What Boschman Technologies does

Boschman Technologies is a Netherlands-based, privately held company founded in 1987 and headquartered in Duiven. Per available sources, the company specializes in the development and supply of advanced transfer molding and sintering systems for the electronics industry, with a specific focus on critical materials for power module packaging and wide-bandgap (WBG) semiconductor technology. Its core offering is positioned within the power module packaging materials ecosystem that supports next-generation power electronics.

The company addresses supply chain risks and technology transitions in critical materials for semiconductor packaging, serving primarily the energy sector and secondarily the transportation sector, where its systems are used in applications including EV power electronics. Its core technology centers on the materials and process equipment used in advanced packaging of WBG devices, an area of growing strategic importance as electrification, renewable power conversion, and EV adoption accelerate demand for high-efficiency power modules.

The company is founder-led — Frank Boschman serves as Founder, CEO, and Managing Director. It received funding from Holland Capital in a 2017 round and is referenced in industry coverage spanning more than 130 companies in the power module packaging value chain. With a headcount reported at 1-10, the firm appears to operate as a specialized boutique supplier. Revenue figures, pricing models, and detailed product specifications are not publicly disclosed in available sources, and the company website (boschman.nl) was inaccessible at the time of data collection, which limits further granularity on the current product portfolio and operating status.

Name

Boschman Technologies

Website

https://boschman.nl

Company type

Private

Founded year

1987

Headcount range

1–10 employees

Short description

Boschman Technologies is a Netherlands-based, founder-led firm specializing in advanced transfer molding and sintering systems for power module packaging, with a focus on wide-bandgap semiconductor materials for the energy and transportation sectors.

Ownership category

akta.pro rank

Headquarters

HQ city

Duiven

HQ country

Netherlands

HQ region

Europe

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Supply Chain, Operations, Marketing or Sales, Infrastructure

Core offering

Boschman Technologies develops and supplies advanced transfer molding and sintering systems used in the packaging of electronic power modules. The company specializes in equipment and critical materials for power module packaging with a focus on wide-bandgap semiconductor technology. Its systems serve the energy and transportation sectors that are adopting wide-bandgap semiconductors for power electronics applications.

Differentiator

Problem solved

Functional benefit

Products and services

• Transfer Molding Systems
• Sintering Systems

Segments2 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Partnerships

One partnership is on record.

• Mindgrove TechnologiesminorStrategic or Co-development PartnerMindgrove Technologies, an Indian semiconductor startup, has formed a partnership with Bosch. This partnership is part of India's expanding semiconductor ecosystem driven by government support, private investment, and international collaborations. Mindgrove Technologies is noted as one of the notable startups in India's chip design ecosystem.

Scale indicators1 record

Recent moves2 records

Expansion highlights2 records

Broad incumbents

• DISCO Corporation:
• ASMPT (ASM Pacific Technology): ASMPT is the global leader in semiconductor packaging equipment, including molding solutions for IC and power module assembly. It competes head-to-head with Boschman in transfer molding for advanced packaging, with far greater scale.
• Kulicke & Soffa Industries: K&S is a long-established supplier of semiconductor and LED packaging equipment, including die-bonding and advanced packaging tools relevant to power module assembly customers served by Boschman.
• BE Semiconductor Industries (Besi): Besi supplies die-bonding, packaging, and assembly equipment for the semiconductor industry, including solutions targeting advanced and power packaging — overlapping with Boschman's customer base.
• SÜSS MicroTec: SÜSS MicroTec produces equipment for advanced semiconductor packaging, including lithography, bonding, and coating systems used in power and compound-semiconductor device manufacturing — an adjacent incumbent.

Emerging players

• Toray Engineering: Toray Engineering supplies production equipment for power semiconductor and electronic component manufacturing, including mounting and packaging tools relevant to Boschman's niche.
• Mycronic (MRSI): Mycronic's MRSI unit makes die-bonding and assembly systems for photonic, power, and advanced packaging — adjacent to Boschman's transfer-molding focus and sharing similar customers.
• Hesse Mechatronics: Hesse Mechatronics supplies precision bonding equipment for power electronics and advanced packaging, addressing overlapping customers in automotive and energy power-module assembly.

Direct peers

• Fico Molding Solutions: Fico is a direct specialist in transfer molding and trim-and-form systems for the semiconductor and power-electronics industry, making it a close functional peer of Boschman.
• TOWA Corporation: TOWA is a Japanese specialist in transfer molding and compression molding equipment for semiconductor packaging, including power devices. It is the most direct competitor to Boschman in transfer molding systems for electronics.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat2 records

Key highlights5 records

Customer concentration

• LinkedInlinkedin.com/company/boschman-technologies-b-v-

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Boschman Technologies