telink's customer base is global and horizontally diversified across OEMs and module integrators in smart home (Tuya, Ledvance, Home Control), consumer electronics (Logitech, Sharp, Panasonic, Skyworth), audio (Harman, Edifier), smart retail (Hanshow), industrial IoT, automotive (digital key), wearables, location services (Apple Find My, Google Nearby), and semiconductor (Renesas, Nvidia). Cumulative IC shipments surpassed 2 billion units by 2024.

The business model is B2B hardware sales of SoCs and pre-certified modules, augmented by SDK and developer tool revenue. Telink distributes globally through Mouser Electronics and a network of regional sales representatives covering North America, Europe, India, and South Korea, supplemented by direct field-sales and application-engineering offices in Shanghai, Santa Clara, Shenzhen, Taipei, Seoul, Kunshan, Ningbo, Lviv (Ukraine), and Cairo (Egypt). Pricing is not publicly disclosed; customers obtain quotes via direct sales or authorized channels. Telink is certified to ISO 9001:2015, GDPR, RoHS, REACH, and holds CE/FCC/NCC/SRRC/TELEC/PSA certifications on key modules, and is a board member of the Connectivity Standards Alliance as of June 2026.

Name

Telink

Legal name

TELINK SEMICONDUCTOR (Shanghai) CO., LTD.

Website

https://telink-semi.com

Company type

Public

Founded year

2010

Operating status

Operating

Headcount range

101–250 employees

Short description

Telink is a Shanghai-based fabless semiconductor company that designs multi-protocol wireless connectivity SoCs (Bluetooth LE, Matter, Thread, Zigbee, Wi-Fi 6) for global IoT device manufacturers serving smart home, audio, gaming, retail, automotive, and industrial applications.

Ownership category

akta.pro rank

Product category

Wireless IoT Semiconductors

NAICS

Telecommunications (517)

SIC

Computer Communications Equipment (3576)

akta.pro primary industry

Smart Home Hubs & Home Gateways (IoT Edge) (HDAFAIAL)

akta.pro secondary industries

Outdoor & Industrial/Rugged Wi‑Fi Access Points (HDAFACAB), Cellular IoT/M2M Gateways & Routers (LTE/5G) (HDAFAIAF)

Keywords

• Wireless connectivity SoCs
• IoT semiconductor chips
• Multi-protocol wireless chips
• Bluetooth LE SoCs
• Matter Thread Zigbee chips

Headquarters

HQ city

Shanghai

HQ country

China

HQ region

Asia

Offices9 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Operations, Supply Chain, Marketing or Sales

Revenue model

1. Wireless SoC and Module Sales: Telink generates revenue primarily from the sale of wireless connectivity SoC chips and pre-certified modules. The company ships complete IC solutions including chips, modules, and development tools to IoT device manufacturers.
2. SDK and Development Tools: Revenue derived from providing SDKs, development tools, documentation, and technical support services to device manufacturers integrating Telink chips.

Go-to-market motion3 records

Distribution channels13 records

Marketing channels7 records

Core offering

Telink is a fabless IC design company that develops and sells wireless connectivity system-on-chip (SoC) solutions and pre-certified modules for IoT applications. Its portfolio spans multi-protocol SoCs supporting Bluetooth LE, Bluetooth Classic, Zigbee, Thread, Matter, Wi-Fi 6, Apple HomeKit, Apple Find My, Amazon Sidewalk, and proprietary 2.4GHz protocols, sold primarily to IoT device manufacturers alongside SDKs and development tools.

Product overview

Telink Semiconductor is a fabless IC design company offering state-of-the-art wireless connectivity SoCs for IoT applications. The company's product portfolio includes multiple SoC series supporting diverse wireless protocols: TL721x, TL322x, TL321x, TC321x, TLSR922x, TLSR921x, TLSR827x, TLSR825x, and TLSR8208 series for Bluetooth LE applications; TL752x, TL751x, TLSR952x, and TLSR951x series for wireless audio; TLSR9118 for Wi-Fi 6; and TLSR836x/TLSR835x for 2.4GHz proprietary protocols. The portfolio supports standards including Bluetooth LE, Bluetooth Classic, Bluetooth Mesh, Zigbee, Thread, Matter, Amazon Sidewalk, Apple HomeKit, and Apple Find My network. Telink provides comprehensive development support through Telink IoT Studio IDE, VS Code Extension, Burning and Debugging Tool, and SDKs available on GitHub. The company has also launched the TL-EdgeAI platform for edge AI computing with support for LiteRT and TVM models.

Differentiator

Problem solved

Functional benefit

Products and services

• TL721x Series SoC High-performance, multi-protocol wireless connectivity SoC supporting Bluetooth LE 6.0, Zigbee, Thread, Matter, and 2.4GHz proprietary protocols with RISC-V 32-bit MCU for high-performance IoT devices.
• TL322x Series SoC Dual-core RISC-V multi-protocol SoC compatible with Bluetooth LE, Zigbee, RF4CE, Thread, Matter, and 2.4GHz proprietary protocols, with up to 384KB SRAM and 2560KB NVM, supporting Bluetooth 6.0 with Channel Sounding for high-precision positioning.
• TL321x Series SoC Low-power SoC compliant with 802.15.4 and proprietary Bluetooth technologies in 2.4GHz band, featuring RISC-V 32-bit MCU with 128KB SRAM and up to 2MB Flash for high-performance wireless IoT devices.
• TC321x Series SoC SoC integrating Bluetooth LE and 2.4GHz proprietary protocol functions with T-MCU 32-bit processor, 64KB SRAM, and up to 1MB Flash, designed for high-quality wireless communication on a single chip.
• TLSR922x Series SoC High-end IoT SoC supporting Bluetooth LE 6.0, Bluetooth Mesh, Zigbee Pro 2023, Thread, Matter, Apple HomeKit (BLE and Thread), and 2.4GHz proprietary protocols, with RISC-V 32-bit MCU, 512KB SRAM, 2MB Flash, and advanced on-chip security.
• TLSR921x Series SoC Low-power, high-performance multi-protocol wireless connectivity SoC supporting Bluetooth LE, Bluetooth Mesh, Zigbee, Thread, Matter, Apple HomeKit, Apple Find My, and 2.4GHz proprietary protocols with 32-bit RISC-V MCU and security features for high-end IoT devices.
• TLSR825x Series SoC Ultra-low power concurrent multi-protocol IoT solution supporting Bluetooth LE, Bluetooth Mesh, Zigbee, RF4CE, and 2.4GHz proprietary protocols in ISM 2.4GHz band.
• TLSR8208 Series SoC Cost-effective multi-protocol wireless connectivity SoC supporting Bluetooth LE standard and proprietary protocols in 2.4GHz band, with common peripheral interfaces and variety of packaging options for basic IoT devices and wireless transceiver modules.
• TL752x Series SoC Single-chip Bluetooth and audio SoC supporting Bluetooth BR/EDR/LE and Telink's proprietary 2.4GHz TAHDT protocol, featuring dual 32-bit RISC-V MCUs, HiFi5 DSP, and flexible I/Os for premium audio, high computing power, and ultra-low power consumption.
• TL751x Series SoC Premium wireless audio and high-end IoT SoC supporting Bluetooth 5.4 (BR/EDR/LE) protocol, featuring dual 32-bit RISC-V MCUs and Cadence HiFi 5 DSP with audio subsystem running up to 192MHz.
• TLSR952x Series SoC Audio-focused SoC with built-in DSP unit, audio codec with accelerator, and management unit, supporting Bluetooth BR, EDR, LE, Mesh, and 2.4GHz proprietary standards for ANC and ENC audio applications.
• TLSR951x Series SoC Dual-mode Bluetooth audio SoC supporting both Bluetooth Classic Audio and Bluetooth LE Audio in single integrated solution, with 32-bit RISC-V MCU and Telink's proprietary ultra-low latency protocol for e-sports headsets and microphones.
• TLSR9118 Series SoC Wi-Fi 6 SoC supporting 2.4GHz with certification, integrating 1T1R Wi-Fi 6 with Bluetooth LE 5.4 and IEEE 802.15.4 protocols, featuring dual-core RISC-V MCU with advanced on-chip security for next-generation IoT connectivity.
• TLSR836x Series SoC Dedicated 2.4GHz SoC solutions for wireless keyboard, mouse, remote control, and other product applications.
• TLSR835x Series SoC 2.4GHz RF chip solutions for retail/logistics, private networking, beacon applications, wireless mouse, and wireless USB adapters.
• Amazon Sidewalk Solutions Complete Amazon Sidewalk ecosystem solutions including chips, modules, and development tools with end-to-end support, supporting Sidewalk over BLE and Sub-GHz protocols for smart outdoor devices, asset tracking, smart meters, and smart positioning applications.
• TL-EdgeAI Platform Edge AI platform combining advanced chip technology with AI algorithms for high-performance and low-power AIoT applications, supporting LiteRT and TVM models from TensorFlow, PyTorch, and JAX for battery-powered AI edge-side applications.
• Telink IoT Studio Integrated development environment (IDE) specifically designed for Telink chips, providing full lifecycle management of SDK projects covering importing, building, programming, and debugging.
• Telink VS Code Extension All-in-one embedded development tool built on Visual Studio Code ecosystem, deeply integrated with Telink SDK context, supporting AI code generation, one-click project conversion to CMake, and full-process operations including dependency acquisition, compilation, burning, and debugging.

Quantifiable outcome

• Over 2 billion cumulative IC unit shipments as of 2024
• +2 more outcomes

Named customers13 records

Segments11 records

Ideal customer profiles6 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Integration5 records

AI capability3 records

Feature9 records

Partnerships

Three partnerships are on record, tiered core and minor.

• Connectivity Standards Alliance (CSA)coreStrategic or Co-development Partner · 17 June 2026Telink was elected and added to the CSA Board of Directors at the Unify event in Austin, Texas in June 2026. This positions Telink at the governance level of the Matter standard and CSA IoT ecosystem development. Telink participates in shaping Matter 1.6, Product Security 1.1, and Aliro specifications.
• Mouser ElectronicscoreChannel Partner/ Reseller/ DistributorMouser Electronics is Telink's global authorized distributor for SoCs and modules, enabling worldwide online ordering and sample procurement for customers. Telink samples are available through Mouser's platform.
• ADTminorStrategic or Co-development PartnerADT was simultaneously added to the CSA Board alongside Telink at the Unify 2026 event, representing the security industry perspective in the CSA IoT standards ecosystem.

Scale indicators3 records

Recent moves7 records

Expansion highlights6 records

Direct peers

• Espressif Systems: Espressif's ESP32 series competes head-to-head with Telink's multi-protocol SoCs in Wi-Fi + BLE IoT applications, serving similar smart home, industrial, and consumer electronics customers. Both are fabless Asian-headquartered players focused on cost-competitive IoT connectivity.
• Nordic Semiconductor: Nordic is the dominant BLE SoC supplier (nRF52, nRF53, nRF54 series) and a direct competitor in multi-protocol IoT. Both companies target smart home, HID, wearables, and asset tracking OEMs with comparable protocol stacks (BLE, Thread, Matter, Zigbee).
• Realtek: Realtek's Ameba series offers Wi-Fi + BLE combo SoCs targeting the same IoT device manufacturers Telink serves, including smart home, audio, and HID segments. Both compete on multi-protocol integration at the IoT edge.
• Silicon Labs: Silicon Labs is a direct competitor in Zigbee, Thread, and Matter silicon for the smart home ecosystem. Both companies target Matter-certified device manufacturers and overlap heavily in smart lighting, smart locks, and sensors.
• Beken Corporation: Beken is a China-based fabless wireless SoC company competing in Wi-Fi, BLE, and IoT connectivity chips. Both companies target cost-sensitive IoT device manufacturers in smart home, audio, and consumer electronics.

Broad incumbents

• Texas Instruments: TI's SimpleLink CC2xxx and CC3xxx BLE/Wi-Fi SoC family competes with Telink in industrial IoT, medical, and smart home applications. TI is a much broader semiconductor incumbent with deeper analog and embedded processing portfolios.
• NXP Semiconductors: NXP competes via its RW61x and i.MX RT wireless MCU families targeting Matter, Thread, and Zigbee devices. As a broad automotive and IoT incumbent, NXP offers deeper automotive tier-1 relationships and more comprehensive security/certification infrastructure.
• Renesas Electronics: Renesas (including legacy Dialog Semiconductor) competes in BLE SoCs for IoT and is also listed as a Telink customer/partner. As a broad MCU and connectivity incumbent, Renesas targets automotive, industrial, and consumer IoT with deeper tier-1 OEM relationships.
• MediaTek (Airoha Technology): MediaTek's Airoha subsidiary competes in BLE audio, TWS, and IoT SoCs, overlapping with Telink's wireless audio portfolio (TL751x, TLSR952x). MediaTek is a broader mobile and connectivity incumbent with much larger scale and R&D budgets.

Regional players

• Actions Semiconductor: Actions Semiconductor is a China-headquartered fabless player competing in BLE and Wi-Fi IoT chips, primarily serving domestic Chinese OEMs. It is most comparable to Telink's smart home and HID product lines within the China market.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat6 records

Key risks6 records

Key highlights7 records

Customer concentration

• GitHubgithub.com/telink-semi
• Xx.com/TelinkSemi
• Facebookfacebook.com/profile.php
• LinkedInlinkedin.com/company/telink-semiconductor

Compliance13 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Funding overview

Funding rounds2 records

Investors2 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments1 record

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Telink