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Sikama International

Full company profile

uuid00077g3

Namestring
Sikama International
Legal namestring
Sikama International, Inc.
Websiteurl
sikama.com
Company typeenum
Private
Founded yearint
1984
Descriptiontext

Sikama International, Inc. is a Santa Barbara, California-based designer and manufacturer of reflow solder and epoxy curing systems serving the global electronics manufacturing industry. The company sells hardware platforms including the Falcon series (benchtop to mid-range ovens such as the Falcon 5C, Falcon 1200, and Falcon 8500), the Ultra Profile series (high-throughput multi-zone UP2000 and UP4000 ovens), the EA1200 fluxless reflow system, and the UP1200 for 300mm wafer processing, alongside support equipment such as the ICS412 flux coater/washer, a Shuttle transport system, and hotplates. Its core technology combines bottom-up conduction heating with top-down convection and radiant heating, with zone-by-zone temperature calibration, individual gas flow controls, and patented Electron Attachment (EA) fluxless capability co-developed with Air Products, enabling residue-free soldering without formic acid and operating at sub-5% hydrogen levels.

Short descriptiontext

Sikama International designs and manufactures proprietary reflow solder and epoxy curing systems for global electronics manufacturers, semiconductor packaging firms, aerospace and defense contractors, and academic research institutions, selling through U.S. representatives and international distributors.

Operating statusenum
Operating
Ownership categoryenum
Headcount rangeband
11–50
akta.pro rankint
HeadquartersSanta Barbara, United States
HQ citystring
Santa Barbara
HQ countrystring
United States
HQ regionstring
North America
Markets served

Serves global market

Offices2 records

Each record includes

City, Country, Type, Description, Source

Keyword5 values
reflow soldering systems, electronics manufacturing equipment, thermal processing ovens, semiconductor packaging, fluxless soldering
Industry1 code
1Thermal Processing Equipment (Furnaces/RTP/Anneal)
CodeHDAHAEAEPrimaryYes
NAICS code2 codes
  • Industrial Process Furnace and Oven Manufacturing333994
  • Semiconductor Machinery Manufacturing333242
SIC code1 code
  • Industrial Process Furnaces & Ovens3567
Product category
Reflow Soldering and Thermal Curing Equipment
GTM motion2 records

Each record includes

Type, Description, Source

Revenue model4 records
1Reflow Soldering Equipment Sales
TypeHardware Sales
Description

Sale of reflow ovens and soldering systems including Falcon series, Ultra Profile series, EA1200, and related equipment for electronics manufacturing and semiconductor packaging.

sikama.com
2Support Equipment Sales
TypeHardware Sales
Description

Sale of support equipment including ICS412 Flux Coater & Washer, Shuttle systems, Hotplates, and metrology equipment.

sikama.com
3Refurbished Equipment Sales
TypeHardware Sales
Description

Sale of refurbished Sikama equipment with full year warranty, offering lower-cost alternatives with reduced lead times.

sikama.com
4Product Support and Service
TypeProfessional Services
Description

Customer support services including on-site testing, metrology, and technical support through regional representatives and international distributors.

sikama.com
Marketing channels7 records

Each record includes

Title, Type, Stage, Description, Source

Distribution channels4 records

Each record includes

Title, Type, Scope, Target buyer, Description, Source

Cost components6 values
Supply Chain, Personnel, Operations, Technology or R&D, Marketing or Sales, Infrastructure
GTM typeB2B
B2B
Offering typeHardware or Manufacturing
Hardware or Manufacturing
Core offering1 text field

Sikama International designs, develops, and manufactures reflow soldering and thermal curing systems for the electronics manufacturing and semiconductor packaging industries. Its portfolio includes benchtop, mid-size, and high-volume multi-zone reflow ovens, fluxless soldering systems using proprietary Electron Attachment technology, and complementary support equipment such as flux coaters, washers, shuttles, and hotplates. The company sells new and refurbished equipment through regional U.S. sales representatives and international distributors.

Differentiator
Functional benefit
Problem solved
Quantifiable outcome1 of 6 values shown
  • Less than 10ppm O2 levels in processing chamber
+5 more records
Product overview1 text field

Sikama International is a designer and manufacturer of reflow solder and curing systems for the electronics manufacturing industry. The product portfolio centers on two main platform families: the Falcon series (benchtop to mid-size ovens including Falcon 5C, Falcon 1200, Falcon 8500) and the Ultra Profile series (high-performance multi-zone ovens including UP2000 and UP4000). Supporting these core platforms are specialized systems including the EA1200 (Electron Attachment fluxless technology), ICS412 Flux Coater & Washer, UP1200 (300mm-capable reflow), and the Shuttle transport system. Products share proprietary conduction+convection+radiant heating technology with zone-by-zone temperature control and low O2 environments. The company also offers partner products including Jabil wafer handling systems, ECD monitoring equipment, and LAUDA temperature controllers as part of their solution ecosystem.

Product and service12 records
1EA1200 Acid-Free Electron Attachment Fluxless Solder Reflow System
CategoryReflow soldering equipment
Description

Next-generation fluxless reflow solder oven using patented Electron Attachment technology developed with Air Products. Features eight working zones (six heating, two cooling) with N2 cover gas and H2/N2 blend atmosphere for residue-free soldering. CE certified.

2UP1200 Multi-Purpose Reflow Oven
CategoryReflow soldering equipment
Description

Multi-purpose continuous flow reflow soldering oven capable of temperatures up to 400°C. Processes up to 300mm wafers with <5ppm O2 levels. Features eight work zones with contact conduction heating combined with convection and radiant heating. SECS/GEM and SMEMA capable.

3Falcon 1200 Reflow Furnace
CategoryReflow soldering equipment
Description

Budget-friendly reflow furnace capable of temperatures up to 400°C for wafer bump reflow, insulated metal-core substrates, BGA, high mass components, and epoxy curing. Features 1 load zone, 7 heat zones, and 2 cooling zones with <10ppm O2 levels.

4Falcon 5C Benchtop Reflow Oven
CategoryReflow soldering equipment
Description

Full-featured benchtop conduction+convection reflow oven processing substrates up to 5" by 5.75" with 400°C maximum heat. Features 4 heating zones and 2 cooling zones in under 10 square feet of floor space. Handles fluxless gold tin reflow, BGA singulated ball reflow, and various substrate materials.

5Falcon 8500 Reflow Solder System
CategoryReflow soldering equipment
Description

200mm reflow solder system with 1 load zone, 5 heat zones, and 2 cooling zones. Well suited for wafer bumping applications (3-8 inch diameter wafers) and broad range of substrate materials, high mass components, and fixtures. Available with sweeper bar or walking beam transport systems.

6Ultra Profile 2000 (UP2000) Reflow Oven
CategoryReflow soldering equipment
Description

Seven-zone reflow oven with patented Conduction+Convection technology. Features cooled loading platform, four heat zones, top and bottom liquid-cooled zones, and liquid-cooled offload platform. Handles die soldering, BGAs, Flip Chips, IMS substrates, and high density components up to 400°C.

7Ultra Profile 4000 (UP4000) Reflow Oven
CategoryReflow soldering equipment
Description

Twelve-zone reflow oven for complex thermal profiles. Features cooled loading platform, seven heat zones, three top and bottom liquid-cooled zones, and liquid-cooled offload platform. Uses same Conduction+Convection technology as UP2000 for balanced heating and cooling.

8ICS412 Inline Flux Coater & Wafer Washer
CategorySupport equipment
Description

Inline flux coating and wafer washing system capable of dispensing up to 4 process fluids on wafers from 4 to 12 inches (300mm). Features servo drive spin chuck with speeds from 1 to 2000 RPM and fully servo-driven inline belt transport.

9Shuttle Programmable Transport System
CategorySupport equipment
Description

Programmable translating roller assembly for automated process flow. Enables transport of components from upstream to downstream equipment. Fully SECS/GEM and SMEMA compatible, developed in response to customer Mercury Systems' space-saving requirements.

10Hotplate Reflow Repair System
CategorySupport equipment
Description

8 by 8 inch cast aluminum platen hot plate for surface mount component reflow repair, hybrid circuit fabrication and repair, component curing and temperature cycling. Temperature range from ambient to 350°C in 1°C increments with K-type thermocouple.

11Refurbished Equipment Program
CategoryRefurbished capital equipment
Description

Sale of refurbished Sikama equipment with full year warranty, offering lower-cost alternatives with reduced lead times for budget-conscious customers seeking entry into Sikama's installed base of reflow technology.

12Complimentary On-Site Testing and Metrology Services
CategoryProfessional services
Description

Customer support center in Camarillo, CA offering complimentary on-site testing, metrology, and profile evaluation, plus low run production runs. Prospective customers can send parts for evaluation or visit the factory to test equipment before purchase.

Scale indicator5 records

Each record includes

Type, Value, Description, Source

Partnership9 partners
Strategic tierCoreTypeTechnology or Integration
Description

Jabil offers wafer handling systems including WaferMate 300 (highly configurable robotic wafer-handling cell servicing up to 3 process tools) and WaferMate 200 Automation Platforms. Sikama offers these as complementary products to their reflow ovens for complete wafer processing solutions.

Strategic tierCoreTypeTechnology or Integration
Description

ECD offers OvenSENTINEL (continuous product quality monitoring system with traceability, analytics, and process monitoring) and SuperM.O.L.E. EV6 Thermal Profiler (massive memory capacity for thermal process measurements). Sikama offers these as process monitoring solutions paired with their reflow ovens.

3LAUDA
Strategic tierSupportingTypeTechnology or Integration
Description

LAUDA is a leading manufacturer of premium temperature control equipment including static water baths, recirculating baths, lab-scale and industrial chillers, custom heating/cooling systems with temperature range from -150 to 550 degrees Celsius and cooling capacity up to 365 kW.

sikama.com
Strategic tierSupportingTypeTechnology or Integration
Description

Industrial Physics EC900 Process Oxygen Analyser reaches oxygen levels as low as 20 ppm within 2 minutes, featuring maintenance-free disposable oxygen sensor and microprocessor controlled functions - ideal for semiconductor manufacturing processes.

Strategic tierCoreTypeStrategic or Co-development Partner
Description

Air Products collaborated with Sikama on development of the EA1200 Electron Attachment fluxless reflow oven. The oven uses N2 cover gas and H2/N2 blend with less than 5% hydrogen developed in partnership with Air Products.

Strategic tierCoreTypeChannel Partner/ Reseller/ Distributor
Description

U.S. Sales Representative covering San Jose CA, Nevada, Oregon, and Idaho regions for Sikama products.

Strategic tierCoreTypeChannel Partner/ Reseller/ Distributor
Description

U.S. Sales Representative covering New Mexico, Las Vegas NV, and Nogales Sonora for Sikama products.

Strategic tierCoreTypeChannel Partner/ Reseller/ Distributor
Description

International Distributor covering Germany, Austria, Hungary, Switzerland, and Portugal for Sikama products.

Strategic tierCoreTypeChannel Partner/ Reseller/ Distributor
Description

International Distributor strengthening Sikama's worldwide distributor network to support Korean and international markets, covering Malaysia, Thailand, Singapore.

Recent move6 records

Each record includes

Date, Type, Title, Description, Source

Expansion highlight5 records

Each record includes

Type, Description

Peers10 records
TypeDirect peer
Description

Heller Industries is a US-based reflow oven manufacturer serving SMT, semiconductor packaging, and advanced assembly customers. It directly overlaps Sikama's core reflow soldering market with a comparable product family at larger scale.

TypeDirect peer
Description

ERSA is a German manufacturer of reflow soldering, selective soldering, and rework systems. It is a leading direct competitor in reflow ovens for both SMT and semiconductor packaging, with a global direct-sales footprint.

TypeDirect peer
Description

BTU International makes convection reflow ovens for SMT and semiconductor packaging, including advanced atmosphere-controlled systems. It competes directly with Sikama in high-volume electronics manufacturing reflow.

TypeDirect peer
Description

Rehm Thermal Systems is a German manufacturer of reflow soldering and convection ovens for electronics manufacturing. It serves the same customer base as Sikama, particularly in European automotive and industrial electronics.

TypeDirect peer
Description

SEHO Systems produces selective soldering and reflow soldering equipment, including lead-free and fluxless systems. It is a focused reflow competitor with strong presence in Europe, comparable to Sikama in scope.

TypeBroad incumbent
Description

ITW EAE is the Electronics Assembly Equipment division of Illinois Tool Works, encompassing multiple soldering and SMT equipment brands. It competes with Sikama through broader portfolio offerings and significant global scale.

TypeBroad incumbent
Description

ASMPT is one of the largest semiconductor packaging equipment manufacturers, offering die bonding, molding, and thermal processing tools. It operates at significantly larger scale than Sikama across the broader advanced packaging equipment market that Sikama addresses.

TypeBroad incumbent
Description

Besi is a global supplier of semiconductor assembly equipment for advanced packaging, including die bonding and hybrid bonding. It is an incumbent in the broader market where Sikama's reflow and curing tools serve adjacent steps.

TypeEmerging player
Description

PAC TECH specializes in advanced packaging equipment including wafer-level soldering, fluxless processing, and laser-assisted bonding. It overlaps with Sikama's fluxless and advanced packaging focus at a similarly specialized scale.

TypeRegional player
Description

Finetech manufactures precision soldering and rework systems primarily for Germany and Europe. It is comparable to Sikama as a niche specialty soldering equipment maker with a different geographic center of gravity.

Market position
Strengths5 records

Each record includes

Headline, Details, Source

Weaknesses5 records

Each record includes

Headline, Details, Source

Competitive moat4 records

Each record includes

Type, Details

Key risks6 records

Each record includes

Headline, Details, Source

Key highlights7 records

Each record includes

Headline, Details, Source

Customer concentration

Classification, Details

Named customers6 records

Each record includes

Name, Industry, Type, Use case, Source, UUID

Segment5 records

Each record includes

Title, Type, Primary, Description, Pain point addressed, Use case, Source

Ideal customer profile5 records

Each record includes

Profile, Firmographic size, Sales motion, Sales cycle length, Buying structure, Purchase trigger, Buyer persona, Geography, Industry vertical, Primary use case, Description, Pain points, Evidence proof points, Target buyer

Technology focused
No
API detail
Has APIbool
No

Docs URL, Description

Integration6 records

Each record includes

Title, Type, Description, Source

AI maturity
App detail

Has app

Feature7 records

Each record includes

Title, Differentiator, Description, Source

Core technology
Revenue estimate
Valuation estimate
Number of profiles
Profiles5 records

Each record includes

Name, Designation, Designation category, Overview, Profile commentary, Source

No data
Compliance1 record

Each record includes

Name, Class, Description

Funding overview

Funding stage, Last funding date, Total funding USD

Funding rounds

Each record includes

Round, Amount USD, Date, Pre money valuation, Total investors, Investors, News

Investors

Each record includes

Name, Type, Date of entry, Rounds participated, Website

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Each record includes

Name, Acquisition type, Announced date, Completed date, Status, Website, News

Investment

Each record includes

Name, Round, Announced date, Lead investor, Website, News

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Sikama International

Reflow Soldering and Thermal Curing Equipmentsikama.com

Sikama International designs and manufactures proprietary reflow solder and epoxy curing systems for global electronics manufacturers, semiconductor packaging firms, aerospace and defense contractors, and academic research institutions, selling through U.S. representatives and international distributors.

What Sikama International does

Sikama International, Inc. is a Santa Barbara, California-based designer and manufacturer of reflow solder and epoxy curing systems serving the global electronics manufacturing industry. The company sells hardware platforms including the Falcon series (benchtop to mid-range ovens such as the Falcon 5C, Falcon 1200, and Falcon 8500), the Ultra Profile series (high-throughput multi-zone UP2000 and UP4000 ovens), the EA1200 fluxless reflow system, and the UP1200 for 300mm wafer processing, alongside support equipment such as the ICS412 flux coater/washer, a Shuttle transport system, and hotplates. Its core technology combines bottom-up conduction heating with top-down convection and radiant heating, with zone-by-zone temperature calibration, individual gas flow controls, and patented Electron Attachment (EA) fluxless capability co-developed with Air Products, enabling residue-free soldering without formic acid and operating at sub-5% hydrogen levels.

Sikama International firmographics

Firmographics
Name
Sikama International
Legal name
Sikama International, Inc.
Website
https://sikama.com
Company type
Private
Founded year
1984
Operating status
Operating
Headcount range
11–50 employees
Short description
Sikama International designs and manufactures proprietary reflow solder and epoxy curing systems for global electronics manufacturers, semiconductor packaging firms, aerospace and defense contractors, and academic research institutions, selling through U.S. representatives and international distributors.
Ownership category
akta.pro rank

Sikama International industry classification

Industry
Product category
Reflow Soldering and Thermal Curing Equipment
NAICS
Industrial Process Furnace and Oven Manufacturing (333994), Semiconductor Machinery Manufacturing (333242)
SIC
Industrial Process Furnaces & Ovens (3567)
akta.pro primary industry
Thermal Processing Equipment (Furnaces/RTP/Anneal) (HDAHAEAE)

Keywords

  • Reflow soldering systems
  • Electronics manufacturing equipment
  • Thermal processing ovens
  • Semiconductor packaging
  • Fluxless soldering

Where Sikama International is headquartered

Location

Headquarters

HQ city
Santa Barbara
HQ country
United States
HQ region
North America

Offices2 records

Markets served

Sikama International business model

Business model
GTM type
B2B
Offering type
Hardware or Manufacturing
Cost components
Supply Chain, Personnel, Operations, Technology or R&D, Marketing or Sales, Infrastructure

Revenue model

  1. Reflow Soldering Equipment Sales: Sale of reflow ovens and soldering systems including Falcon series, Ultra Profile series, EA1200, and related equipment for electronics manufacturing and semiconductor packaging.
  2. Support Equipment Sales: Sale of support equipment including ICS412 Flux Coater & Washer, Shuttle systems, Hotplates, and metrology equipment.
  3. Refurbished Equipment Sales: Sale of refurbished Sikama equipment with full year warranty, offering lower-cost alternatives with reduced lead times.
  4. Product Support and Service: Customer support services including on-site testing, metrology, and technical support through regional representatives and international distributors.

Go-to-market motion2 records

Distribution channels4 records

Marketing channels7 records

Sikama International product offering

Product offering

Core offering

Sikama International designs, develops, and manufactures reflow soldering and thermal curing systems for the electronics manufacturing and semiconductor packaging industries. Its portfolio includes benchtop, mid-size, and high-volume multi-zone reflow ovens, fluxless soldering systems using proprietary Electron Attachment technology, and complementary support equipment such as flux coaters, washers, shuttles, and hotplates. The company sells new and refurbished equipment through regional U.S. sales representatives and international distributors.

Product overview

Sikama International is a designer and manufacturer of reflow solder and curing systems for the electronics manufacturing industry. The product portfolio centers on two main platform families: the Falcon series (benchtop to mid-size ovens including Falcon 5C, Falcon 1200, Falcon 8500) and the Ultra Profile series (high-performance multi-zone ovens including UP2000 and UP4000). Supporting these core platforms are specialized systems including the EA1200 (Electron Attachment fluxless technology), ICS412 Flux Coater & Washer, UP1200 (300mm-capable reflow), and the Shuttle transport system. Products share proprietary conduction+convection+radiant heating technology with zone-by-zone temperature control and low O2 environments. The company also offers partner products including Jabil wafer handling systems, ECD monitoring equipment, and LAUDA temperature controllers as part of their solution ecosystem.

Differentiator

Problem solved

Functional benefit

Products and services

  • EA1200 Acid-Free Electron Attachment Fluxless Solder Reflow System Next-generation fluxless reflow solder oven using patented Electron Attachment technology developed with Air Products. Features eight working zones (six heating, two cooling) with N2 cover gas and H2/N2 blend atmosphere for residue-free soldering. CE certified.
  • UP1200 Multi-Purpose Reflow Oven Multi-purpose continuous flow reflow soldering oven capable of temperatures up to 400°C. Processes up to 300mm wafers with <5ppm O2 levels. Features eight work zones with contact conduction heating combined with convection and radiant heating. SECS/GEM and SMEMA capable.
  • Falcon 1200 Reflow Furnace Budget-friendly reflow furnace capable of temperatures up to 400°C for wafer bump reflow, insulated metal-core substrates, BGA, high mass components, and epoxy curing. Features 1 load zone, 7 heat zones, and 2 cooling zones with <10ppm O2 levels.
  • Falcon 5C Benchtop Reflow Oven Full-featured benchtop conduction+convection reflow oven processing substrates up to 5" by 5.75" with 400°C maximum heat. Features 4 heating zones and 2 cooling zones in under 10 square feet of floor space. Handles fluxless gold tin reflow, BGA singulated ball reflow, and various substrate materials.
  • Falcon 8500 Reflow Solder System 200mm reflow solder system with 1 load zone, 5 heat zones, and 2 cooling zones. Well suited for wafer bumping applications (3-8 inch diameter wafers) and broad range of substrate materials, high mass components, and fixtures. Available with sweeper bar or walking beam transport systems.
  • Ultra Profile 2000 (UP2000) Reflow Oven Seven-zone reflow oven with patented Conduction+Convection technology. Features cooled loading platform, four heat zones, top and bottom liquid-cooled zones, and liquid-cooled offload platform. Handles die soldering, BGAs, Flip Chips, IMS substrates, and high density components up to 400°C.
  • Ultra Profile 4000 (UP4000) Reflow Oven Twelve-zone reflow oven for complex thermal profiles. Features cooled loading platform, seven heat zones, three top and bottom liquid-cooled zones, and liquid-cooled offload platform. Uses same Conduction+Convection technology as UP2000 for balanced heating and cooling.
  • ICS412 Inline Flux Coater & Wafer Washer Inline flux coating and wafer washing system capable of dispensing up to 4 process fluids on wafers from 4 to 12 inches (300mm). Features servo drive spin chuck with speeds from 1 to 2000 RPM and fully servo-driven inline belt transport.
  • Shuttle Programmable Transport System Programmable translating roller assembly for automated process flow. Enables transport of components from upstream to downstream equipment. Fully SECS/GEM and SMEMA compatible, developed in response to customer Mercury Systems' space-saving requirements.
  • Hotplate Reflow Repair System 8 by 8 inch cast aluminum platen hot plate for surface mount component reflow repair, hybrid circuit fabrication and repair, component curing and temperature cycling. Temperature range from ambient to 350°C in 1°C increments with K-type thermocouple.
  • Refurbished Equipment Program Sale of refurbished Sikama equipment with full year warranty, offering lower-cost alternatives with reduced lead times for budget-conscious customers seeking entry into Sikama's installed base of reflow technology.
  • Complimentary On-Site Testing and Metrology Services Customer support center in Camarillo, CA offering complimentary on-site testing, metrology, and profile evaluation, plus low run production runs. Prospective customers can send parts for evaluation or visit the factory to test equipment before purchase.

Quantifiable outcome

  • Less than 10ppm O2 levels in processing chamber
  • +5 more outcomes

Companies that use Sikama International

Customer profile

Named customers6 records

Segments5 records

Ideal customer profiles5 records

Sikama International technology and API

Technology

Technology focussed No

API detail

Has API
No
API docs
API detail

Core technology

AI maturity

App detail

Integration6 records

Feature7 records

Sikama International partnerships and signals

Strategic signal

Partnerships

Nine partnerships are on record, tiered core and supporting.

  • JabilcoreTechnology or IntegrationJabil offers wafer handling systems including WaferMate 300 (highly configurable robotic wafer-handling cell servicing up to 3 process tools) and WaferMate 200 Automation Platforms. Sikama offers these as complementary products to their reflow ovens for complete wafer processing solutions.
  • ECD (Electronic Controls Design)coreTechnology or IntegrationECD offers OvenSENTINEL (continuous product quality monitoring system with traceability, analytics, and process monitoring) and SuperM.O.L.E. EV6 Thermal Profiler (massive memory capacity for thermal process measurements). Sikama offers these as process monitoring solutions paired with their reflow ovens.
  • LAUDAsupportingTechnology or IntegrationLAUDA is a leading manufacturer of premium temperature control equipment including static water baths, recirculating baths, lab-scale and industrial chillers, custom heating/cooling systems with temperature range from -150 to 550 degrees Celsius and cooling capacity up to 365 kW.
  • Industrial PhysicssupportingTechnology or IntegrationIndustrial Physics EC900 Process Oxygen Analyser reaches oxygen levels as low as 20 ppm within 2 minutes, featuring maintenance-free disposable oxygen sensor and microprocessor controlled functions - ideal for semiconductor manufacturing processes.
  • Air ProductscoreStrategic or Co-development PartnerAir Products collaborated with Sikama on development of the EA1200 Electron Attachment fluxless reflow oven. The oven uses N2 cover gas and H2/N2 blend with less than 5% hydrogen developed in partnership with Air Products.
  • TEC AssociatescoreChannel Partner/ Reseller/ DistributorU.S. Sales Representative covering San Jose CA, Nevada, Oregon, and Idaho regions for Sikama products.
  • G.E. Clevenger Co.coreChannel Partner/ Reseller/ DistributorU.S. Sales Representative covering New Mexico, Las Vegas NV, and Nogales Sonora for Sikama products.
  • Nanotec International GmbHcoreChannel Partner/ Reseller/ DistributorInternational Distributor covering Germany, Austria, Hungary, Switzerland, and Portugal for Sikama products.
  • CMT GlobalcoreChannel Partner/ Reseller/ DistributorInternational Distributor strengthening Sikama's worldwide distributor network to support Korean and international markets, covering Malaysia, Thailand, Singapore.

Scale indicators5 records

Recent moves6 records

Expansion highlights5 records

Sikama International competitors and assessment

Company assessment

Direct peers

  • Heller Industries: Heller Industries is a US-based reflow oven manufacturer serving SMT, semiconductor packaging, and advanced assembly customers. It directly overlaps Sikama's core reflow soldering market with a comparable product family at larger scale.
  • ERSA (Kurtz Ersa): ERSA is a German manufacturer of reflow soldering, selective soldering, and rework systems. It is a leading direct competitor in reflow ovens for both SMT and semiconductor packaging, with a global direct-sales footprint.
  • BTU International: BTU International makes convection reflow ovens for SMT and semiconductor packaging, including advanced atmosphere-controlled systems. It competes directly with Sikama in high-volume electronics manufacturing reflow.
  • Rehm Thermal Systems: Rehm Thermal Systems is a German manufacturer of reflow soldering and convection ovens for electronics manufacturing. It serves the same customer base as Sikama, particularly in European automotive and industrial electronics.
  • SEHO Systems: SEHO Systems produces selective soldering and reflow soldering equipment, including lead-free and fluxless systems. It is a focused reflow competitor with strong presence in Europe, comparable to Sikama in scope.

Broad incumbents

  • ITW EAE: ITW EAE is the Electronics Assembly Equipment division of Illinois Tool Works, encompassing multiple soldering and SMT equipment brands. It competes with Sikama through broader portfolio offerings and significant global scale.
  • ASM Pacific Technology: ASMPT is one of the largest semiconductor packaging equipment manufacturers, offering die bonding, molding, and thermal processing tools. It operates at significantly larger scale than Sikama across the broader advanced packaging equipment market that Sikama addresses.
  • BE Semiconductor Industries (Besi): Besi is a global supplier of semiconductor assembly equipment for advanced packaging, including die bonding and hybrid bonding. It is an incumbent in the broader market where Sikama's reflow and curing tools serve adjacent steps.

Emerging players

  • PAC TECH GmbH: PAC TECH specializes in advanced packaging equipment including wafer-level soldering, fluxless processing, and laser-assisted bonding. It overlaps with Sikama's fluxless and advanced packaging focus at a similarly specialized scale.

Regional players

  • Finetech GmbH: Finetech manufactures precision soldering and rework systems primarily for Germany and Europe. It is comparable to Sikama as a niche specialty soldering equipment maker with a different geographic center of gravity.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat4 records

Key risks6 records

Key highlights7 records

Customer concentration

Sikama International social profiles

Digital presence

Sikama International compliance and trust

Trust signal

Compliance1 record

Sikama International financial estimates

Financial estimate

Revenue estimate

Valuation estimate

Sikama International leadership team

Management profile

Number of profiles

Profiles5 records

Sikama International funding detail

Funding detail

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

Sikama International M&A and investment

M&A and investment

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Sikama International

What does Sikama International do?

Sikama International designs, develops, and manufactures reflow soldering and thermal curing systems for the electronics manufacturing and semiconductor packaging industries. Its portfolio includes benchtop, mid-size, and high-volume multi-zone reflow ovens, fluxless soldering systems using proprietary Electron Attachment technology, and complementary support equipment such as flux coaters, washers, shuttles, and hotplates. The company sells new and refurbished equipment through regional U.S. sales representatives and international distributors.

Is Sikama International a public or private company?

Sikama International is a private company. It is classified as founder individual operated bootstrapped and is currently operating.

When was Sikama International founded?

Sikama International was founded in 1984. It employs 11 to 50 people.

Where is Sikama International based?

Sikama International is headquartered in Santa Barbara, United States, in the North America region.

How does Sikama International make money?

Four revenue lines are on record. Reflow Soldering Equipment Sales are the primary driver. The others are support Equipment Sales, refurbished Equipment Sales and product Support and Service.

Who are Sikama International's main competitors?

Direct peers on record are Heller Industries, ERSA (Kurtz Ersa), BTU International, Rehm Thermal Systems and SEHO Systems. Broad incumbents are ITW EAE, ASM Pacific Technology and BE Semiconductor Industries (Besi). PAC TECH GmbH is listed as an emerging player. Finetech GmbH is listed as a regional player.

Does Sikama International have an API?

No public API is recorded for Sikama International.

What industry is Sikama International in?

Sikama International's product category is Reflow Soldering and Thermal Curing Equipment. Its primary akta.pro industry code is HDAHAEAE, Thermal Processing Equipment (Furnaces/RTP/Anneal). Its NAICS code is 333994 and its SIC code is 3567.

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