HANA Micron

What HANA Micron does

HANA Micron (하나마이크론(주), KOSDAQ: 067310) is a South Korean publicly listed semiconductor backend processing company founded in 2001 and headquartered in Asan, South Chungcheong Province. The company provides full turnkey backend services — including bumping (with high-performance RDL), wafer-level packaging, flip chip, laminate, and lead frame packaging — alongside dedicated wafer, package, and module test services, plus engineering solutions covering design & simulation, reliability, failure analysis, verification, and software development. Its proprietary HIC™ 2.xD packaging platform combines bridge dies with copper pillar fusion to shorten data transmission paths in chiplet-based AI semiconductors and HBM/Wide I/O memory interfaces, and was recognized with the ECTC 2025 Excellent Paper Award at the IEEE EPS conference — an honor shared with only Samsung Electronics, TSMC, and Shinko Electric.

HANA Micron serves AI and high-performance computing semiconductor manufacturers, memory producers (HBM, DRAM) including SK Hynix as a strategic customer, and mobile/consumer electronics chip companies. It operates a four-country footprint: its Korea headquarters and main manufacturing site, a Bac Ninh (Vietnam) production facility, Austin (USA) sales and support office, and Brazilian operations through wholly-owned subsidiaries HT Micron and HANA Electronics, with additional HANA Group affiliates HANA Materials and HANA WLS providing materials and logistics integration. The GTM is direct enterprise field sales with engineering-led engagement targeting major semiconductor manufacturers and fabless companies; revenue is generated through long-term B2B contracts and per-wafer/per-unit testing fees.

Consolidated 2025 revenue is ₩15,344 billion (Korean Won, ~$1.1B equivalent) with approximately 4,000 employees globally. The company is led by CEO Lee Dong-cheol (이동철) and maintains an active investor relations program including NDRs and coverage by Meritz, Daishin, and SangSangIn securities. Revenue concentration toward HBM and AI-chip customers is a key watch item, as is the firm's positioning in Vietnam's emerging OSAT cluster alongside Intel and Amkor.

Name

HANA Micron

Legal name

하나마이크론(주)

Website

https://hanamicron.co.kr

Company type

Public

Founded year

2001

Operating status

Operating

Headcount range

501–1,000 employees

Short description

HANA Micron (하나마이크론, KOSDAQ: 067310) is a South Korean semiconductor backend OSAT providing bumping, flip chip, wafer-level packaging, and test services. It serves AI, HBM/memory, and mobile chip customers across Korea, Vietnam, Brazil, and the USA via its proprietary HIC™ 2.xD packaging platform.

Ownership category

akta.pro rank

Product category

Semiconductor Backend Packaging and Testing

NAICS

Semiconductor and Related Device Manufacturing (334413)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

akta.pro secondary industries

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC), System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI), Package Substrates & Interposers (ABF/BT, Silicon/Glass) (HDAHADAE)

Keywords

• Semiconductor packaging services
• Wafer level packaging
• Chip testing services
• Bumping solutions
• Backend semiconductor manufacturing

Headquarters

HQ city

Asan

HQ country

South Korea

HQ region

Asia

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Infrastructure, Supply Chain, Marketing or Sales

Revenue model

1. Semiconductor Assembly & Packaging Services: Backend semiconductor manufacturing services including bumping, wafer level packaging, flip chip, laminate, lead frame packaging. Revenue generated through long-term contracts with semiconductor manufacturers and fabless companies.
2. Test Services: Wafer test, package test, and module test services through dedicated test centers. Revenue from per-wafer/per-unit testing fees.
3. Engineering Solutions: Design & simulation, reliability testing, failure analysis, verification, and software development services for semiconductor companies

Go-to-market motion1 record

Distribution channels1 record

Marketing channels3 records

Core offering

HANA Micron provides semiconductor backend assembly and packaging services — including bumping, flip chip, laminate, lead frame, and wafer level packaging — together with wafer, package, and module testing through dedicated test centers, plus engineering services covering design, simulation, reliability, failure analysis, and verification. Its proprietary HIC™ 2.xD packaging platform targets AI semiconductors and HBM/Wide I/O memory interfaces, enabling chiplet integration with shortened data paths and improved power delivery efficiency. The company delivers these services to semiconductor manufacturers and fabless companies via manufacturing facilities in South Korea, Vietnam, Brazil, and a US sales office.

Product overview

HANA Micron is an innovative semiconductor solution provider offering a comprehensive full turnkey solution for semiconductor backend processing. The portfolio includes Bumping Solution (with high-performance RDL technology), Package services (Flip Chip, Laminate PKG, Lead Frame PKG, and Wafer Level), Test services (Wafer Test, Package Test, and Module Test with dedicated Test Platform and IT System), and Engineering Solution (Design & Simulation, Reliability, Failure Analysis, Verification, Software Development). The company has developed proprietary advanced packaging technology HIC™ for 2.xD packaging targeting AI semiconductor applications.

Differentiator

Problem solved

Functional benefit

Brands

• HIC™: Proprietary 2.xD packaging solution combining bridge dies and copper pillars for high-performance AI semiconductor packaging, optimized for high-speed memory interfaces including HBM and Wide I/O Memory

Products and services

• Full Turnkey Solution End-to-end semiconductor backend processing solution covering design through bumping, packaging, testing, and final delivery for semiconductor manufacturers and fabless companies.
• Bumping Solution Semiconductor bumping service featuring high-performance Redistribution Layer (RDL) technology for wafer-level interconnect applications.
• Package (Flip Chip, Laminate, Lead Frame, Wafer Level) Semiconductor packaging services spanning Flip Chip, Laminate PKG, Lead Frame PKG, and Wafer Level packaging technologies for memory, mobile/consumer SoC, and AI chip customers.
• Test Services (Wafer, Package, Module) Comprehensive semiconductor testing including Wafer Test, Package Test, and Module Test delivered through a dedicated Test Center with Test Platform, Test IT System, and process capabilities.
• Engineering Solution Engineering services covering Design & Simulation, Reliability testing, Failure Analysis, Verification, Software Development, and Future Solution development for semiconductor customers.
• HIC™ (2.xD Packaging Solution) Proprietary 2.xD advanced packaging platform combining bridge dies with copper pillars for high-performance AI semiconductor packaging, optimized for high-speed memory interfaces including HBM and Wide I/O Memory.

Quantifiable outcome

• Recognized at ECTC 2026 as one of only 4 companies worldwide (alongside Samsung Electronics, TSMC, Shinko Electric) to receive Excellent Paper Award for advanced packaging innovation

Named customers3 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature3 records

Partnerships

Five partnerships are on record, tiered core and major.

• HT MicroncoreOthersBrazilian semiconductor company subsidiary. Part of HANA Micron's global manufacturing network in South America.
• HANA ElectronicscoreOthersBrazilian subsidiary focused on electronics manufacturing as part of HANA Micron's South America operations.
• HANA MaterialscoreTechnology or IntegrationAffiliate company within HANA Group ecosystem, providing materials for semiconductor manufacturing processes.
• HANA WLScoreTechnology or IntegrationAffiliate company within HANA Group ecosystem, supporting semiconductor backend operations.
• Samsung ElectronicsmajorStrategic or Co-development PartnerCo-recipient of ECTC 2025 Excellent Paper Award. Both companies recognized for advanced semiconductor packaging innovations at IEEE conference.

Scale indicators5 records

Recent moves6 records

Expansion highlights5 records

Direct peers

• JCET Group: Leading Chinese-headquartered OSAT providing bumping, flip-chip, WLP, and advanced packaging. Competes with HANA Micron for global memory and logic packaging customers, particularly in mobile and high-performance computing.
• Powertech Technology (PTI): Taiwan-based OSAT specializing in DRAM and NAND memory packaging and test, plus advanced packaging services. Highly comparable to HANA Micron's memory (HBM/DRAM) packaging exposure and flip-chip/WLP offerings.
• ASE Technology Holding: Largest global OSAT offering bumping, flip-chip, WLP, and advanced packaging (TSV/2.5D) for memory, mobile, and AI semiconductor customers. Directly comparable in service breadth and customer set to HANA Micron's turnkey model.
• Amkor Technology: One of the world's largest OSAT providers with a full backend service portfolio (bumping, flip-chip, advanced packaging including TSV/2.5D SLIM). Co-located with HANA Micron in Vietnam, competing for the same AI/HBM packaging programs.
• King Yuan Electronics (KYEC): Taiwan-based pure-play semiconductor test house and OSAT, one of the largest third-party test providers. Directly comparable to HANA Micron's dedicated wafer/package/module test and turnkey backend services for memory and logic customers.
• Shinko Electric Industries: Japan-based OSAT and packaging materials supplier offering flip-chip, lead-frame, and advanced packaging (including 2.5D). Co-recipient of the ECTC 2025 Excellent Paper Award with HANA Micron, making it a direct technology peer.

Broad incumbents

• TSMC (Advanced Packaging): Dominant foundry with industry-leading 2.5D/3D advanced packaging platforms (CoWoS, InFO, SoIC). Sets the performance bar in chiplet and HBM packaging and competes with HANA Micron for the same AI/HBM customer engagements.
• Samsung Electronics (Foundry/Packaging): IDM and foundry with a leading captive advanced-packaging business (I-Cube, X-Cube, HBM stacking). Co-recipient of the ECTC 2025 award and a key competitor for HBM and AI accelerator packaging programs that HANA Micron targets with HIC™.

Regional players

• Nepes: Korean-headquartered OSAT offering bumping, WLP, and advanced packaging. Direct regional competitor to HANA Micron in Korea, competing for the same Korean memory and logic packaging customers.
• Signetics: South Korea-based OSAT focused on memory packaging and test, including advanced packaging for HBM. Closely comparable in geography, customer base (Korean memory makers), and packaging technology mix to HANA Micron.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/hana-micron-inc

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Subsidiaries4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments1 record

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about HANA Micron