Unisem

Name

Unisem

Legal name

Unisem (M) Berhad

Website

https://unisemgroup.com

Company type

Public

Founded year

1989

Operating status

Operating

Headcount range

501–1,000 employees

Ownership category

akta.pro rank

Product category

Semiconductor Assembly and Test Services (OSAT)

NAICS

Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Services-Testing Laboratories (8734), Special Industry Machinery, Nec (3559)

akta.pro primary industry

Outsourced Semiconductor Manufacturing Services (Back-End EMS/Turnkey) (HDAHADAJ)

akta.pro secondary industries

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA), Test Services (Wafer Sort, Final Test, Burn-In) (HDAHADAD), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• Semiconductor assembly services
• Semiconductor test services
• Wafer bumping services
• IC packaging solutions
• MEMS packaging services

Headquarters

HQ city

Santa Clara

HQ country

United States

HQ region

North America

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Infrastructure, Technology or R&D, Supply Chain, Marketing or Sales

Revenue model

1. Semiconductor Assembly Services: Turnkey assembly services for leadless, laminate, leadframe and wafer level packages including package development, assembly, and drop shipping of finished goods.
2. Semiconductor Testing Services: Full range of package testing services including analog, digital and mixed signal testing with over 100 test systems.
3. Wafer Bumping Services: Wafer bumping services through subsidiary Unisem Advanced Technologies (UAT) offering gold, copper pillar and solder bumping options.

Go-to-market motion2 records

Distribution channels1 record

Marketing channels4 records

Core offering

Unisem is a global outsourced semiconductor assembly and test (OSAT) provider offering full turnkey packaging and test services. It manufactures and packages integrated circuits for fabless and IDM customers across multiple package families (leadframe, laminate, leadless, MEMS, and wafer-level), complemented by wafer bumping, wafer probing, final test, reliability/failure analysis, warehousing, and drop shipment to OEMs.

Product overview

Unisem is a global provider of semiconductor assembly and test services offering an integrated suite of packaging and test solutions. The product portfolio consists of multiple package types including Leadframe Packages (PDIP, QSOP, SOIC, SSOP, TSOT, TSSOP with 3-484+ pins), Laminate Packages (FBGA/LGA, MCM/SIP, Stacked Die BGA), Leadless Packages (SLP, SLP SIP, Stacked Die SLP, MIS QFN), MEMs Packaging (LGA-FLP, LGA-MCP, LGA-MLP), and Wafer Level Chip Scale Packaging (WLCSP). These are complemented by comprehensive turnkey services including wafer bumping, wafer probing, wafer grinding, assembly, test, reliability testing, failure analysis, and drop shipment capabilities. Unisem operates manufacturing facilities in Ipoh, Malaysia and Chengdu, China, with over 1.5 million square feet of factory floor space and more than 540,000 square feet of clean rooms.

Differentiator

Problem solved

Functional benefit

Products and services

• Leadframe Packages

Quantifiable outcome

• 1 billion packaged MEMS devices shipped by July 2016

Named customers11 records

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Seven partnerships are on record, tiered core.

• Malaysia Advanced Packaging Consortium (MAPC)coreStrategic or Co-development Partner · 15 June 2026Five local companies including Unisem forming the Malaysia Advanced Packaging Consortium to upgrade Malaysia's semiconductor industry into higher-value advanced packaging activities. The initiative has government-approved R&D grant of RM92 million over 24 months with industry contributing RM93 million, totaling RM185 million investment. Targets advanced testing, precision automation, photonics integration, and chiplet design support capabilities.
• InaricoreStrategic or Co-development PartnerCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem, MPI, and other Malaysian semiconductor companies targeting advanced packaging capabilities
• MPIcoreStrategic or Co-development PartnerCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem and other Malaysian semiconductor companies targeting advanced packaging capabilities
• Skyechip BhdcoreStrategic or Co-development PartnerCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) targeting chip design operations expansion with planned RM352 million IPO
• FusionAPcoreStrategic or Co-development PartnerCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem and other Malaysian semiconductor companies
• PentamastercoreStrategic or Co-development PartnerCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem and other Malaysian semiconductor companies
• NSW AutomationcoreStrategic or Co-development PartnerCo-beneficiary of Malaysia Advanced Packaging Consortium (MAPC) alongside Unisem and other Malaysian semiconductor companies

Scale indicators11 records

Recent moves9 records

Expansion highlights4 records

Broad incumbents

• ASE Technology Holding: Largest global OSAT with end-to-end assembly, test, and advanced packaging (fan-out, 2.5D/3D, SiP). Comparable to Unisem as the global benchmark OSAT; Unisem operates in the same broad back-end services category but at smaller scale and without ASE's leading-edge advanced-pack leadership.
• Amkor Technology: US-headquartered OSAT and key competitor across test, flip-chip BGA, advanced packaging, and SiP. Amkor's TSMC Arizona adjacency strategy mirrors what Unisem hopes to capture via MAPC; both serve fabless/IDM customers on outsourced back-end workflows.

Direct peers

• Tianshui Huatian Technology: China's largest OSAT and a strategic shareholder of Unisem via Huatian (Malaysia/Hong Kong) entities. Operates the same back-end assembly and test service portfolio as Unisem and provides the technology pipeline underpinning Unisem's advanced-packaging expansion.
• JCET Group: Chinese OSAT offering turnkey assembly and test across leadframe, laminate, WLCSP, and fan-out packaging. Closest direct competitor to Unisem among mainland-China OSATs and competes with Unisem in Chengdu-adjacent customer accounts.
• UTAC Holdings: Singapore-headquartered OSAT offering analog, mixed-signal, RF, and power semiconductor test and assembly services. Comparable product breadth and serves many of the same automotive and industrial customers as Unisem.
• Powertech Technology: Taiwan-listed OSAT providing memory and logic packaging/test services, including bumping and wafer-level packaging. Overlaps with Unisem in leadframe/laminate BGA test services for fabless customers and competes for the same advanced-packaging roadmap.
• Inari Amertron: Malaysian OSAT co-beneficiary of MAPC alongside Unisem. Operates turnkey assembly and test services for RF/wireless semiconductors with the same Penang-based operating footprint, making it the most directly comparable domestic peer.
• ChipMOS Technologies: Taiwanese OSAT focused on test, assembly, and packaging for memory, display drivers, and mixed-signal semiconductors. Direct competitor in laminate/leadframe test services with overlapping customer base among Asian fabless companies.
• Malaysian Pacific Industries (MPI): Malaysian OSAT serving test, assembly, and packaging for automotive, industrial, and consumer semis. Another MAPC co-beneficiary and the closest regional peer in the Ipoh/Penang corridor.

Others

• Cohu: US-headquartered semiconductor test handler and contactor supplier serving OSAT customers including Unisem. Not a direct competitor but an ecosystem peer — Unisem uses comparable test platforms (and just hosted the first locally assembled AccoTEST tester in Penang).

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks6 records

Key highlights7 records

Customer concentration

• Xx.com/unisemgroup
• Facebookfacebook.com/unisem.group

Revenue estimate

Valuation estimate

Number of profiles

Profiles10 records

Subsidiaries3 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Unisem