Hwatsing

What Hwatsing does

Hwatsing (华海清科, SSE: 688120) is a Chinese high-end semiconductor equipment manufacturer founded in 2013 and headquartered in Tianjin, China, with additional operations in Kunshan, Beijing and Shanghai. The company specializes in Chemical Mechanical Polishing (CMP) equipment — its Universal series spans 12-inch (S300, H300, 300 FS/T/X/Dual/E/B), 8-inch (200 Smart/200/200 W/200 D) and 6-inch (150 Smart) configurations — and has built a horizontal equipment platform that also covers panel-level CMP (Master-P510/P510APEX, 510×515mm), ion implantation (iPUMA-LE/HT/HP/LT/H via wholly-owned subsidiary Xinyu Semiconductor), ultra-precision wafer thinning (Versatile-GP300/GH300/GM300/GM300CMP/GR300/GR200/GN200), edge polishing (Master-BN300/BT300), dicing (Versatile-DT300/DT200), and wet processing/cleaning (HSC-D3812/F3400/F2400/I2402/S1300/S3810 plus batch cassette cleaning and chemical/slurry delivery systems).

The company's revenue model mixes one-time capital-equipment sales with recurring service revenue streams: wafer regeneration (Tianjin factory at 200,000 12-inch wafers/month, scaling to 600,000 wafers/month once Kunshan completes), CMP key consumables, and equipment maintenance/upgrade services. Go-to-market is enterprise direct field sales to Chinese fabs, supported by a nationwide service branch network. The customer base comprises over 30 domestic semiconductor partners, including leading Chinese memory and IC manufacturers; the May 2026 iPUMA-LE delivery to a leading domestic advanced memory chip manufacturer marks its flagship memory-customer win.

Hwatsing has positioned itself as China's domestic CMP leader: it produced the country's first domestically developed 12-inch CMP equipment in 2017, won the National Technical Invention First Prize in 2024 and a China Patent Silver Award in 2025, and listed on the Shanghai Stock Exchange STAR Market in June 2022. Its full operations are geographically concentrated in mainland China, exposing revenue to the cycle of domestic fab capex and to import-substitution policy tailwinds without geographic diversification.

Name

Hwatsing

Legal name

华海清科股份有限公司 (Hwatsing Co., Ltd.)

Website

https://hwatsing.com

Company type

Public

Founded year

2013

Operating status

Operating

Short description

Hwatsing (华海清科) is a Chinese semiconductor equipment manufacturer specializing in Chemical Mechanical Polishing (CMP), ion implantation, and wafer thinning equipment. Founded in 2013 and listed on the SSE STAR Market (688120), it serves domestic Chinese semiconductor fabs and advanced packaging manufacturers.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Special Industry Machinery (No Metalworking Machinery) (3550)

akta.pro primary industry

Wafer Cleaning & Surface Preparation Equipment (HDAHAEAG)

akta.pro secondary industries

Ion Implantation & Doping Equipment (HDAHAEAD), Wafer Services & Reclaim (Epitaxy, Thinning, Reclaim) (HDAHACAH)

Keywords

• Semiconductor manufacturing equipment
• Chemical mechanical polishing
• Ion implantation systems
• Wafer thinning equipment
• Advanced packaging equipment

Headquarters

HQ city

Beijing

HQ country

China

HQ region

Asia

Offices4 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Operations, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

1. Semiconductor Equipment Sales: Sale of semiconductor manufacturing equipment including CMP systems, ion implanters, wafer thinning equipment, dicing equipment, wet processing equipment, edge polishing equipment, and panel-level packaging equipment to semiconductor fabs and manufacturers.
2. Wafer Regeneration Services: Provides wafer regeneration processing services with monthly capacity of 200,000 12-inch regenerated wafers, expanding to 600,000 with Kunshan facility completion.
3. Key Consumables and Maintenance Services: Provides key CMP equipment consumables and maintenance/update services with professional process team offering complete solutions and self-controllable high-stability supply chain system.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels5 records

Core offering

Hwatsing designs, manufactures, and sells semiconductor manufacturing equipment, with its core product line being Chemical Mechanical Polishing (CMP) equipment for 12-inch and smaller wafers. The company also offers ion implanters, ultra-precision wafer thinning systems, edge polishing and dicing equipment, wet processing/cleaning platforms, chemical and slurry delivery systems, and provides wafer regeneration and equipment maintenance services to semiconductor fabs and manufacturers.

Product overview

华海清科 (Hwatsing) is a high-end semiconductor equipment manufacturer with core proprietary intellectual property. The company offers a comprehensive portfolio of equipment and services organized around semiconductor manufacturing processes: CMP (Chemical Mechanical Polishing) equipment including the Universal series (S300, H300, 300 FS/T/X/Dual/E/B) and Panel-level CMP equipment (Master-P510, Master-P510APEX); Ion Implantation equipment (iPUMA series including LE, HT, HP, LT, H models); Wafer Thinning equipment (Versatile-GP300, GH300, GM300, GM300CMP, GR300, GN200, GR200); Edge Polishing equipment (Master-BN300, Master-BT300); Dicing equipment (Versatile-DT300, DT200); Wet Processing/Cleaning equipment (HSC-D3812, F3400, F2400, I2402, S1300, S3810, HCC-3080S, HBC-E3500); and Chemical/Slurry Delivery systems (HCDS, HSDS, HSDS-AD2501). The company also provides wafer regeneration services and key consumables with maintenance services. This equipment portfolio serves integrated circuits, advanced packaging, large silicon wafers, third-generation semiconductors, MEMS, and Micro LED manufacturing processes.

Differentiator

Problem solved

Functional benefit

Brands

• Universal-S300: 12-inch CMP equipment with stacked layout architecture for high productivity, advanced polishing and cleaning modules, suitable for advanced process technology.
• Universal-H300
• Universal-300 FS
• Universal-300 T
• Universal-300 X
• Universal-300 Dual
• Universal-300 E
• Universal-300 B
• Universal-TGS200
• Universal-200 Smart
• Universal-200 W
• Master-P510
• iPUMA-LE
• iPUMA-HT
• iPUMA-HP
• iPUMA-LT
• iPUMA-H
• Versatile-GP300
• Versatile-GH300
• Versatile-GM300
• Versatile-GM300CMP
• Versatile-GR300
• Versatile-GN200
• Master-BN300
• Master-BT300
• Versatile-DT300
• Versatile-DT200
• HSC-D3812
• HSC-F3400
• HSC-F2400
• HSC-I2402
• HSC-S1300
• HSC-S3810
• HBC-E3500
• HCDS
• HSDS

Products and services

• Universal Series CMP Equipment (12-inch, 8-inch, 6-inch) 12-inch, 8-inch, and 6-inch Chemical Mechanical Polishing (CMP) equipment families (Universal-S300, Universal-H300, Universal-300 FS/T/X/Dual/E/B, Universal-TGS200, Universal-200 Smart/200/200 W/200 D, Universal-150 Smart) for advanced and mature process nodes across IC, advanced packaging, large silicon wafer, third-generation semiconductor (SiC), MEMS, and Micro LED manufacturing.
• Panel CMP Equipment (Master-P510, Master-P510APEX) High-precision polishing equipment for advanced packaging and glass substrate panel-level products, supporting ultra-flat, low-defect polishing of panels up to 510mm×515mm in single or dual polishing head configurations with integrated cleaning and automated loading/unloading.
• iPUMA Series Ion Implantation Equipment 12-inch ion implantation systems (iPUMA-LE horizontal ribbon-beam large-beam, iPUMA-HT high-temperature, iPUMA-HP hydrogen large-beam, iPUMA-LT low-temperature, iPUMA-H hydrogen high-energy) developed by subsidiary Xinyu Semiconductor, used in IC manufacturing, advanced logic, large silicon wafer, and power device processes.
• Versatile Series Wafer Thinning Equipment 12-inch ultra-precision wafer thinning systems (Versatile-GP300, GH300, GM300, GM300CMP, GR300) and 4/6/8-inch power semiconductor thinners (Versatile-GN200, GR200) integrating grinding, CMP, cleaning, and ring-attaching processes for 3D IC, advanced packaging, and power semiconductor manufacturing.
• Edge Polishing Equipment (Master-BN300, Master-BT300) 12-inch wafer edge precision polishing and finishing equipment integrating high-precision polishing, trimming, efficient cleaning, and precision measurement for advanced packaging and HBM applications.
• Dicing Equipment (Versatile-DT300, Versatile-DT200) High-efficiency, high-cleanliness fully automatic dual-axis wafer edge trimming equipment integrating cutting, transfer, cleaning, and measurement units with multi-axis precision cutting technology for 12-inch and smaller wafers.
• Wet Processing and Cleaning Equipment (HSC, HCC, HBC Series) Single-wafer cleaning platforms (HSC-D3812, HSC-F3400, HSC-F2400, HSC-I2402, HSC-S1300, HSC-S3810), cassette cleaning (HCC-3080S), and batch cleaning (HBC-E3500) equipment for advanced processes, large silicon wafer endpoint cleaning, compound semiconductors, and Micro LED applications.
• Chemical and Slurry Delivery Systems (HCDS, HSDS, HSDS-AD2501) Chemical delivery system (HCDS) and slurry delivery system (HSDS, HSDS-AD2501) featuring real-time, high-precision online proportioning and parameter closed-loop control for slurry and chemical supply in semiconductor manufacturing wet process equipment.
• Wafer Regeneration Services Standard wafer regeneration production service with professional CMP/Wet cleaning technical team and comprehensive measurement/analysis instruments, providing full-range technical support, sales, and contract manufacturing services for domestic partners, with planned combined monthly capacity of 600,000 12-inch wafers.
• Key Consumables and Maintenance Services Provides key CMP equipment consumables, maintenance, and update services with a professional process team offering complete solutions and a self-controllable high-stability supply chain system to ensure stable equipment operation for semiconductor manufacturers.

Quantifiable outcome

• First domestically developed 12-inch CMP equipment, achieving full industrialization and breaking foreign monopoly
• +1 more outcomes

Named customers2 records

Segments5 records

Ideal customer profiles3 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

One partnership is on record.

• 芯嵛半导体（上海）有限公司 (Xinzhu Semiconductor)coreOthers · 6 May 2026Wholly-owned subsidiary acquired by Hwatsing to expand into ion implantation equipment. The iPUMA-LE 12-inch large-beam ion implanter developed by this subsidiary has been delivered to domestic advanced memory chip manufacturers, representing significant expansion of Hwatsing's product portfolio into front-end semiconductor process equipment.

Scale indicators6 records

Recent moves8 records

Expansion highlights7 records

Broad incumbents

• Applied Materials: Global semiconductor equipment giant whose CMP, implant, and clean product lines compete broadly with Hwatsing across the process flow.
• Lam Research: Global front-end equipment incumbent (etch, deposition, clean) whose broad portfolio overlaps with Hwatsing's surface-prep and cleaning tools.

Direct peers

• ACM Research: Semiconductor wet-cleaning equipment maker with strong China presence, directly comparable to Hwatsing's single-wafer cleaning and wet-process tool portfolio.
• Axcelis Technologies: Pure-play ion implantation equipment maker, directly comparable to Hwatsing's iPUMA implanter line developed via its Xinzhu subsidiary.
• DISCO Corporation: Japanese leader in wafer grinding, thinning, and dicing equipment, overlapping with Hwatsing's Versatile thinning and DT dicing/edge-trim tools.
• SCREEN Holdings: Major supplier of semiconductor cleaning and surface-preparation equipment, directly comparable to Hwatsing's wet-process and cleaning platforms.
• NAURA Technology Group: Leading Chinese semiconductor equipment manufacturer (etch, deposition, cleaning) serving the same domestic fabs and localization mandate as Hwatsing.
• Ebara Corporation: Japanese supplier of CMP (planarization) systems for semiconductor fabs, directly overlapping with Hwatsing's core chemical mechanical polishing equipment business.

Regional players

• Kingsemi: Chinese maker of coater/developer and cleaning equipment competing for the same domestic fab wet-process and surface-prep demand.
• Advanced Micro-Fabrication Equipment (AMEC): Chinese STAR Market-listed semiconductor equipment maker (etch, MOCVD) pursuing the same domestic-substitution market as Hwatsing.

Market position

Strengths5 records

Weaknesses4 records

Competitive moat6 records

Key risks5 records

Key highlights7 records

Customer concentration

Compliance4 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles3 records

Subsidiaries1 record

Funding overview

Funding rounds1 record

Investors1 record

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A1 record

Investments1 record

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Hwatsing