What Micro Point Pro does

Micro Point Pro Ltd (MPP), founded in 2010 in Yokne'am Illit, Israel, designs, manufactures, and distributes precision equipment and consumable tooling for the semiconductor packaging industry. The company was established through the acquisition of Kulicke & Soffa's bonding tools and back-end consumables production lines, and in 2015 it expanded by acquiring the manual wire bonder product line. Its core products include the Automatic Die Attach System (Model 6500) supporting chip-and-wire and flip-chip bonding via epoxy, eutectic, ultrasonic, and sintering processes, OEM manual wire bonders for R&D and low-volume production, four-point probes for wafer resistance measurement, semiconductor backend tools, precision mechanical parts and assemblies, probe head solutions, and diamond grinding wheels. The portfolio targets primarily semiconductor manufacturers and R&D centers, with secondary applications in automotive, medical, renewable energy, LED, IoT, and precision industrial markets.

MPP operates a hybrid go-to-market combining direct enterprise sales to semiconductor manufacturers, an e-commerce storefront for mid-market and prototyping customers, and a global distribution network spanning 13+ regions including Israel, China, Japan, South Korea, Taiwan, Singapore, India, Thailand, Vietnam, Philippines, North America, Europe, and South America. Revenue is generated through hardware sales of capital equipment (die attach systems, wire bonders, probes), recurring consumable tooling, and technical support services including installation, training, maintenance, and on-site engineering. Pricing is quote-based and not publicly disclosed, with customized solutions tailored to customer requirements and short delivery times positioned as a differentiator. The company holds ISO 9001:2008 and ISO 14001:2004 certifications, operates a multilingual website in English, Chinese, Japanese, Korean, and German, and maintains participation in industry events such as Semicon China and The Battery Show Europe.

Ownership is private with no disclosed external investors, parent company, or institutional funding. Headcount is reported in the 1–10 range, and the company is structured around retained expertise from the original Kulicke & Soffa bonding tools division, with employees collectively bringing over 40 years of semiconductor interconnect experience.

Name

Micro Point Pro

Legal name

Micro Point Pro Ltd

Website

https://mpptools.com

Company type

Private

Founded year

2010

Operating status

Operating

Headcount range

1–10 employees

Short description

Micro Point Pro Ltd, founded 2010 in Israel, manufactures precision semiconductor backend equipment including automatic die attach systems, manual wire bonders, four-point probes, and bonding consumables for semiconductor manufacturers, R&D centers, and adjacent industries globally.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Equipment

NAICS

Semiconductor Machinery Manufacturing (333242), Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals (334515)

SIC

Semiconductors & Related Devices (3674), Electronic Components & Accessories (3670)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industries

Leadframes & Package Interconnect Materials (HDAHADAF), Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM)

Keywords

• Semiconductor packaging equipment
• Die attach systems
• Wire bonding tools
• Precision bonding equipment
• Semiconductor backend tools

Headquarters

HQ city

Yoqne`am `illit

HQ country

Israel

HQ region

Middle East

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Supply Chain, Operations, Technology or R&D, Personnel, Marketing or Sales, Infrastructure

Revenue model

1. Equipment Sales: Sale of automatic die attach systems and manual wire bonders as capital equipment to semiconductor manufacturers
2. Consumables and Tooling: Recurring sale of precision consumable tools and bonding accessories for semiconductor packaging operations
3. Technical Support Services: Technical support services including installation, training, maintenance, and on-site support provided globally

Go-to-market motion1 record

Distribution channels3 records

Marketing channels3 records

Core offering

Micro Point Pro manufactures and sells high-precision semiconductor backend equipment and bonding tools, including automatic die attach systems (Model 6500 and Model 6200), manual wire bonders (OEM), four-point probes, backend tools, precision mechanical parts and assemblies, and diamond grinding wheels. The products support chip-and-wire and flip-chip packaging with epoxy, eutectic, ultrasonic, and sintering bonding processes for advanced semiconductor packaging applications. The company also provides installation, training, maintenance, and on-site technical support services globally.

Product overview

Micro Point Pro offers a unified portfolio of semiconductor manufacturing equipment and precision tools. The core offerings include Automatic Die Attach Systems (Model 6500, Model 6200) for advanced packaging applications and Manual Wire Bonders as OEM solutions. These are complemented by a comprehensive range of consumable tools including Semiconductor Tools (Backend Tools), Four Point Probes for metrology, Precision Mechanical Parts & Assemblies, and Diamond Grinding Wheels. The company also provides Probe Head Solutions for semiconductor testing. The portfolio serves semiconductor manufacturers, R&D centers, and technology companies requiring high accuracy die placement, process stability, and long-term operational reliability across both backend and frontend semiconductor sectors.

Differentiator

Problem solved

Functional benefit

Products and services

• Automatic Die Attach Systems (Model 6500 and Model 6200) High-precision automatic die bonding platforms for advanced semiconductor packaging, supporting Chip-and-Wire and Flip-Chip applications with epoxy, eutectic, ultrasonic, and sintering bonding processes for accurate die placement and reproducible series production performance. Targeted at semiconductor manufacturers and R&D centers.
• Manual Wire Bonders (OEM) Manual wire bonding systems for R&D, prototyping, and low-volume production applications, providing versatile bonding solutions with high performance and reliability for semiconductor manufacturers and research centers.
• Semiconductor Backend Tools Comprehensive range of high-performance semiconductor packaging and assembly tools designed to meet industry standards for precision, reliability, and efficiency in backend semiconductor operations.
• Four Point Probes Essential measurement equipment for accurate testing of wafer specific resistance and thin conductive layers in semiconductor, solar wafer, and thin-film research and production applications, ensuring precise and consistent data collection.
• Precision Mechanical Parts and Assemblies High-precision mechanical parts and assemblies manufactured to the highest standards using state-of-the-art manufacturing equipment and processes for semiconductor and precision manufacturing customers.
• Diamond Grinding Wheels Premium diamond grinding wheels designed for high precision and long-lasting performance in a variety of industrial grinding applications, delivering accuracy and surface finish for precision manufacturing customers.
• Technical Support and Services Installation, training, maintenance, and on-site and remote technical support services delivered globally by experienced engineers, including Help Desk chat support, for semiconductor equipment customers to minimize downtime and ensure long-term partnership.

Quantifiable outcome

• Stringent Quality Assurance Program supported by advanced measurement equipment ensures world-class quality meeting customer requirements and specifications

Segments8 records

Ideal customer profiles2 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature4 records

Partnerships

One partnership is on record.

• Kulicke & SoffacoreStrategic or Co-development Partner · 1 January 2010Acquired Kulicke & Soffa's bonding tools and other back-end consumables production lines in 2010, along with associated knowledge and expertise of experienced employees. This acquisition established MPP's foundation in the semiconductor tooling market.

Scale indicators4 records

Recent moves7 records

Expansion highlights6 records

Broad incumbents

• SUSS MicroTec: SUSS MicroTec is a German supplier of equipment for semiconductor and advanced packaging markets, including lithography, bonding, and metrology tools. It overlaps with MPP in advanced packaging equipment though as a broader portfolio player rather than a bonding-tool specialist.

Direct peers

• West-Bond: West-Bond manufactures manual and semi-automatic wire bonders for R&D, hybrid microelectronics, and small-scale production. It competes directly with MPP's manual wire bonder OEM offerings in the R&D and prototyping segment.
• Palomar Technologies: Palomar Technologies designs and manufactures high-precision wire bonders, die bonders, and vacuum reflow systems for microelectronic and photonic packaging. It competes directly with MPP in precision die attach and wire bonding solutions for advanced packaging.
• BE Semiconductor Industries (Besi): Besi is a leading global supplier of die attach equipment, flip-chip bonders, and advanced packaging solutions serving semiconductor and hybrid electronics manufacturers. It directly competes with MPP's automatic die attach systems in high-precision die bonding applications.
• Hesse Mechatronics: Hesse Mechatronics is a German manufacturer of ultrasonic and thermosonic wire bonders used in semiconductor and microelectronic packaging. It directly overlaps MPP's manual and R&D wire bonder product lines, particularly in low-volume and prototyping applications.
• Kulicke & Soffa Industries: Kulicke & Soffa is a global leader in semiconductor packaging equipment, including the very wire bonding and die attach product lines from which MPP was carved out in 2010. It is both MPP's technology progenitor and its largest direct competitor in wire bonding and advanced packaging equipment.
• ASMPT (ASM Pacific Technology): ASMPT is a Hong Kong-headquartered global supplier of semiconductor assembly equipment including die bonders, wire bonders, and packaging materials. It is one of the largest direct competitors to MPP in semiconductor packaging equipment across Asia and globally.
• Fasford Technology (Fuji Corporation): Fasford Technology, part of Fuji Corporation, is a leading Japanese manufacturer of high-speed die bonders for semiconductor back-end processes. It is a direct competitor to MPP's automatic die attach systems, particularly in high-volume chip-and-wire packaging.

Emerging players

• Finetech GmbH: Finetech develops high-precision die bonders, flip-chip bonders, and sub-micron placement systems for photonics, MEMS, and advanced packaging. It is a niche competitor addressing similar high-precision die attach use cases as MPP, though with a stronger photonics focus.

Regional players

• Toray Engineering: Toray Engineering is a Japanese provider of semiconductor manufacturing and inspection equipment, including die bonders and packaging tools. It competes regionally with MPP in Japan and across Asia for advanced semiconductor packaging equipment.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

Compliance2 records

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Micro Point Pro