FusionAP
FusionAP is a Malaysia-based advanced semiconductor packaging OSAT founded in 2025, offering 2.5D/3D heterogeneous integration, wafer bumping, substrate design, and assembly & test services to fabless companies, foundries, and memory manufacturers globally, leveraging geopolitical neutrality and Intel/TSMC-veteran leadership.
- Company typePrivate
- Founded2025
- HeadquartersPenang, Malaysia
- Headcount1–10
- GTM typeB2B
- OfferingServices
What FusionAP does
FusionAP Sdn. Bhd. is a Malaysia-based advanced semiconductor packaging OSAT (outsourced semiconductor assembly and test) provider founded in 2025 in Penang. The company markets itself as Malaysia's first domestic advanced packaging house and offers a horizontal service portfolio spanning engineering services, prototyping and engineering samples, advanced substrate design and simulation, wafer bumping, 2.5D and 3D heterogeneous integration, and assembly and test — covering the full path from prototype to high-volume manufacturing for chiplet architectures, high-bandwidth memory, and beyond-Moore packaging technologies.
The underlying technology platform is built around 2.5D and 3D heterogeneous integration, including chiplet-based architectures, high-bandwidth interconnects, TSV and C4 bumping, and system-level substrate optimization. Leadership is drawn heavily from Intel's advanced packaging organization (including the Foveros and EMIB 3D packaging programs) and from TSMC, Micron, AT&S, and ams OSRAM, providing direct process expertise in PVD, CVD, epitaxy, dry etch, ALD, CMP, and 3DIC test. Geopolitical neutrality in Malaysia is positioned as a core structural advantage for US and European chipmakers seeking to diversify away from Taiwan- and China-concentrated supply chains.
The business model is a direct enterprise sales motion selling service contracts (engineering, prototyping, assembly, and test) to fabless semiconductor companies, foundries, design houses, and memory manufacturers globally across Asia, the United States, and Europe. Pricing is quote-based and tied to packaging complexity and volume; no standard price list is disclosed. The company is venture-backed (US$2M pre-seed from Vertex Ventures SEA & India and Southern Capital Group in May 2026) and embedded in the Malaysia Advanced Packaging Consortium (MAPC), a national initiative targeting 7% of the global advanced packaging market by 2035 and supported by RM185.8M in combined government and industry funding. The planned facility buildout contemplates an RM400M pilot line progressing to RM2B for high-volume manufacturing.
FusionAP firmographics
Firmographics- Name
- FusionAP
- Legal name
- FusionAP Sdn. Bhd.
- Website
- https://fusionap.com
- Company type
- Private
- Founded year
- 2025
- Operating status
- Operating
- Headcount range
- 1–10 employees
- Short description
- FusionAP is a Malaysia-based advanced semiconductor packaging OSAT founded in 2025, offering 2.5D/3D heterogeneous integration, wafer bumping, substrate design, and assembly & test services to fabless companies, foundries, and memory manufacturers globally, leveraging geopolitical neutrality and Intel/TSMC-veteran leadership.
- Ownership category
- akta.pro rank
FusionAP industry classification
Industry- Product category
- Semiconductor Packaging Services
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (33441)
- SIC
- Semiconductors & Related Devices (3674)
- akta.pro primary industry
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)
- akta.pro secondary industries
- Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC), Test Services (Wafer Sort, Final Test, Burn-In) (HDAHADAD), System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI)
Keywords
Where FusionAP is headquartered
LocationHeadquarters
- HQ city
- Penang
- HQ country
- Malaysia
- HQ region
- Asia
Offices1 record
Markets served
FusionAP business model
Business model- GTM type
- B2B
- Offering type
- Services
- Cost components
- Infrastructure, Technology or R&D, Personnel, Operations, Marketing or Sales
Revenue model
- Advanced Packaging OSAT Services: Outsourced semiconductor assembly and test services for advanced packaging, providing wafer bumping, 2.5D/3D heterogeneous integration, assembly, and test services to fabless companies, design houses, and foundries. Revenue generated through service contracts for prototype through high-volume manufacturing.
- Engineering and Consulting Services: Engineering services for advanced packaging process development, technology integration, and substrate design and simulation services.
Go-to-market motion1 record
Distribution channels1 record
Marketing channels3 records
FusionAP product offering
Product offeringCore offering
FusionAP is a Malaysia-based outsourced semiconductor assembly and test (OSAT) provider specializing in advanced packaging technologies including 2.5D and 3D heterogeneous integration, wafer bumping, substrate design and simulation, rapid prototyping, and final assembly and test. The company serves fabless semiconductor companies, design houses, foundries, and memory manufacturers globally, providing services from prototype through high-volume manufacturing for chiplet architectures, high-bandwidth memory, and AI/high-performance computing applications.
Product overview
FusionAP is a Malaysia-based advanced semiconductor packaging OSAT (outsourced semiconductor assembly and test) company offering a portfolio of services for 2.5D, 3D, and beyond-Moore packaging technologies. The service portfolio includes: Engineering Services (process development and technology integration for HVM lines), Prototyping & Engineering Samples (design validation before volume production), Advance Substrate Design & Simulation (electrical, thermal, and mechanical performance), Wafer Bumping (high-density die-to-package interconnects), 2.5D & 3D Heterogeneous Integration (chiplet architectures and high-bandwidth interconnects), and Assembly & Test (quality and yield learning for production transition). The company positions itself as a geopolitically neutral OSAT solution, working with global design, foundry, and technology partners to enable chipmakers to move from prototype to high-volume manufacturing.
Differentiator
Problem solved
Functional benefit
Products and services
- Engineering Services Engineering services supporting advanced packaging process development and technology integration for high-volume manufacturing semiconductor production lines, offered to fabless companies, foundries, and design houses.
Quantifiable outcome
- Targeting 7% of global advanced packaging market by 2035
Companies that use FusionAP
Customer profileSegments3 records
Ideal customer profiles3 records
FusionAP technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature6 records
FusionAP partnerships and signals
Strategic signalPartnerships
Two partnerships are on record, tiered flagship and core.
- Malaysia Advanced Packaging Consortium (MAPC)flagshipFive-company consortium formed at SEMICON Southeast Asia 2026, including SkyeChip Bhd, Inari Technology Sdn Bhd, FusionAP Sdn Bhd, Pentamaster Instrumentation Sdn Bhd, and NSW Automation Sdn Bhd. Consortium aims to develop Malaysia's first advanced packaging capabilities and capture 7% of global market by 2035. Supported by RM185.8 million in government R&D grants and industry contributions.
- Global Design, Foundry, and Technology PartnerscoreFusionAP works within a collaborative ecosystem partnering with fabless companies, design houses, foundries, and technology suppliers to align design, packaging, and test from the outset, accelerating path from prototype to production.
Scale indicators6 records
Recent moves7 records
Expansion highlights6 records
FusionAP competitors and assessment
Company assessmentBroad incumbents
- Intel Foundry: Intel's foundry and advanced packaging business offers Foveros (3D) and EMIB (2.5D) packaging services externally. Competes in the same advanced packaging market, drawing on the same IP pedigree that FusionAP's founders helped build.
- TSMC: The dominant foundry with advanced packaging leadership via CoWoS (2.5D) and SoIC (3D). While primarily a foundry, TSMC's in-house advanced packaging is the benchmark FusionAP must compete against for leading-edge chiplet and AI accelerator work.
Direct peers
- Amkor Technology: Major US-headquartered OSAT with significant advanced packaging capabilities including 2.5D/3D, TSV, and HBM packaging. Competes directly for advanced packaging service contracts with leading AI and HBM chipmakers.
- JCET Group: Leading Chinese OSAT offering advanced packaging including fan-out, 2.5D/3D, and system-in-package. Direct competitor in the global advanced packaging services market with comparable technology offerings.
- ASE Technology Holding: The world's largest OSAT provider, offering advanced packaging including 2.5D/3D integration, fan-out wafer-level packaging, and chiplet solutions. Direct competitor targeting the same fabless, foundry, and memory customers that FusionAP serves.
- Powertech Technology (PTI): Taiwan-based OSAT specializing in advanced packaging including HBM and 2.5D/3D integration. Competes for memory packaging and high-performance computing OSAT contracts in the same customer base.
- SkyeChip: Malaysian chip design house and MAPC consortium partner developing chiplet and advanced packaging IP. While primarily a design house rather than OSAT, SkyeChip is a strategic collaborator and adjacent peer in Malaysia's emerging advanced packaging ecosystem.
Regional players
- Inari Amertron: Malaysia's largest OSAT and a MAPC consortium partner alongside FusionAP. Comparable in geography and customer base, but focuses on conventional packaging and RF/analog test rather than advanced 2.5D/3D.
- Unisem Group: Malaysian OSAT providing assembly and test services to global semiconductor customers. A fellow MAPC consortium member serving the same geographic market, though focused on conventional rather than advanced packaging.
Others
- AT&S: European substrate manufacturer with Malaysia operations and advanced packaging substrate capabilities for 2.5D/3D heterogeneous integration. Enabling supplier in the advanced packaging value chain rather than direct OSAT competitor; FusionAP's substrate technologist Allen Cheah previously led AT&S's Malaysian substrate buildout.
Market position
Strengths4 records
Weaknesses4 records
Competitive moat5 records
Key risks5 records
Key highlights5 records
Customer concentration
FusionAP social profiles
Digital presenceFusionAP financial estimates
Financial estimateRevenue estimate
Valuation estimate
FusionAP leadership team
Management profileNumber of profiles
Profiles6 records
FusionAP funding detail
Funding detailFunding overview
Funding rounds2 records
Investors3 records
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
FusionAP M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about FusionAP
What does FusionAP do?
FusionAP is a Malaysia-based outsourced semiconductor assembly and test (OSAT) provider specializing in advanced packaging technologies including 2.5D and 3D heterogeneous integration, wafer bumping, substrate design and simulation, rapid prototyping, and final assembly and test. The company serves fabless semiconductor companies, design houses, foundries, and memory manufacturers globally, providing services from prototype through high-volume manufacturing for chiplet architectures, high-bandwidth memory, and AI/high-performance computing applications.
Is FusionAP a public or private company?
FusionAP is a private company. It is classified as venture growth investor backed and is currently operating.
When was FusionAP founded?
FusionAP was founded in 2025. It employs 1 to 10 people.
Where is FusionAP based?
FusionAP is headquartered in Penang, Malaysia, in the Asia region.
How does FusionAP make money?
Two revenue lines are on record. Advanced Packaging OSAT Services are the primary driver. The others are engineering and Consulting Services.
Who are FusionAP's main competitors?
Broad incumbents on record are Intel Foundry and TSMC. Direct peers are Amkor Technology, JCET Group, ASE Technology Holding, Powertech Technology (PTI) and SkyeChip. Regional players are Inari Amertron and Unisem Group. AT&S is listed as an others.
Does FusionAP have an API?
No public API is recorded for FusionAP.
What industry is FusionAP in?
FusionAP's product category is Semiconductor Packaging Services. Its primary akta.pro industry code is HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets), with a secondary code of HDAHADAC, Wafer-Level Packaging (WLP) & Redistribution (RDL). Its NAICS code is 33441 and its SIC code is 3674.