SET Corporation

Name

SET Corporation

Legal name

SET Corporation S.A.

Website

https://set-sas.fr

Company type

Private

Founded year

1975

Operating status

Operating

Headcount range

11–50 employees

Ownership category

akta.pro rank

Product category

Semiconductor Assembly Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Semiconductor and Other Electronic Component Manufacturing (3344)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industry

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Flip-chip bonders
• Nanoimprint lithography
• Semiconductor assembly equipment
• Hybrid bonding systems
• Precision die bonding

Headquarters

HQ city

Saint Jeoire

HQ country

France

HQ region

Europe

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Infrastructure, Marketing or Sales

Revenue model

1. Semiconductor Equipment Sales: SET designs, manufactures, and sells high-accuracy flip-chip bonders and nanoimprint lithography equipment to semiconductor laboratories and companies worldwide. Equipment ranges from manual-loading to fully-automated solutions covering a wide range of bonding applications.

Go-to-market motion1 record

Distribution channels4 records

Marketing channels6 records

Core offering

SET Corporation designs, manufactures, and sells high-accuracy Flip-Chip Bonders and Nanoimprint Lithography (NIL) equipment for semiconductor assembly. The product portfolio ranges from manual-loading bonders to fully-automated production solutions, supporting wafer diameters up to 300mm and components from 150µm to 100mm. Equipment serves applications including 3D integration, image sensors, optoelectronics, MEMS packaging, laser bars, and photonics packaging, with bonding capabilities spanning fluxless reflow, thermo-compression, thermosonic, adhesive joining, and direct metallic/hybrid bonding.

Product overview

SET Corporation is a world-leading supplier of high-accuracy Flip-Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions for semiconductor assembly. The product portfolio centers on the Flip-Chip Bonder line, ranging from manual-loading (ACCµRA M) to fully-automated solutions (NEO series), covering bonding applications from 0.2mm to 100mm components onto substrates up to 300mm. The ACCµRA family (M, OPTO, 100, Plus) targets different precision levels and application types. The NEO series (HB, W) represents the latest generation for high-volume production with hybrid bonding capabilities. Supporting equipment includes the NPS300 nanoimprint lithography tool, LDP150 high precision press, and atmospheric plasma systems. SET's equipment supports all major bonding technologies: fluxless reflow, thermo-compression, adhesive joining, thermosonic, and hybrid bonding.

Differentiator

Problem solved

Functional benefit

Products and services

• ACCµRA M Manual flip-chip bonder with simple operation, popular in research centers and universities, allowing manual alignment and assembly of components with 3 micron accuracy.
• ACCµRA OPTO Flip-chip bonder designed for optoelectronics applications, providing high precision alignment for optical component assembly.
• ACCµRA100 High-accuracy flip-chip bonder with high placement accuracy, high bonding force, and high process temperature enabling silver sintering of power semiconductors onto substrates.
• ACCµRA Plus High-accuracy flip-chip bonder providing the highest precision in the ACCµRA family for advanced applications.
• FC150 PLATINUM Flip-chip bonder for advanced R&D with accuracy of ±0.5 µm before welding and ±1 µm after welding, supporting various welding techniques including reflow, thermocompression, bonding, and fusion welding.
• FC300 High force device bonder (4,000N) for wafer diameters up to 300mm with optional built-in chamber for collective reflow in gas or vacuum environment, featuring nanoimprinting capabilities.
• NEO HB Fully automated flip-chip bonder designed for high-volume production, achieving +/- 1 micron post-bonding accuracy (3 sigma) for hybrid or direct bonding processes. First product in new NEO flip-chip bonder series.
• NEO W Flip-chip bonder in the NEO series for production applications.
• NPS300 Nanoimprinting stepper developed in collaboration with VTT Microelectronics as part of the NaPa European Project for UV-NIL processes.
• LDP150 High precision press for applications requiring precise bonding force and temperature control.
• Ontos TT / OntosIS

Quantifiable outcome

• 300+ Device Bonders installed worldwide in cleanrooms
• +4 more outcomes

Named customers8 records

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

Ten partnerships are on record, tiered core and minor.

• SUSS MicroTeccoreStrategic or Co-development Partner · 1 September 2021Joint Development Agreement (JDA) to develop a combined equipment solution for 3D chip integration. SUSS MicroTec's surface preparation and metrology modules are combined with SET's NEO HB ultra-high precision D2W hybrid bonding platform to provide fully automated, configurable, high-throughput equipment for advanced multi-chip 3D applications including stacked memories and chip integration.
• Taipro EngineeringminorChannel Partner/ Reseller/ Distributor · 19 August 2020New flip-chip bonding demo center for Benelux region established at Taipro Engineering's facility in Liege, Belgium. An ACCuRA M demo machine was installed in Taipro's cleanroom to provide testing and flip-chip bonding services for Benelux customers. Taipro handles customer assembly as tests or mini-production runs.
• Taipro EngineeringminorChannel Partner/ Reseller/ Distributor · 24 July 2020SET partnered with Taipro Engineering (Liegois microelectronics company) to provide flip-chip bonding demonstration, testing, and services for Benelux customers. Taipro installed an ACCuRA M in its cleanroom for this purpose.
• IRT (Institute of Technology)minorStrategic or Co-development Partner · 1 November 2017SET is a partner of IRT (French Institute of Technology), specifically the Nanoelec pilot led by CEA-Leti in Grenoble since end of 2015. SET participated in the annual Forum of the IRT in Paris to present the benefits of such collaboration for SMEs.
• IRT NanoeleccoreStrategic or Co-development Partner · 1 January 2016SET joined the French IRT Nanoelec consortium (pilot by CEA-Leti in Grenoble) as a partner in January 2016. The consortium focuses on advanced semiconductor research and development. Within this framework, SET worked with CEA-Leti to advance hybrid bonding technology from laboratory level to industrial readiness.
• MinalogicminorStrategic or Co-development Partner · 1 June 2013SET joined Minalogic, the global competitive cluster specialized in micro and nanotechnologies and embedded intelligence, in June 2013. Through Minalogic, SET participated in the PROCEED project alongside CEA-Leti, STMicroelectronics, ALES, and CNRS-CEMES for advanced chip-to-wafer technologies.
• SEMATECHcoreStrategic or Co-development Partner · 1 September 2010SET received a strategic order from SEMATECH for its FC300 high accuracy/high force Device Bonder for the 3D R&D Center at CNSE Albany NanoTech Complex. The equipment explores die-to-wafer bonding applications including Cu-Cu bonding for 3D-ICs integration.
• IMECcoreStrategic or Co-development Partner · 13 January 2009SET joined IMEC's Industrial Affiliation Program (IIAP) on 3D integration in 2009. The collaboration uses SET's FC300 for developing highly-accurate pick-and-place and low-temperature bonding processes required for advanced 3D integration schemes. IMEC is one of Europe's leading independent nanoelectronics research institutes.
• CEA-LeticoreStrategic or Co-development Partner · 13 November 2007Long-standing strategic partnership since 1981 (when the first commercially available flip-chip bonder was jointly developed). CEA-Leti and SET collaborated on the FC300 development with nanoimprint capabilities. The partnership has advanced chip-to-wafer direct metallic bonding technology, vacuum hybridization, and hybrid bonding. CEA-Leti uses SET equipment extensively in its cleanrooms for 3D integration research.
• VTT MicroelectronicsminorStrategic or Co-development Partner · 1 January 2005Collaboration with VTT Microelectronics as part of the NaPa European Project to develop the NPS300 Nanoimprinting Stepper, launched in 2005.

Scale indicators4 records

Recent moves9 records

Expansion highlights6 records

Broad incumbents

• ASMPT (ASM Pacific Technology): ASMPT is one of the largest global suppliers of semiconductor and SMT assembly equipment, including die bonders for advanced packaging. ASMPT competes with SET in flip-chip and hybrid bonding, particularly for high-volume production.
• Panasonic Smart Factory Solutions: Panasonic provides flip-chip bonders and semiconductor assembly equipment as part of its smart factory portfolio. SET competes with Panasonic in die bonding, particularly for high-precision automotive and consumer applications.
• Kulicke & Soffa Industries: K&S is a major incumbent in semiconductor and LED assembly equipment, with a broad portfolio spanning wire bonders, die bonders, and advanced packaging tools. SET's precision flip-chip bonders compete with K&S offerings in advanced packaging applications.

Regional players

• Toray Engineering: Toray Engineering is a Japanese supplier of semiconductor manufacturing equipment, including flip-chip bonders and advanced packaging tools. Toray competes with SET primarily in the Japanese and broader Asian market for precision die bonding.

Direct peers

• MRSI (Mycronic Group): MRSI is a leading supplier of high-precision die bonding equipment for photonics, RF, and advanced semiconductor packaging. SET and MRSI compete in high-accuracy bonding for photonics packaging and optoelectronics assembly.
• SUSS MicroTec: SUSS MicroTec is a leading supplier of equipment for semiconductor advanced packaging, including lithography and wafer-level processing. SET has a joint development partnership with SUSS for hybrid bonding, but the companies also compete in adjacent equipment categories.
• BE Semiconductor Industries (BESI): BESI is the global market leader in die bonding and flip-chip packaging equipment, with particular strength in hybrid bonding for advanced packaging. SET competes with BESI in high-accuracy flip-chip bonding for 3D integration, image sensors, and advanced semiconductor packaging.
• EV Group (EVG): EVG is a leading supplier of wafer-level bonding, nanoimprint lithography, and advanced packaging equipment. SET's NPS300 nanoimprint stepper overlaps with EVG's NIL offerings, and both companies serve 3D integration and advanced semiconductor packaging markets.
• Finetech: Finetech specializes in high-accuracy die bonders and flip-chip bonders for R&D and low-volume production, very similar to SET's ACCµRA family. Both companies serve research institutes and niche advanced packaging applications.

Emerging players

• Amicra: Amicra is a German specialist in sub-micron die bonding equipment, with a similar focus on optoelectronics, photonics, and advanced semiconductor packaging. Amicra competes with SET in high-accuracy R&D and low-volume production bonding.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat6 records

Key risks5 records

Key highlights7 records

Customer concentration

• LinkedInlinkedin.com/company/set-corporation

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about SET Corporation