What Pac Tech - Packaging Technologies does

PacTech - Packaging Technologies GmbH is a German-headquartered semiconductor packaging equipment and services company, founded in 1993 and operating today as a wholly-owned subsidiary of Japan's NAGASE Group. The company designs, manufactures, and sells automated, high-precision packaging equipment organized under four proprietary product families — SB²® (solder ball mounting for WLCSP and flip-chip), LAPLACE® (laser-assisted bonding), Ultra-SB²® (enhanced fine-pitch solder ball mounting), and PACLINE® (integrated production-line packaging systems) — and supplies complementary plating chemicals. These tools address fine-pitch interconnects, 3D/3.5D packaging, probe card assembly, reballing, and SMT processes.

Beyond equipment, PacTech operates a wafer-level packaging (WLP) services business covering electroless plating, electroplating (including copper pillar and redistribution layer/RDL), solder balling, laser-assisted bonding, wafer-level component assembly, wafer thinning, wafer metal coating, and dicing. The combined equipment-plus-services-plus-chemicals offering is positioned as a complete process-transfer solution for semiconductor manufacturers across aerospace, automotive, consumer electronics, energy/solar, medical, and production/assembly verticals.

The company generates revenue primarily through one-time equipment sales, professional services (WLP), and consumable chemical sales, with pricing conducted on a quote basis. Go-to-market is enterprise field sales via wholly-owned subsidiaries in Germany (Nauen, headquarters and manufacturing), the USA (Pac Tech USA Inc., Santa Clara), Malaysia (PacTech Asia Sdn. Bhd., Penang), and a Seoul branch office, supplemented by regional distributors across Europe, the Nordics, Southeast Asia, India, Korea, Taiwan, and Japan. Management is led by Managing Directors Dr. Thorsten Teutsch and Annette Burczyk, and the firm operates as part of NAGASE's semiconductor and electronics division without external institutional investors.

Name

Pac Tech - Packaging Technologies

Legal name

Pac Tech – Packaging Technologies GmbH

Website

https://pactech.com

Company type

Private

Founded year

1993

Operating status

Operating

Headcount range

11–50 employees

Short description

PacTech - Packaging Technologies is a German-headquartered, NAGASE-owned semiconductor packaging equipment and wafer-level packaging services company. It sells proprietary equipment (SB²®, LAPLACE®, Ultra-SB²®, PACLINE®), WLP services, and plating chemicals to global semiconductor manufacturers across aerospace, automotive, consumer electronics, medical, and energy verticals.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC)

akta.pro secondary industries

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Semiconductor packaging equipment
• Wafer-level packaging
• Solder ball mounting
• Laser soldering equipment
• Wafer bumping services

Headquarters

HQ city

Nauen

HQ country

Germany

HQ region

Europe

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Supply Chain, Personnel, Operations, Marketing or Sales, Infrastructure

Revenue model

1. Advanced Packaging Equipment Sales: Sale of automated, high-precision manufacturing equipment for semiconductor packaging processes including laser soldering, plating, ball mounting, and assembly systems.
2. Wafer Level Packaging (WLP) Services: Customized WLP services including electroless plating, electroplating, copper pillar, RDL, solder balling, laser assisted bonding, component assembly, wafer thinning, metal coating, and dicing.
3. Plating Chemicals: Supply of high-tech chemicals for wafer-level packaging processes, providing complete plating solutions for guaranteed process transfer.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels5 records

Core offering

PacTech designs and manufactures advanced packaging equipment (SB²®, LAPLACE®, Ultra-SB²®, PACLINE® product families) for semiconductor manufacturing processes including laser soldering, laser-assisted bonding, electroless plating, and solder ball mounting. In parallel, the company provides customized wafer-level packaging (WLP) services such as electroless plating, electroplating (copper pillar, RDL), solder balling, laser-assisted bonding, wafer thinning, wafer metal coating, and wafer dicing, along with proprietary high-tech plating chemicals.

Product overview

PacTech is a semiconductor packaging technology company offering a platform-plus-services model consisting of four core equipment product lines (SB²®, LAPLACE®, Ultra-SB²®, and PACLINE®) and comprehensive wafer-level packaging (WLP) services. The equipment portfolio includes solder ball mounting, laser-based bonding, and electroless plating systems organized by process type (Laser Soldering, Laser Assisted Bonding, Electroless Plating, Wire Soldering), application (3D/3.5D Packaging, Flip Chip, Probe Card, Reballing, SMT), and industry sector (Aerospace, Automotive, Consumer Electronics, Energy/Solar, Medical, Production/Assembly). The WLP services complement the equipment offerings, providing electroless plating, electroplating (including Copper Pillar and RDL), solder balling, laser-assisted bonding, wafer-level component assembly, wafer thinning, wafer metal coating, and wafer dicing. The company also supplies proprietary high-tech chemicals for wafer-level packaging processes. Headquartered in Germany with operations in the USA and Malaysia, PacTech is backed by the NAGASE Group.

Differentiator

Problem solved

Functional benefit

Brands

• SB² ®: Product family for solder ball mounting machines for WLCSP and flip chip packaging
• LAPLACE ®
• Ultra-SB² ®
• PACLINE ®

Products and services

• SB² ® Equipment

Segments6 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature12 records

Scale indicators3 records

Recent moves6 records

Expansion highlights5 records

Broad incumbents

• Amkor Technology: One of the world's largest OSATs, offering advanced packaging services including flip-chip, WLP, and 2.5D/3D. Comparable to PacTech's WLP services arm but operating at vastly larger scale across a full packaging and test service portfolio.
• SCREEN Holdings: Japanese semiconductor equipment manufacturer offering cleaning, coating, and wafer-processing systems that intersect with PacTech's wafer thinning and metal coating services. Larger scale with broader semiconductor portfolio.
• ASE Technology Holding: World's largest OSAT, providing complete semiconductor packaging and test services including advanced WLP, fan-out, and 3D IC. Comparable to PacTech's WLP service portfolio but at hyperscale, with broader geographic coverage.

Direct peers

• Kulicke & Soffa Industries: Global semiconductor and LED packaging equipment maker, with growing exposure to advanced packaging, flip-chip bonding, and TCB. Overlaps directly with PacTech's flip-chip and wafer-level packaging equipment focus.
• ASMPT Limited: Hong Kong-listed supplier of semiconductor assembly and packaging materials and equipment, including flip-chip, TCB, and advanced packaging tools. Comparable to PacTech across the equipment portfolio and in serving global OSAT and foundry customers.
• Palomar Technologies: US-based specialist in precision microelectronic packaging and assembly equipment, including die and component bonding. Directly comparable to PacTech's laser-assisted bonding and wafer-level component assembly offerings for photonics, RF, and advanced packaging customers.
• SÜSS MicroTec: German-based manufacturer of equipment for semiconductor backend processes including advanced packaging, lithography, and bonding. Comparable to PacTech's German heritage, product portfolio in advanced packaging, and overlapping customer base of OSATs and foundries.
• BE Semiconductor Industries (Besi): Leading global supplier of die-attachment and advanced packaging equipment for flip-chip and WLP. Directly comparable to PacTech in serving semiconductor manufacturers with high-precision bonding, plating, and assembly tools targeting the same chiplet and 3D packaging end-markets.

Emerging players

• Hanmi Semiconductor: Korean equipment maker specializing in semiconductor packaging tools including sawing, sorting, and advanced bonding equipment. Comparable niche specialist profile to PacTech in serving HBM and advanced packaging customers.
• Toray Engineering Co., Ltd. Japanese supplier of semiconductor manufacturing and packaging equipment, including wafer-level and bonding solutions. Comparable to PacTech's equipment offerings, particularly in advanced packaging and laser-based processes, with similar Japanese corporate roots.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• YouTubeyoutube.com/@PacTechGmbH
• LinkedInlinkedin.com/company/pac-tech-asia-sdn.-bhd.
• Facebookfacebook.com/pactech.packagingtechnologies

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Subsidiaries3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Pac Tech - Packaging Technologies