CoVi Technologies

What CoVi Technologies does

CoVi Technologies, operating as CVInc, is a privately held US semiconductor packaging and assembly services company headquartered in Richardson, Texas (601 N Glenville, Suite 105), founded in June 2001. The company specializes in quick-turn, prototype and small-volume microelectronics packaging, serving customers in RF, RFID, optical, and high-density device applications through die bumping, wafer bumping, custom QFN packaging, PCB and substrate layout, and full assembly services.

Its core technical capabilities span advanced die and wafer bumping (solder bumps as small as 25um at 35um pitch, copper pillars at 20um diameter and 25um pitch, thermosonic/ultrasonic bumping), Through Glass Vias with up to 40:1 aspect ratio at 30um diameter, patent pending Coil in Package integrated QFN technology, and HD-QFN high-density packaging with 52/84/104 pin configurations. Assembly capabilities include less than 5um placement accuracy, wafer thinning to 100um, and handling of single die down to 0.25um, with substrate design and fabrication across organic and glass materials. Differentiating process specifications include expedited bump builds completed in 4-6 working days.

CVInc operates a direct sales-led go-to-market model with no distribution partners, resellers, or marketplace channels, reaching customers via phone (469-368-7475) and email ([email protected], [email protected]). Pricing is quote-based with no publicly disclosed tiers, and revenue is generated primarily through one-time project engagements for prototype and small-volume builds plus professional services for assembly work. The company holds ITAR compliance certification enabling US defense and aerospace customer engagement, and maintains industry memberships in IMAPS and SMTA.

Name

CoVi Technologies

Legal name

CVInc

Website

https://covinc.com

Company type

Private

Founded year

2001

Operating status

Operating

Headcount range

51–100 employees

Short description

CVInc is a US-based semiconductor packaging and assembly services company in Richardson, Texas, providing quick-turn die bumping, wafer bumping, custom QFN packaging, TGV, and small-form-factor assembly primarily for prototype and development-phase customers in RF, RFID, and high-density device applications.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Services

NAICS

Other Electronic Component Manufacturing (334419), Semiconductor and Other Electronic Component Manufacturing (3344), Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Bare Printed Circuit Board Manufacturing (334412)

SIC

Electronic Components, Nec (3679), Printed Circuit Boards (3672)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

Keywords

• Semiconductor packaging services
• Die bumping services
• Wafer bumping services
• QFN packaging
• Semiconductor assembly services

Headquarters

HQ city

Austin

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Technology or R&D, Marketing or Sales

Revenue model

1. Die and Wafer Bumping Services: Bumping services for single die, partial wafers, and complete wafers. Includes UBM application, solder and reflow. Supports leaded and lead free alloys.
2. Packaging Products and Services: Custom and off-the-shelf overmolded and open cavity QFN packages, including HD-QFN, TQ-CFN, and MOD/SOP/SON packages. Various sizes from 2x2 to 10x10.
3. Assembly Services: Assembly services for small form factor boards and modules including PCB, RDL and substrate design, fabrication, wafer thinning, singulation, and die/component placement.
4. PCB and Repair Kits: PCB design, layout, modification, repair kits available in various shapes, sizes and geometries. Optional finishes include Cu, NiAu, NiPdAu and Au.
5. Dummy Die Products: Wide variety of dummy die in bond pad and bumped footprints. Custom builds optional. Available NRE wafers and die for development, qualification and die builds.

Go-to-market motion1 record

Distribution channels1 record

Marketing channels2 records

Core offering

CoVi Technologies (CVI) provides quick turn, high quality semiconductor packaging and assembly services targeting prototype and small-volume customers. Core offerings include die bumping, wafer bumping with RDL, overmolded QFN and open cavity packaging, precision assembly for small form factor boards and modules, PCB/repair kits, dummy die, and proprietary technologies such as Through Glass Vias (TGV) and integrated coiled QFN packages. All work is completed in the US under ITAR compliance.

Product overview

CoVi Technologies (CVI) provides quick turn, high quality semiconductor packaging and assembly services. The company's core offering is a portfolio of specialized services including die bumping (single die and partial wafers), wafer bumping with RDL and ENIG pillars, packaging (overmolded QFN, open cavity, and custom modules), assembly services for small form factor boards and modules, PCB/repair kits, and dummy die products. Key differentiating technologies include Through Glass Vias (TGV) with up to 40:1 aspect ratio, patent pending integrated coiled QFN packages, and IIIVto75/IIIV-75 compound semiconductor products. All services are designed for prototype and development phases where quick turnaround is essential.

Differentiator

Problem solved

Functional benefit

Products and services

• Die Bumping Single die and partial wafer bumping services supporting standard solder bumping, modified solder bumping with gold stud bumps, and thermosonic/ultrasonic bumping. Offers solder bumps as small as 25um with 35um pitch and copper pillars at 20um diameter with 25um pitch. For semiconductor companies requiring bump die and assembly services.
• Wafer Bumping with RDL Complete quick turn wafer bumping with redistribution layer (RDL) and ENIG pillars for development, qualification, sampling and prototype builds. Supports wafer materials including Si, GaAs, Pyrex, and Alumina up to 8 inches. Expedited bump builds can be completed in 4-6 working days.
• Packaging (QFN and Custom Modules) Custom and off-the-shelf overmolded and open cavity packages including QFN (2x2 to 9x9), TQ-CFN custom packages, HD-QFN high density packages (52, 84, 104 pin options), and MOD/SOP/SON custom designs (7x7 to 10x10). Features patent pending integrated coil in package technology.
• Assembly Services Assembly services for small form factor boards and modules including board layout (PCB, RDL and substrate design), inorganic and organic substrate fabrication, wafer thinning down to 100um, singulation, and pick and place with less than 5um accuracy.
• PCB and Repair Kits PCB and substrate layout services including full design, layout from schematic capture, modification of existing PCBs, and subcontract manufacturing. Repair kits available in various shapes, sizes and geometries with optional finishes including Cu, NiAu, NiPdAu and Au.
• Dummy Die Products Wide variety of dummy die in bond pad and bumped footprints with NRE wafers and die for development, qualification and die builds. Die have footprints in silicon, alumina, Pyrex and glass (borosilicate and high lead) with connection technologies including aluminum/copper pads, gold ball bumps, solder bumps, copper pillars, and ENIG/ENIPIG pillars.
• Through Glass Vias (TGV) Through glass vias and filled vias with aspect ratios up to 40:1. Supports 30um diameter, 50um pitch, and 480um tall configurations for advanced semiconductor packaging applications.
• IIIVto75 and IIIV-75 Compound Semiconductor Products Compound semiconductor products (InGaAs or similar III-V materials) for specialized applications requiring III-V semiconductor materials.

Quantifiable outcome

• Expedited bump builds completed in 4-6 working days
• +4 more outcomes

Segments3 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Two partnerships are on record, tiered minor.

• IMAPSminorOthersIndustry membership organization for microelectronics packaging and assembly. Member organization providing networking, professional development, and industry standards participation.
• SMTAminorOthersSurface Mount Technology Association - professional organization for electronics assembly and manufacturing. Membership provides networking and knowledge sharing opportunities.

Scale indicators2 records

Recent moves5 records

Expansion highlights4 records

Direct peers

• Amkor Technology: Largest US-headquartered OSAT offering die bumping, wafer bumping, QFN packaging, and advanced packaging services. Most directly comparable competitor across CVI's full service portfolio, though at vastly larger scale.
• ASE Technology Holding: Global OSAT leader providing bumping, wafer-level packaging, QFN, and assembly services. Competes head-to-head with CVI in advanced packaging, including in defense-adjacent and RF segments.
• JCET Group: China-based OSAT offering bumping, QFN packaging, and advanced assembly. Comparable service portfolio with scale advantages, particularly in consumer and communications packaging.
• Powertech Technology: Taiwanese OSAT providing bumping, wafer-level packaging, and QFN assembly. Directly comparable to CVI's prototype and small-volume bumping/packaging capabilities.
• ChipMOS Technologies: OSAT providing bumping, gold bumping, and QFN packaging for mixed semiconductor and memory end markets. Overlaps with CVI's bumping and packaging service lines.
• STATS ChipPAC: Advanced packaging OSAT (now part of ASE) with strong fan-out wafer-level packaging and bumping capabilities. Comparable to CVI for prototype advanced packaging engagements.
• Unimicron Technology: Major PCB and IC substrate manufacturer producing substrate-like carriers used in advanced packaging. Comparable to CVI's PCB/substrate design and fabrication capabilities at much larger scale.
• Shinko Electric Industries: Japanese substrate and packaging manufacturer specializing in flip-chip BGA substrates and leadframe packaging. Comparable for high-density packaging substrates overlapping with CVI's HD-QFN work.
• TTM Technologies: US-based PCB manufacturer with aerospace and defense focus, including RF and quick-turn PCB fabrication. Comparable to CVI's PCB design, layout, and repair kit services, particularly for ITAR-compliant defense customers.
• Ibiden: Japanese manufacturer of IC substrates and packaging materials, including advanced flip-chip substrates. Comparable substrate and advanced packaging technology stack to CVI's HD packaging offerings.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat3 records

Key risks6 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/covi-technologies-inc

Compliance1 record

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds3 records

Investors5 records

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about CoVi Technologies