Integra Technologies
Integra Technologies is the largest U.S.-domiciled OSAT service provider, offering turnkey semiconductor assembly, test, and qualification for defense, aerospace, space, medical, automotive, and communications customers from Wichita, KS and Milpitas, CA facilities. It operates as a Micross Components subsidiary following a January 2025 acquisition by Behrman Capital.
- Company typePrivate
- Founded1984
- HeadquartersWichita, United States
- Headcount251–500
- GTM typeB2B
- OfferingServices
What Integra Technologies does
Integra Technologies is a U.S.-domiciled Outsourced Semiconductor Assembly and Test (OSAT) service provider, headquartered in Wichita, Kansas with a second facility in Milpitas, California, operating the largest independent U.S. OSAT platform focused on high-reliability microelectronics. The company serves defense, aerospace, space, medical, automotive, and communications OEMs with a full-turnkey service stack organized into Die Preparation, Packaging & Assembly, and Testing & Qualification. Core capabilities include wafer thinning down to 25 µm via a proprietary dry polishing process, Dice Before Grind (DBG) singulation, FALIT laser-and-acid decapsulation, Ultra Low-k mechanical dicing achieving >95% yield at 14nm, plus full electrical test (digital, analog, RF to 50 GHz, mixed signal, memory), reliability and PEM qualification, destructive physical analysis, failure analysis, counterfeit detection, and obsolescence management.
The platform combines substantial capital infrastructure (DISCO dicing systems, FC150 flip chip bonder, TOWA compression molding, Accretech AL3000 laser grooving, FTI 1000 wide-bandgap tester, SEM and metallurgical labs) with proprietary process know-how accumulated over 40+ years. Integra holds DMEA DoD Category 1A Trusted Source accreditation, ITAR registration, DLA QML suitability across multiple MIL specifications, NASA GSFC approved-supplier status, and ISO 9001/AS9100/ISO 13485 certifications — accreditations that gate entry into U.S. defense and aerospace supply chains. The company reports tens of millions of die inspected monthly, over 800 PEM qualification lots processed, and 100M+ die probed across its customer base of 500+ active accounts, including Northrop Grumman and NASA programs such as Mars Rover and Hubble Telescope.
Integra generates revenue through project-based professional services (assembly, test, qualification) and processed die/wafer product sales via its High Reliability Division, with quote-based, multi-year contract pricing and dedicated program managers assigned to each customer engagement. The company was employee-owned (ESOP) until January 2025, when it was acquired by Micross Components, a Behrman Capital portfolio company with 18 global manufacturing operations, and now operates as an independent subsidiary. In February 2023, prior to the Micross transaction, Integra announced a planned one million-square-foot Bel Aire, Kansas facility projected at $1.8-2B capex and 2,000-2,500 new jobs contingent on CHIPS Act funding, signaling an intent to materially scale U.S. high-reliability OSAT capacity.
Integra Technologies firmographics
Firmographics- Name
- Integra Technologies
- Legal name
- Integra Technologies, Inc.
- Website
- https://integra-tech.com
- Company type
- Private
- Founded year
- 1984
- Operating status
- Operating
- Headcount range
- 251–500 employees
- Short description
- Integra Technologies is the largest U.S.-domiciled OSAT service provider, offering turnkey semiconductor assembly, test, and qualification for defense, aerospace, space, medical, automotive, and communications customers from Wichita, KS and Milpitas, CA facilities. It operates as a Micross Components subsidiary following a January 2025 acquisition by Behrman Capital.
- Ownership category
- akta.pro rank
Integra Technologies industry classification
Industry- Product category
- Semiconductor Assembly and Test Services
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (33441), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515)
- SIC
- Electronic Components, Nec (3679)
- akta.pro primary industry
- Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ)
- akta.pro secondary industries
- Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI), Test Services (Wafer Sort, Final Test, Burn-In) (HDAHADAD)
Keywords
Where Integra Technologies is headquartered
LocationHeadquarters
- HQ city
- Wichita
- HQ country
- United States
- HQ region
- North America
Offices2 records
Markets served
Integra Technologies business model
Business model- GTM type
- B2B
- Offering type
- Services
- Cost components
- Technology or R&D, Infrastructure, Personnel, Operations, Supply Chain
Revenue model
- OSAT Services: Full-turnkey semiconductor assembly, packaging, test and qualification services. Revenue generated through die preparation, IC packaging, electrical testing, reliability qualification, failure analysis, and counterfeit detection services. Services provided on project basis with program management.
- Product Sales (Die & Wafer): Sale of processed die and wafer products including value-added processing through their High Reliability Division.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Custom quotation-based pricing |
Go-to-market motion1 record
Distribution channels1 record
Marketing channels6 records
Integra Technologies product offering
Product offeringCore offering
Integra Technologies provides Outsourced Semiconductor Assembly and Test (OSAT) services, including die preparation (wafer thinning, dicing, pick & place, inspection), IC packaging and assembly (SiP/MCM, standard packaging, die attach, encapsulation, flip chip), and testing and qualification (electrical test, reliability, DPA/failure analysis, counterfeit detection, obsolescence management). The company serves high-reliability microelectronics programs for defense, aerospace, space, medical, automotive, and communications customers from facilities in Wichita, KS and Milpitas, CA.
Product overview
Integra Technologies is a platform of semiconductor assembly, test, and qualification services organized into three core product categories: Die Preparation (Wafer Thinning & Polishing, Wafer Dicing, Pick & Place, Die Inspection), Packaging & Assembly (SiP/MCM, Standard IC Packaging, Die Attach, Encapsulation, Flip Chip/Interconnect, Quick Turn Production), and Testing & Qualification (Electrical Test with Total Test Solution, Device Up-Screening, Wafer Probe, Singulated Die Probe, Custom ASIC & FPGA Testing; Reliability & Qualification including PEM Qualification, Cu Wire Evaluation, ESD Services; DPA & FA including Laser Ablation; Counterfeit Detection; and supporting services including Obsolescence Management, BOM Procurement, and Program Management). The company operates as a full-turnkey OSAT provider serving aerospace, defense, space, medical, automotive, and communications sectors, with facilities in Wichita, KS and Milpitas, CA.
Differentiator
Problem solved
Functional benefit
Products and services
- Die Preparation
Quantifiable outcome
- Ultra Low-k dicing yield >95% down to 14nm technology
- +4 more outcomes
Companies that use Integra Technologies
Customer profileNamed customers3 records
Segments5 records
Ideal customer profiles4 records
Integra Technologies technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature5 records
Integra Technologies partnerships and signals
Strategic signalPartnerships
One partnership is on record.
- National Center for Manufacturing Sciences (NCMS)coreIntegra selected to participate in collaborative program headed by NCMS for Integrated Photonics for Sustained Operations including Positional Navigational and Timing (PNT) elements. Project sponsored by U.S. Department of Defense through Cooperative Agreement Award No. HQ0034-20-2-0007 under CTMA program. Participants include U.S. Army DEVCOM ARL.
Scale indicators4 records
Recent moves8 records
Expansion highlights5 records
Integra Technologies competitors and assessment
Company assessmentDirect peers
- Hana Microelectronics: Thailand-headquartered OSAT with assembly and test services for ICs and MEMS, with particular strength in high-reliability and RF modules. Closely comparable to Integra's mix of high-reliability and specialty packaging programs.
- King Yuan Electronics (KYEC): One of the largest independent semiconductor test services providers globally. Directly comparable to Integra's Electrical Test, wafer probe, and qualification capabilities, particularly for high-volume RF and mixed-signal devices.
- Signetics: Mid-sized U.S.-domiciled OSAT providing assembly and test services with a focus on high-reliability and specialty programs. Direct peer in the niche of smaller, U.S.-based specialty packaging and test providers serving defense and aerospace.
Broad incumbents
- Amkor Technology: One of the world's largest OSAT providers, headquartered in the U.S. with global packaging and test facilities. Direct competitor in advanced packaging, flip chip, and SiP for automotive, communications, and high-reliability end markets, but at significantly larger scale and broader geographic footprint than Integra.
- UTAC Holdings: Singapore-based OSAT providing assembly and test services across analog, mixed signal, memory and RF devices. Competes with Integra in automotive, communications, and industrial end markets with similar full-turnkey packaging offerings.
- Powertech Technology (PTI): Taiwan-based OSAT focused on memory and logic packaging/test. Comparable as a full-service assembly and test provider; serves similar commercial end markets and competes on advanced packaging capabilities.
- ASE Technology Holding (ASE Group): World's largest OSAT, offering full-turnkey semiconductor packaging, test, and assembly across a global footprint. Closest comparable on full-turnkey OSAT model, though primarily Asia-domiciled and focused on high-volume commercial packaging rather than Integra's hi-rel defense/aerospace niche.
- JCET Group: Major China-based OSAT with global operations including the former STATS ChipPAC facilities. Competes with Integra in advanced packaging, flip chip bumping, and SiP for communications, automotive, and industrial end markets.
- ChipMOS Technologies: Taiwan-based OSAT offering back-end assembly, test, and packaging for memory and mixed-signal semiconductors. Comparable on test services and packaging breadth, though focused on Asia-domiciled customers.
Others
- Micross Components: Parent company of Integra Technologies since January 2025; offers hi-reliability microelectronic components and solutions through 18 global operations. Now operates as the combined platform rather than a pure peer, but previously comparable as a hi-rel distributor and packaging provider.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat6 records
Key risks6 records
Key highlights7 records
Customer concentration
Integra Technologies social profiles
Digital presenceIntegra Technologies compliance and trust
Trust signalCompliance14 records
Integra Technologies financial estimates
Financial estimateRevenue estimate
Valuation estimate
Integra Technologies leadership team
Management profileNumber of profiles
Profiles9 records
Integra Technologies funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Integra Technologies M&A and investment
M&A and investmentM&A1 record
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Integra Technologies
What does Integra Technologies do?
Integra Technologies provides Outsourced Semiconductor Assembly and Test (OSAT) services, including die preparation (wafer thinning, dicing, pick & place, inspection), IC packaging and assembly (SiP/MCM, standard packaging, die attach, encapsulation, flip chip), and testing and qualification (electrical test, reliability, DPA/failure analysis, counterfeit detection, obsolescence management). The company serves high-reliability microelectronics programs for defense, aerospace, space, medical, automotive, and communications customers from facilities in Wichita, KS and Milpitas, CA.
Is Integra Technologies a public or private company?
Integra Technologies is a private company. It is classified as private equity controlled and is currently operating.
When was Integra Technologies founded?
Integra Technologies was founded in 1984. It employs 251 to 500 people.
Where is Integra Technologies based?
Integra Technologies is headquartered in Wichita, United States, in the North America region.
How does Integra Technologies make money?
Two revenue lines are on record. OSAT Services are the primary driver. The others are product Sales (Die & Wafer).
Who are Integra Technologies's main competitors?
Direct peers on record are Hana Microelectronics, King Yuan Electronics (KYEC) and Signetics. Broad incumbents are Amkor Technology, UTAC Holdings, Powertech Technology (PTI), ASE Technology Holding (ASE Group), JCET Group and ChipMOS Technologies. Micross Components is listed as an others.
Does Integra Technologies have an API?
No public API is recorded for Integra Technologies.
What industry is Integra Technologies in?
Integra Technologies's product category is Semiconductor Assembly and Test Services. Its primary akta.pro industry code is HDAHADAJ, Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey), with a secondary code of HDAHADAA, Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA). Its NAICS code is 33441 and its SIC code is 3679.