What QP Technologies does

QP Technologies is a U.S.-based provider of microelectronic packaging and assembly services operating as a division of Promex Industries from a 20,000 sq ft AS9100D, ISO 9001:2015, ISO 13485:2016, and ITAR-registered facility in Escondido, California. Founded as Quik-Pak in 1992 and acquired by Promex in 2015, the company delivers integrated services spanning wafer preparation (backgrinding to 50μm, dicing up to 300mm wafers, SiC/GaN processing), IC assembly (wire bonding, flip chip with 1μm placement accuracy, encapsulation, marking), advanced packaging (SiP, MCM, stacked die, chiplets, SMT), substrate development, laser micromachining, and design-for-manufacturability engineering. Its proprietary OmPP (Open-molded Plastic Packages) and OCPP (Open Cavity Plastic Packages) technologies provide differentiated air-cavity QFN solutions validated to 40+GHz RF performance.

The company serves fabless semiconductor designers and device manufacturers across compound/power semiconductors, mil-aero, medical, automotive, industrial, and commercial segments, with particular emphasis on prototype through small-volume production runs requiring quick-turn turnaround (3 business days standard, expedited to 8 hours). Notable technical differentiators include ultra-thin wafer processing using DISCO Poligrind technology, Finetech Pico flip chip bonding at 1μm accuracy, and substrate development delivered 50% faster than competitors. The customer base is not publicly named, and revenue is project-based with quote-driven pricing.

QP Technologies' business model is a professional services-plus-products hybrid, generating revenue through fee-for-service packaging and assembly engagements, sale of proprietary OmPP and OCPP package products (sold standalone or bundled with assembly), and custom substrate design and fabrication. Go-to-market is direct B2B sales with engineering consultation, supported by technical content marketing, industry events (iMAPS, EuMW, AUSA, Space Tech Expo), and a customer portal for consigned inventory visibility. Recent strategic emphasis has been placed on mil-aero/defense qualification (AS9100D, Mil-PRF pursuit), compound semiconductor packaging for SiC/GaN power devices, and advanced packaging for AI/HPC chiplet architectures.

Name

QP Technologies

Legal name

QP Technologies

Website

https://qptechnologies.com

Company type

Private

Founded year

2015

Operating status

Operating

Headcount range

51–100 employees

Short description

QP Technologies is a U.S.-based microelectronic packaging and assembly services provider (division of Promex Industries) serving fabless semiconductor designers across mil-aero, automotive, medical, and compound semiconductor markets with proprietary OmPP/OCPP packages, wafer prep, and advanced chiplet packaging from its ITAR-registered Escondido, CA facility.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging and Assembly Services

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

akta.pro secondary industries

System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI), Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC)

Keywords

• Semiconductor packaging services
• IC assembly services
• Microelectronic packaging
• Wafer preparation services
• Advanced packaging solutions

Headquarters

HQ city

Escondido

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Technology or R&D, Supply Chain, Infrastructure, Marketing or Sales

Revenue model

1. Microelectronic Packaging and Assembly Services: QP Technologies generates revenue through providing semiconductor packaging and assembly services including wafer preparation, IC assembly, advanced packaging, substrate development, and engineering support. Services are offered as standalone or turnkey solutions. Revenue is project-based, with pricing determined by complexity, volume, and turnaround time requirements.
2. IC Package Products: Sale of proprietary IC packages including OmPP (Open-molded Plastic Packages) and OCPP (Open Cavity Plastic Packages), as well as standard QFN/DFN, ceramic, and custom configurations. Packages sold alongside assembly services or as standalone products.

Pricing tiers

Go-to-market motion1 record

Distribution channels1 record

Marketing channels5 records

Core offering

QP Technologies provides microelectronic packaging and assembly services including wafer preparation (backgrinding, dicing to 50μm, processing SiC/GaN up to 300mm), IC assembly (wire bonding, flip chip, encapsulation, marking), advanced packaging (flip chip, stacked die, SiP, MCM, chiplets, SMT), substrate design and fabrication, and laser micromachining. The company sells proprietary package products (OmPP and OCPP) and offers turnkey solutions from prototype through production volumes with standard 3-day turnaround and expedited 8-hour turnaround options.

Product overview

QP Technologies is a semiconductor packaging and assembly service provider offering a comprehensive portfolio of products and services for microelectronic packaging. The core product line includes OmPP (Open-molded Plastic Packages) and OCPP (Open Cavity Plastic Packages) as their proprietary package solutions, complemented by Overmolded QFN/DFN, Leaded Plastic Packages (SOIC, TSSOP, TQFP, MQFP), and Ceramic IC Packages. Services span the entire semiconductor packaging value chain: Wafer Preparation (backgrinding, dicing, thinning to 50µm, SiC/GaN processing up to 300mm), IC Assembly (wire bonding, flip chip, encapsulation, marking), and Advanced Assembly (COB/COF, MCM, SiP, stacked die, chiplets, SMT). Additional capabilities include Substrate Development (design, fabrication, custom substrates), Laser Micromachining, and Design & Engineering services. The company also provides a Customer Resource Center portal for inventory visibility. Prototype turn times as quick as 3 business days (expedited to 8 hours available).

Differentiator

Problem solved

Functional benefit

Brands

• OmPP (Open-molded Plastic Packages): Exclusive line of pre-molded, air-cavity QFN packages ideal for prototype, mid-volume, or production volume applications.
• OCPP (Open Cavity Plastic Packages)

Products and services

• OmPP (Open-molded Plastic Packages) Exclusive pre-molded, air-cavity QFN packages in sizes from 3x3mm to 12x12mm with multiple lead counts, RoHS and REACH compliant with gold-plated options, tested to RF frequencies of 40+GHz. Ideal for prototype, mid-volume, or production volume applications in semiconductor manufacturing.
• OCPP (Open Cavity Plastic Packages) Proprietary reconfigured plastic packages mechanically and electrically identical to future transfer molded production parts, ideal for new IC prototypes and design verification. RoHS compliant.
• Overmolded QFN/DFN Packages JEDEC-compliant plastic QFN packages with NiPdAu plated lead frames, available in standard and custom sizes from DFN 1.5x1.5 (6-lead) to QFN 12x12 (100-lead), RoHS compliant.
• Leaded Plastic Packages Various leaded package types including MSOP, PDIP, QSOP, SOIC, SSOP, TSSOP, TQFP, and MQFP packages for prototype to full production applications.
• Ceramic IC Packages Full turnkey ceramic package solutions with various lid options including taped-on, ceramic, combo, glass, and hermetically sealed configurations for high-reliability applications.
• Wafer Preparation Services Precision wafer processing including backgrinding to less than 100μm (down to 50μm), dicing of silicon, glass, ceramic, laminates, and compound semiconductors (SiC, GaN), supporting wafers up to 300mm. Uses DISCO precision dicing saws with Poligrind technology.
• IC Assembly Services Complete IC assembly spanning wafer preparation, flip chip bonding, wire bonding, encapsulation, IC marking/branding, and BGA sphere attach, with prototype turn times as quick as 3 business days (expedited to 8 hours).
• Advanced Assembly Services Complex assembly services including Chip-on-Board (COB), Chip-on-Flex (COF), Multi-Chip Modules (MCM), System-in-Package (SiP), stacked die, flip chip, chiplets, and surface mount technology (SMT).
• Chiplet Integration Services Modular chiplet architecture integration supporting heterogeneous die configurations, high-density interconnects, and advanced compute/AI applications with various substrate options including AI, HPC, RF, and mixed-signal configurations.
• Flip Chip Bonding Services Direct electrical connection via conductive bumps with Finetech Pico Flip Chip bonder capable of 1μm placement accuracy, supporting μBGA, standard flip-chip, 3D packaging, and optoelectronic bonding with placement down to 100μm pitch devices.
• Design & Engineering Services End-to-end engineering support including custom package design, substrate/interconnect design, design-for-manufacturability (DFM), and rapid prototyping for fabless companies and OEMs.
• Substrate Development Custom substrate design, fabrication and assembly services targeting ICs and MEMS with delivery times 50% faster than competitive services, supporting 5G RF packages, 2.5D/3D integration, flip chip, wirebond, SiP, interposers, RF devices, and MEMS.
• Laser Micromachining Precision laser processing using ESI 5220 ND:YAG laser system for drilling microvias (25μm diameter), cutting grooves/channels, scribing, stencil creation, and MEMS device processing on parts up to 21"x25"x0.75".
• Wire Bonding Automated wire bonding using K&S and Hesse equipment supporting Au ball bonding (18-50μm), Cu and Ag ball bonding, fine wire Al/Au wedge bonding, ribbon bonding, and heavy wire up to 508μm diameter.
• BGA Substrates Custom BGA, interposer, and laminate substrate development with full assembly services including die attachment, wire bond/flip chip interconnect, encapsulation, marking, and ball attach.

Quantifiable outcome

• 50% faster substrate development delivery than competitive services
• +3 more outcomes

Named customers1 record

Segments6 records

Ideal customer profiles5 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature6 records

Partnerships

One partnership is on record.

• AnySiliconminorGTM or Marketing Partner · 18 November 2021AnySilicon is a marketplace for semiconductor service providers. QP Technologies partnered with AnySilicon to gain access to online marketing services, increase exposure, and generate leads through the platform's ecosystem of semiconductor service buyers.

Scale indicators5 records

Recent moves7 records

Expansion highlights5 records

Broad incumbents

• Amkor Technology: One of the world's largest OSAT (Outsourced Semiconductor Assembly and Test) providers, offering advanced packaging including flip chip, fan-out WLP, SiP, and chiplet integration. Comparable to QP across the full packaging service stack, though at vastly greater scale and with a much broader geographic footprint.
• JCET Group: Leading Chinese OSAT offering a full range of semiconductor packaging and test services including advanced flip chip, fan-out, SiP, and 3D packaging. Comparable to QP across advanced packaging service categories but at substantially greater scale and primarily serving high-volume commercial customers.
• Mercury Systems: US-based mission-critical aerospace and defense electronics provider with significant in-house microelectronic packaging capabilities targeting mil-aero applications. Comparable to QP's defense/aerospace packaging focus, though Mercury is a vertically integrated defense prime rather than a pure-play packaging services provider.
• Hana Microelectronics: Thailand-based OSAT with IC assembly, packaging, and test services including advanced packaging for RF, power, and consumer applications. Overlaps with QP's packaging and assembly service categories but operates at higher volumes across multiple end markets.
• UTAC Holdings: Singapore-headquartered OSAT providing analog, mixed-signal, and advanced packaging services including wafer-level packaging and SiP. Comparable to QP across packaging formats but with a global manufacturing footprint focused on high-volume production.
• ASE Group (Advanced Semiconductor Engineering): Global #1 OSAT providing IC packaging, test, and substrate design including SiP, flip chip, and advanced packaging. Operates at a much larger scale than QP across similar service categories, with overlapping capabilities in advanced packaging, substrate, and chiplet integration.
• ChipMOS Technologies: Taiwan-based OSAT providing IC packaging and testing services including advanced packaging formats (BGA, flip chip, SiP) and substrate offerings. Comparable to QP's IC assembly service stack but operating at materially greater scale and higher volumes.
• Powertech Technology (PTI): Taiwan-based OSAT offering IC packaging, test, and substrate services including advanced packaging for memory, logic, and mixed-signal devices. Overlaps with QP's packaging and substrate service lines but operates at a significantly larger volume scale across consumer and mobile.

Direct peers

• Micross Components: US-based specialty provider of advanced microelectronic packaging and test services for mil-aero, space, medical, and industrial markets. Direct peer given overlapping ITAR-registered, MIL-STD-compliant packaging services and high-reliability focus comparable to QP's mil-aero positioning.

Emerging players

• SkyWater Technology: US-based semiconductor foundry offering advanced packaging, wafer services, and heterogeneous integration through its Florida facility. Overlaps with QP's advanced packaging and substrate development services, particularly for aerospace, defense, and biomedical customers, though SkyWater's primary identity is as a foundry.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/quik-pak
• Xx.com/QPTechnologies

Compliance8 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about QP Technologies