Xallent
Xallent Inc. is a Cornell spinoff that builds MEMS-based nanoscale probing systems (HITS™ and SAKYIWA NanoProber) for semiconductor chiplet, advanced-package, and thin-film testing, serving semiconductor manufacturers, research universities, and defense laboratories.
- Company typePrivate
- Founded2013
- HeadquartersIthaca, United States
- Headcount1–10
- GTM typeB2B
- OfferingHardware or Manufacturing
What Xallent does
Xallent Inc. is a Cornell University spinoff that designs and manufactures nanoscale measurement hardware and software for imaging, testing, and analyzing semiconductors and thin-film materials. The company's core platform is built around MEMS-based fine-pitch probe technology that enables sub-micron electrical contact for testing chiplets, advanced packages, microbump arrays, copper pillars, hybrid-bonded structures, and 2.5D/3D heterogeneous integrations without sacrificial test pads or lithography-heavy cycles. Its product portfolio centers on the HITS™ Unified Test System and the SAKYIWA NanoProber, supported by proprietary probe cards, software, and accessories developed in collaboration with NIST, Sandia, Brookhaven, Cornell, and ASU. The company is pursuing the metrology bottleneck associated with sub-2nm nodes and advanced-packaging scaling, a segment where conventional prober architectures are reaching physical limits.
The company sells primarily through direct enterprise sales to semiconductor manufacturers, national laboratories, defense agencies, and research universities, with channel partners covering China/Taiwan (SE Technologies) and the Middle East. Pricing is quote-based: standard products ship on Net 30 terms while custom systems require 50% deposits, indicating a project-based, high-ticket capital equipment model with professional services (installation, training, support) layered on top. Founded in 2013 and headquartered in Albany, New York after a February 2024 relocation from Ithaca, Xallent operates with a small team of 1-10 employees and has been funded primarily through federal non-dilutive sources, including NSF SBIR awards (cumulative ~$1.28M) and a DARPA STTR Phase I grant.
Xallent firmographics
Firmographics- Name
- Xallent
- Legal name
- Xallent Inc.
- Website
- https://xallent.com
- Company type
- Private
- Founded year
- 2013
- Operating status
- Operating
- Headcount range
- 1–10 employees
- Short description
- Xallent Inc. is a Cornell spinoff that builds MEMS-based nanoscale probing systems (HITS™ and SAKYIWA NanoProber) for semiconductor chiplet, advanced-package, and thin-film testing, serving semiconductor manufacturers, research universities, and defense laboratories.
- Ownership category
- akta.pro rank
Xallent industry classification
Industry- Product category
- Semiconductor Metrology Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515), Research and Development in Nanotechnology (541713)
- SIC
- Instruments For Meas & Testing Of Electricity & Elec Signals (3825)
- akta.pro primary industry
- Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ)
- akta.pro secondary industry
- Metrology, Inspection & Machine Tool Accessories (CMMs, Probing, Gauging) (IMAHADAK)
Keywords
Where Xallent is headquartered
LocationHeadquarters
- HQ city
- Ithaca
- HQ country
- United States
- HQ region
- North America
Offices1 record
Markets served
Xallent business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Operations, Marketing or Sales, Supply Chain
Revenue model
- Standard Products: Manufactured products including thin film materials testing equipment, advanced package testing solutions, and fine-pitch probing systems sold directly to semiconductor manufacturers and research institutions.
- Custom Products: Products designed and manufactured based on specifications provided by buyers, typically for specialized semiconductor testing applications. Custom products require 50% payment upon order placement and 50% upon shipment.
- Professional Services: Installation, training, and technical support services for their testing systems, including installation at customer facilities like the Dubai installation and ASU Defense Microelectronics Hub.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| One time/ perpetual license | Pay-as-you-go | Standard Products - Pre-configured testing equipment |
| One time/ perpetual license | Multi-year contract | Custom Products - Bespoke testing solutions |
Go-to-market motion1 record
Distribution channels2 records
Marketing channels4 records
Xallent product offering
Product offeringCore offering
Xallent designs, manufactures, and sells nanoscale measurement hardware and software used to image, probe, and electrically test semiconductors and thin film materials. Its HITS™ Unified Test System and SAKYIWA NanoProber leverage proprietary MEMS-based fine-pitch probes combined with computer vision and automation to deliver sub-micron, direct-contact testing of chiplets, advanced packages (2.5D/3D, hybrid bonding, microbumps, copper pillars), and pristine thin films, replacing sacrificial test pads and lithography-heavy workflows. The company also provides installation, training, and technical support services tied to its systems.
Product overview
Xallent is an advanced semiconductor metrology company offering a portfolio of fine pitch probing solutions designed for the chiplet era. The core product lineup consists of the HITS™ unified test system and the SAKYIWA NanoProber, which leverage proprietary MEMS-based fine-pitch probes combined with computer vision and automation. These products are organized around two main application areas: Thin Film Materials testing and Advanced Package testing, including 2D Material Tests. The 'Direct-Contact' philosophy eliminates traditional fabrication hurdles like sacrificial test pads and lithography cycles, enabling rapid testing of chiplets, advanced packages, and thin films. The technology is designed for 2.5D and 3D integration, hybrid bonding, microbumps, and copper pillars.
Differentiator
Problem solved
Functional benefit
Brands
- HITS™: Unified test system for semiconductor testing utilizing direct-contact philosophy
- SAKYIWA NanoProber
- NanoProbers
Products and services
- HITS™ Unified Test System A unified test system based on Xallent's 'Direct-Contact' philosophy that interfaces directly with pristine thin films and micro-scale interconnects, eliminating sacrificial test pads and chemical-heavy lithography cycles. Built for semiconductor manufacturers and research institutions working on chiplets and advanced packages.
- SAKYIWA NanoProber Sub-micron precision nanoprobing system for fine-pitch testing of chiplets, advanced packages, and thin films, including hybrid bonding, microbumps, and copper pillars. Sold to semiconductor manufacturers, defense labs, and research institutions.
- Thin Film Materials Testing Application solution for testing thin film materials used in semiconductor manufacturing, delivering early actionable insights during new materials development. Targeted at semiconductor manufacturers and university research groups.
- Advanced Package Testing Application solution for testing advanced semiconductor packaging, including 2.5D and 3D integration, hybrid bonding, microbumps, and copper pillars to validate Known-Good Die. Used by foundries and packaging manufacturers.
- 2D Material Tests Application solution for testing 2D materials used in next-generation semiconductor devices, supporting university and corporate materials-research workflows.
Quantifiable outcome
- Reduce chip design costs by 25%
- +2 more outcomes
Companies that use Xallent
Customer profileNamed customers4 records
Segments3 records
Ideal customer profiles3 records
Xallent technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
AI capability1 record
Feature4 records
Xallent partnerships and signals
Strategic signalPartnerships
Ten partnerships are on record, tiered core and minor.
- Cornell UniversitycoreXallent is a Cornell-spinoff company with deep ties to Cornell's NanoScale Science and Technology Facility. The partnership involves collaborative development of high-resolution semiconductor test chips, with Muthangi (M.Eng. student) performing full fabrication processes including lithography, metal deposition, and etching, while Xallent uses the resulting data to refine its semiconductor testing tools.
- IBMcoreXallent collaborated with IBM on advanced package tests, presenting groundbreaking findings at SWTest 2025 on 'Fine Pitch' probing technology for advanced packaging applications.
- Arizona State University (ASU) Defense Microelectronics HubcoreXallent successfully completed installation and training of its SAKYIWA NanoProber system at ASU's Defense Microelectronics Hub for defense-related semiconductor testing applications.
- MPIcoreXallent and MPI announced strategic partnership to innovate and accelerate the development of next generation AI chips through combined expertise in fine pitch probing and probe station technology.
- Air Force Research LabscoreCollaboration focused on materials testing for radar, hypersonic systems, radiation-hard space applications, and Size, Weight, and Power (SWaP) improvements requiring materials that support higher voltages and temperatures.
- National Institute of Standards and Technology (NIST)coreXallent's collaboration with NIST resulted in a novel nanomachine probe that leverages nano-electro-mechanical-systems (NEMS) technology and is monolithically integrated for advanced metrology applications.
- MicrosoftminorXallent was selected for Microsoft's highly competitive early-stage B2B Startup program which aims at creating technical solutions that support customers in AI and advanced computing applications.
- Sandia National Laboratories (CINT)coreSandia National Laboratory granted Xallent access to their Center for Integrated Nanotechnologies (CINT) facility. Xallent works with engineers at Sandia to further develop its nanomachine technology.
- Brookhaven National LaboratorycoreXallent received approval to conduct research activities at Brookhaven National Laboratory (BNL), a multipurpose research institution funded primarily by the U.S. Department of Energy's Office of Science.
- SE TechnologiesminorSE Technologies serves as Xallent's sales representative for China and Taiwan markets, located at 3F-3, No. 371, Sec. 1, Kuang-fu Road, HsinChu 300, Taiwan.
Scale indicators2 records
Recent moves7 records
Expansion highlights5 records
Xallent competitors and assessment
Company assessmentDirect peers
- MPI Corporation: Taiwan-based global leader in probe stations and advanced wafer-level test equipment. Direct peer in fine-pitch probing for semiconductor test, and explicitly Xallent's strategic partner for AI-chip test.
- Signatone: US-based manufacturer of manual and semi-automatic probe stations used in semiconductor wafer and package-level testing. Direct peer serving similar characterization and failure-analysis customers.
- Onto Innovation: US-based supplier of process control and metrology tools for advanced packaging, 3D integration, and front-end semiconductor manufacturing. Direct peer in advanced-packaging inspection and metrology.
- FormFactor: Leading supplier of probe cards, probe stations, and engineered test solutions for the semiconductor industry. Direct competitor in fine-pitch and advanced packaging probing for both wafer sort and final test.
- Wentworth Laboratories: Manufacturer of analytical probe stations for semiconductor failure analysis and wafer-level test. Direct peer in precision probing equipment serving similar device-characterization use cases.
- Tokyo Seimitsu (Accretech): Japanese manufacturer of probe stations, wafer probers, and metrology equipment. Direct peer in sub-micron probing systems used in semiconductor device characterization and advanced packaging test.
- Cascade Microtech (now part of FormFactor): Heritage brand in analytical probe stations for device characterization, RF, and MEMS testing. Direct overlap with Xallent's MEMS-based fine-pitch probing for advanced semiconductor metrology.
Broad incumbents
- KLA Corporation: Global leader in process control, yield management, and inspection/metrology for semiconductors. Broad incumbent whose portfolio overlaps with Xallent's metrology niche but at much larger scale across the fab.
- Bruker Nano Surfaces: Division of Bruker offering atomic force microscopy and nanoscale metrology tools used in semiconductor materials characterization and failure analysis. Broad incumbent with overlapping nanoscale measurement capability.
Emerging players
- Park Systems: Specialist in atomic force microscopy (AFM) and nanoscale metrology tools used in semiconductor and 2D-materials research. Emerging player addressing the same nanoscale metrology niche from a complementary technology angle.
Market position
Strengths4 records
Weaknesses4 records
Competitive moat4 records
Key risks5 records
Key highlights7 records
Customer concentration
Xallent social profiles
Digital presenceXallent financial estimates
Financial estimateRevenue estimate
Valuation estimate
Xallent leadership team
Management profileNumber of profiles
Profiles1 record
Xallent funding detail
Funding detailFunding overview
Funding rounds3 records
Investors2 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Xallent M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Xallent
What does Xallent do?
Xallent designs, manufactures, and sells nanoscale measurement hardware and software used to image, probe, and electrically test semiconductors and thin film materials. Its HITS™ Unified Test System and SAKYIWA NanoProber leverage proprietary MEMS-based fine-pitch probes combined with computer vision and automation to deliver sub-micron, direct-contact testing of chiplets, advanced packages (2.5D/3D, hybrid bonding, microbumps, copper pillars), and pristine thin films, replacing sacrificial test pads and lithography-heavy workflows. The company also provides installation, training, and technical support services tied to its systems.
Is Xallent a public or private company?
Xallent is a private company. It is classified as unknown and is currently operating.
When was Xallent founded?
Xallent was founded in 2013. It employs 1 to 10 people.
Where is Xallent based?
Xallent is headquartered in Ithaca, United States, in the North America region.
How does Xallent make money?
Three revenue lines are on record. Standard Products are the primary driver. The others are custom Products and professional Services.
Who are Xallent's main competitors?
Direct peers on record are MPI Corporation, Signatone, Onto Innovation, FormFactor, Wentworth Laboratories, Tokyo Seimitsu (Accretech) and Cascade Microtech (now part of FormFactor). Broad incumbents are KLA Corporation and Bruker Nano Surfaces. Park Systems is listed as an emerging player.
Does Xallent have an API?
No public API is recorded for Xallent.
What industry is Xallent in?
Xallent's product category is Semiconductor Metrology Equipment. Its primary akta.pro industry code is HDAHAEAJ, Test, Probe & Burn-In Equipment (Wafer Sort/Final Test), with a secondary code of IMAHADAK, Metrology, Inspection & Machine Tool Accessories (CMMs, Probing, Gauging). Its NAICS code is 333242 and its SIC code is 3825.