What RJR Technologies does

RJR Technologies, Inc. is a privately held electronic packaging company founded in 1987 and headquartered in Phoenix, Arizona, specializing in near-hermetic air cavity plastic semiconductor packages, pre-applied B-stage epoxy components, and proprietary sealing equipment. The company operates three manufacturing sites (Phoenix, AZ; Hayward, CA; Biñan, Philippines) with three R&D sites and ten worldwide support locations, all ISO 9001:2015 certified. Its core technology portfolio centers on proprietary B-stage epoxy formulations (protected as trade secrets), the patented Isothermal Sealing System (ITS, available as Models 400, 500, and 600), and the recently launched Dual Epoxy Advanced Packaging (DEAP) platform introduced in March 2026. RJR serves three primary customer segments: semiconductor manufacturers requiring RF power and sensor packaging, the photonics industry needing Butterfly, VCSEL, ROSA, and TROSA layouts, and RF/power electronics applications including wireless infrastructure base stations where 100 million ACP packages have been deployed with zero field failures.

The company operates a direct enterprise field sales model with sales support covering the United States, Europe, and Asia, and generates revenue through four streams: Air Cavity Plastic (ACP) Packages including RF Power headers and RQFN packages; B-Stage Components comprising pre-applied epoxy components and custom epoxy formulations; sealing equipment (ITS Models 400/500/600); and custom formulation services for challenging material combinations. Pricing is quote-based and not publicly disclosed, with multi-year contracts in place for enterprise customers. RJR's go-to-market leverages industry trade shows (PCIM Europe, SENSOR+TEST, Advanced Packaging International, SEMICON Europa), technical white papers and application notes, direct sales engagement with technical application expertise, and its corporate website. The company is actively building an ecosystem through strategic partnerships with Kostecsys (thermal management), PHIX (photonic integration), and CITC (heterogeneous integration research in the Netherlands), positioning itself as a total package solution provider rather than a standalone component supplier. Leadership is provided by CEO and President Wil Salhuana alongside co-founder Raymond Bregante.

Name

RJR Technologies

Legal name

RJR Technologies, Inc.

Website

https://rjrtechnologies.com

Company type

Private

Founded year

1987

Operating status

Operating

Headcount range

101–250 employees

Short description

RJR Technologies is a privately held Phoenix-based electronic packaging company, founded in 1987, that designs and manufactures near-hermetic air cavity plastic semiconductor packages, proprietary B-stage epoxy components, and Isothermal Sealing equipment for semiconductor manufacturers, photonics companies, and RF/power electronics customers worldwide.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic Components & Accessories (3670)

akta.pro primary industry

Electronic & High-Purity Specialty Chemicals (IMAEABAD)

akta.pro secondary industry

PCB & Electronics Manufacturing Chemicals (Desmear, micro-etch, plating, fluxes) (IMAEAKAL)

Keywords

• Semiconductor packaging
• Air cavity packages
• B-stage epoxy components
• Photonics packaging
• RF power packages

Headquarters

HQ city

Phoenix

HQ country

United States

HQ region

North America

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Supply Chain, Technology or R&D, Marketing or Sales, Infrastructure

Revenue model

1. Air Cavity Plastic Packages: Sale of near-hermetic air cavity semiconductor packages including ACP RF Power packages and RQFN packages. Products include headers, sidewalls, lids, and bases configured as 2-piece or 3-piece solutions.
2. B-Stage Epoxy Components: Pre-applied B-stage epoxy components including epoxy-coated IC lids, packages, and custom formulations. Materials are applied in-house with tightly controlled quality and performance characteristics.
3. Sealing Equipment: Sale of Isothermal Sealing System (ITS) equipment including Model 400, 500, and 600 units. Systems include custom design plates, transfer tools, loading plates, training, and one-year warranty. Electronic control modules are field serviceable and programmable.
4. Custom Formulation Services: Custom epoxy formulations to address challenging scenarios involving difficult or dissimilar materials, providing tailored solutions to meet specific customer requirements.

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels4 records

Core offering

RJR Technologies develops, manufactures, and sells near-hermetic air cavity plastic semiconductor packages, pre-applied B-stage epoxy components, and isothermal sealing equipment for the semiconductor and photonics industries. The company provides a total package solution spanning epoxy formulations, package components (headers, sidewalls, lids, bases), and sealing equipment used in back-end semiconductor assembly.

Product overview

RJR Technologies provides a comprehensive portfolio of semiconductor back-end packaging solutions consisting of three core product lines: Air Cavity Plastic (ACP) Packages offering RF Power and RQFN packages with near-hermetic sealing for sensors and RF applications; B-Stage Components providing pre-applied epoxy formulations including proprietary high-temperature systems, low-temperature co-polymer systems, and custom formulations for ceramic lids, optical sensors, and medical applications; and Photonics Packaging delivering Butterfly, VCSEL, ROSA, and TROSA layouts for photonics integrated circuits. Supporting these product lines is the Isothermal Sealing System (ITS) equipment with Models 400, 500, and 600, providing pre-programmed sealing processes with precise temperature, time, and pressure control. The company operates strategic partnerships with Kostecsys for thermal management solutions, PHIX for photonic integrated circuit integration, and CITC for heterogeneous integration research.

Differentiator

Problem solved

Functional benefit

Products and services

• Air Cavity Plastic (ACP) Packages Near-hermetic air cavity plastic semiconductor packages offered as 2-piece or 3-piece configurations (headers, sidewalls, lids, bases) for RF power, sensor, and demanding electronic applications, providing a high-reliability, lower-cost alternative to ceramic packaging.
• B-Stage Components Pre-applied B-stage epoxy components (including open tooled ceramic lids with B-stage epoxies) used to provide near-hermetic seals between ceramic or plastic lids, glass lids for optical sensors, and metal components for medical applications.
• Custom B-Stage Epoxy Formulation Services Tailored epoxy formulation services for customers with challenging material combinations, leveraging proprietary high-temperature, high-performance B-stage epoxy systems, low-temperature co-polymer systems, and solvent-free epoxy options.
• Photonics Packaging Solutions Scalable, high-volume air-cavity packaging solutions for Photonic Integrated Circuits (PICs) covering Butterfly, VCSEL, ROSA, TROSA, and other layouts with near-hermetic performance for optical sensors and communications.
• Isothermal Sealing System (ITS) Patented semi-automated sealing equipment (Models 400, 500, and 600) with precise control over time, temperature, and pressure, producing near-hermetic seals with 0.001 inch location tolerances, 99% factory yield, and field-serviceable, programmable electronic control modules. Each system ships with custom design plates, a transfer tool, a loading plate, and a two-day training seminar at the RJR factory.
• Dual Epoxy Advanced Packaging (DEAP) Dual-epoxy approach combining conductive and non-conductive B-stage epoxy systems within a unified assembly and sealing process to enable electrical interconnects and near-hermetic seals in air-cavity plastic packages for semiconductor and photonic applications.

Quantifiable outcome

• 100 million ACP packages deployed in base stations with zero field failures
• +3 more outcomes

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

Three partnerships are on record, tiered core.

• Kostecsys (Kostecs)coreStrategic or Co-development PartnerRJR Technologies and Kostecsys formed a strategic partnership to enhance semiconductor industry solutions. Combining RJR's advanced packaging technology with Kostecsys's expertise in low thermal expansion and high thermal conductivity thermal flanges delivers cutting-edge thermal management solutions for the global semiconductor market.
• PHIXcoreStrategic or Co-development PartnerRJR Technologies and PHIX joined forces to advance semiconductor and photonics integration solutions. The partnership leverages RJR's packaging expertise and PHIX's specialization in hybrid integration, optical assembly, and RF electrical connectivity for major Photonic Integrated Circuit (PIC) platforms.
• CITC (Center for Integrated Transnational Innovation)coreStrategic or Co-development PartnerRJR Technologies partnered with CITC, a non-profit innovation center in The Netherlands specializing in heterogeneous integration and advanced chip packaging. This collaboration merges RJR's packaging expertise with CITC's pioneering research to address evolving challenges of the global semiconductor industry.

Scale indicators6 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• Resonac (formerly Showa Denko Materials): Resonac's electronic materials division supplies advanced packaging materials, encapsulants, and substrate materials used in semiconductor packaging — a large incumbent competing for the same materials wallet as RJR's B-stage components.
• JCET (Jiangsu Changjiang Electronics Technology): JCET is a top-tier global OSAT providing back-end packaging and test services across consumer, automotive, and advanced packaging segments — a broad-scale competitor for packaging-focused semiconductor customers.
• ASE Technology Holding: ASE is the largest global OSAT with packaging, test, and assembly services spanning QFN, RF, and advanced packaging formats. It competes for the same semiconductor packaging wallet as RJR and has substantially greater scale and capital.
• Amkor Technology: One of the world's largest OSATs, Amkor offers a broad portfolio of semiconductor packaging services including advanced and RF packaging. It is the dominant scale competitor that any growth-stage specialty packager must outperform on cost or differentiated capability.
• Sumitomo Bakelite: Sumitomo Bakelite is a leading supplier of epoxy molding compounds and encapsulation materials used in semiconductor packaging — adjacent to RJR's epoxy formulation expertise, though focused on molding rather than sealing.
• Henkel: Henkel is a major supplier of electronic materials including underfills, encapsulants, and adhesives for semiconductor packaging — directly competing with RJR's B-stage epoxy components business in formulation-driven accounts.

Direct peers

• PHIX Photonics Assembly: PHIX specializes in hybrid photonic integrated circuit assembly and packaging — directly overlapping RJR's photonics packaging product line. The two companies are also strategic partners, making PHIX both a competitor and collaborator in air-cavity PIC packaging.
• KYOCERA: KYOCERA produces ceramic semiconductor packages including air-cavity and QFN-style packages — the incumbent alternative technology to RJR's plastic near-hermetic packages in RF and high-reliability applications.
• Palomar Technologies: Palomar Technologies makes precision packaging and assembly equipment for photonic, RF, and microelectronic devices — comparable to RJR's ITS sealing equipment product line and serving the same back-end customer base.

Emerging players

• Indium Corporation: Indium Corporation supplies specialty materials for semiconductor and PCB assembly, including solder, underfills, and packaging materials. It is a comparable specialty materials peer for RJR's epoxy and packaging consumables business.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles2 records

Funding overview

Funding rounds2 records

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about RJR Technologies