Semiconductor Process Equipment
Yield Engineering Systems (YES) supplies dry and wet process equipment for advanced semiconductor packaging, serving AI and HPC chip manufacturers, foundries, memory producers, and OSATs with reflow, cure, adhesion, TGV etch, and metal deposition systems globally.
- Company typePrivate
- Founded1986
- HeadquartersValencia, United States
- Headcount101–250
- GTM typeB2B
- OfferingHardware or Manufacturing
What Semiconductor Process Equipment does
Yield Engineering Systems, Inc. (YES), doing business as Semiconductor Process Equipment Corporation, is a privately held US-based supplier of process equipment for advanced semiconductor packaging. Founded in 1986 and headquartered in Fremont, California, the company designs and manufactures both dry process systems (reflow, cure, adhesion, bonding, coating) and wet process systems (TGV etch, electroless metal deposition, edge zone removal, surface conditioning), with a separate Radix lab-to-fab product line for scale-up from research to production. Its equipment portfolio targets process steps critical to advanced packaging — including fluxless reflow for sub-10 micron micro-bumps, low-temperature cure for build-up layers and interposers, panel-level processing on glass substrates, and through-glass-via etching — explicitly oriented to the AI and HPC packaging roadmap (2.5D and 3D integration, glass core substrates, fan-out wafer-level packaging).
YES operates approximately 300 employees globally, of which more than 220 are engineers, supported by an IP portfolio of 100+ patents, pending patents, and trade secrets. The company has delivered 1,000+ tools to 100+ semiconductor fabs worldwide. Its manufacturing, engineering, and R&D footprint spans the United States (Fremont headquarters and Chandler Advanced Technology Center) and India (manufacturing in Sulur/Coimbatore, R&D in Bengaluru and Coimbatore), with sales and service offices in Taiwan, South Korea, Japan, and Germany, and an explicit geographic exclusion of mainland China.
YES generates revenue primarily through direct, quote-based hardware sales of engineered systems sold on multi-year enterprise contracts to semiconductor manufacturers, foundries, memory producers, OSATs, and AI infrastructure suppliers, complemented by a global services and support stream for installation, maintenance, and parts. Named engagements include leading AI infrastructure suppliers, a leading global memory supplier, Asia's leading foundry, a leading Japanese semiconductor manufacturer, a Tier 1 Taiwanese OSAT, and SkyWater Technology. In December 2025, Rezwan Lateef was appointed Chief Executive Officer, succeeding Rama Alapati, signaling a focus on accelerating growth in AI/HPC advanced packaging.
Semiconductor Process Equipment firmographics
Firmographics- Name
- Semiconductor Process Equipment
- Legal name
- Yield Engineering Systems, Inc.
- Website
- https://team-spec.com
- Company type
- Private
- Founded year
- 1986
- Operating status
- Operating
- Headcount range
- 101–250 employees
- Short description
- Yield Engineering Systems (YES) supplies dry and wet process equipment for advanced semiconductor packaging, serving AI and HPC chip manufacturers, foundries, memory producers, and OSATs with reflow, cure, adhesion, TGV etch, and metal deposition systems globally.
- Ownership category
- akta.pro rank
Semiconductor Process Equipment industry classification
Industry- Product category
- Semiconductor Process Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242)
- SIC
- Electronic & Other Electrical Equipment (No Computer Equip) (3600)
- akta.pro primary industry
- Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)
- akta.pro secondary industry
- Package Substrates & Interposers (ABF/BT, Silicon/Glass) (HDAHADAE)
Keywords
Where Semiconductor Process Equipment is headquartered
LocationHeadquarters
- HQ city
- Valencia
- HQ country
- United States
- HQ region
- North America
Offices9 records
Markets served
Semiconductor Process Equipment business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales, Infrastructure
Revenue model
- Semiconductor Equipment Sales: Sale of advanced packaging equipment including dry process (VeroTherm, VertaCure, VertaPrime, VertaBond, VeroFlex, UltraCoat) and wet process systems (TersOnus, TersOra). Equipment sold to semiconductor manufacturers for high-volume manufacturing.
- Global Services and Support: Technical support, service, and parts for installed equipment base. Includes installation, maintenance, and ongoing support for semiconductor fab customers.
Pricing tiers
| Model | Billing | Price |
|---|---|---|
| Other | Multi-year contract | Custom enterprise pricing |
Go-to-market motion1 record
Distribution channels1 record
Marketing channels4 records
Semiconductor Process Equipment product offering
Product offeringCore offering
Yield Engineering Systems (YES) supplies semiconductor process equipment used in advanced packaging for AI and high-performance computing applications. Its portfolio spans Dry Process systems (fluxless reflow, low-temperature cure, adhesion, bonding, coating), Wet Process platforms (TGV etch, electroless metal deposition, edge zone removal), and the Radix Lab-to-Fab product line, sold to semiconductor manufacturers, foundries, and OSATs globally.
Product overview
Yield Engineering Systems (YES) offers a comprehensive portfolio of semiconductor process equipment organized into three main categories: Dry Process systems (reflow, curing, coating, and bonding equipment including VeroTherm, VertaCure, VertaPrime, VertaBond, UltraCoat, and RapidCure product lines), Wet Process platforms (TersOnus for TGV etching and metal deposition, TersOra for edge zone removal, SURE wet processing, and chemical delivery units), and Radix Lab to Fab equipment series (G Series, RF/SRF Series, EcoClean, TA Series, EcoCoat, and PB Series for scale-up from lab to production). The equipment enables advanced packaging for high-performance computing and AI applications, supporting technologies including 2.5D and 3D integration, glass core substrates, micro-bump structures, panel-level processing, and various curing, reflow, and deposition processes.
Differentiator
Problem solved
Functional benefit
Brands
- VeroTherm: Reflow systems for solder balls, C4 bumps, and μBumps used in advanced packaging for AI and HPC applications.
- VertaCure
- VertaPrime
- VertaBond
- VeroFlex
- UltraCoat
- TersOnus Platform
- SURE Wet Processing Tool
- Chemical Delivery Units
- TersOra
- Radix
- RapidCure
Products and services
- VeroTherm FAR XP Dry Process Equipment — Fluxless solder reflow system designed for sub-10 micron micro-bumps used in Solder Balls, C4 Bumps, and µBumps in advanced packaging for AI and HPC applications.
- VertaCure XP G2 Dry Process Equipment — Resist cure system for curing of build-up layers and interposers in advanced packaging for AI and HPC.
- VertaCure XP G3 Dry Process Equipment — Advanced curing system enabling precise low-temperature curing, annealing, and degassing for next-generation 2.5D and 3D AI and HPC packaging.
- VertaCure PLP Dry Process Equipment — Panel-level processing cure system enabling high-throughput manufacturing on larger panel substrates.
- VertaCure LX Dry Process Equipment — Low-temperature curing and annealing system for advanced semiconductor packaging supporting next-gen Edge devices in AI and HPC.
- VeroFlex FAR PLP Dry Process Equipment — Panel-level reflow system for advanced packaging on glass substrates enabling high-throughput 2.5D and 3D integration.
- UltraCoat Dry Process Equipment — Coating system for dry process applications in semiconductor manufacturing.
- VertaPrime PLP Dry Process Equipment — Adhesion enhancement system that enhances bonding needed for build-up layers and substrate core in advanced packaging.
- VertaBond Dry Process Equipment — Bonding solution for advanced semiconductor packaging applications.
- TersOnus Platform Wet Process Equipment — Comprehensive wet processing platform providing precise Through Glass Via (TGV) etch capability and Cu-less and ENEPIG electroless metal deposition for advanced packaging build-up layer connectivity.
- SURE Wet Processing Tool Wet Process Equipment — Wet processing tool for semiconductor manufacturing applications.
- Chemical Delivery Units Wet Process Equipment — Chemical delivery units for wet process semiconductor manufacturing.
- TersOra Edge Zone Removal Wet Process Equipment — Edge zone removal process for uniform edges in advanced package build-up layers.
- RapidCure Dry Process Equipment — UV and direct thermal exposure curing system, based on exclusive license from Deca Technologies, that significantly reduces process cycle time for Fan Out Wafer Level Packaging.
- Radix Lab-to-Fab Product Line Radix Lab to Fab Products — Scale-up product line including G Series, RF/RFS/RFSE, SRF Series, EcoClean, TA Series, EcoCoat, and PB Series equipment that transitions processes from laboratory to production-level panel and wafer-level packaging.
- Global Services and Support Services — Technical support, service, parts, installation, and maintenance for YES's installed base of advanced packaging equipment.
Quantifiable outcome
- Delivered 1,000+ tools to over 100 fabs worldwide
- +2 more outcomes
Companies that use Semiconductor Process Equipment
Customer profileNamed customers6 records
Segments3 records
Ideal customer profiles3 records
Semiconductor Process Equipment technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature8 records
Semiconductor Process Equipment partnerships and signals
Strategic signalPartnerships
One partnership is on record.
- Tamil Nadu GovernmentcoreMemorandum of Understanding (MoU) signed with Government of Tamil Nadu. YES proposed to set up manufacturing facility in Tamil Nadu, India as part of the agreement. This partnership enabled the establishment of YES's Sulur, Coimbatore manufacturing facility.
Scale indicators5 records
Recent moves9 records
Expansion highlights6 records
Semiconductor Process Equipment competitors and assessment
Company assessmentDirect peers
- BE Semiconductor Industries N.V. (Besi): Besi is a leading supplier of die attach, flip-chip, hybrid bonding, and advanced packaging equipment — directly competing with YES in fluxless reflow and micro-bump packaging for AI and HBM applications.
- ASMPT: ASMPT supplies die bonding, advanced packaging, and SMT equipment globally. Its Advanced Packaging segment overlaps directly with YES's VeroTherm and VertaCure offerings for memory stacking and logic packaging.
- Kulicke & Soffa Industries: Kulicke & Soffa is a major supplier of wire bonders, TCB (thermo-compression bonding), and advanced packaging tools. Its TCB and die attach portfolios directly compete with YES's bonding and reflow systems for HBM and AI packaging.
- SÜSS MicroTec: SÜSS MicroTec is a specialist in lithography, wafer-level packaging, bonding, and coating equipment. Its advanced packaging equipment portfolio (coaters, bonders) overlaps with YES's VertaPrime, VertaBond, and UltraCoat offerings.
- Toray Engineering Co., Ltd. Toray Engineering supplies semiconductor manufacturing equipment including coater/developers and advanced packaging tools. Its coater and panel-level packaging systems compete with YES's UltraCoat and VertaCure PLP products.
Broad incumbents
- Tokyo Electron (TEL): Tokyo Electron is one of the largest semiconductor manufacturing equipment vendors globally, with growing exposure to advanced packaging. TEL's scale and broad portfolio make it a major competitive force, even where YES specializes.
- Applied Materials: Applied Materials has expanded into advanced packaging through its Black Diamond and Producer XP platforms. As a broad incumbent, AMAT competes with YES across packaging and adjacent equipment categories.
- Lam Research: Lam Research is a leading semiconductor equipment incumbent with selective forays into advanced packaging. While its core focus is deposition and etch, it competes indirectly with YES's TersOnus and wet processing portfolio.
- SCREEN Holdings: SCREEN Holdings supplies semiconductor cleaning and surface preparation equipment. Its cleaning tools overlap with YES's wet processing and TersOra edge zone removal offerings for advanced packaging.
- ULVAC: ULVAC provides vacuum and thin-film deposition equipment used in semiconductor and packaging manufacturing. It competes with YES in dry process equipment categories and is an established Japanese equipment vendor.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat5 records
Key risks6 records
Key highlights7 records
Customer concentration
Semiconductor Process Equipment social profiles
Digital presenceSemiconductor Process Equipment financial estimates
Financial estimateRevenue estimate
Valuation estimate
Semiconductor Process Equipment leadership team
Management profileNumber of profiles
Profiles1 record
Semiconductor Process Equipment funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Semiconductor Process Equipment M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Semiconductor Process Equipment
What does Semiconductor Process Equipment do?
Yield Engineering Systems (YES) supplies semiconductor process equipment used in advanced packaging for AI and high-performance computing applications. Its portfolio spans Dry Process systems (fluxless reflow, low-temperature cure, adhesion, bonding, coating), Wet Process platforms (TGV etch, electroless metal deposition, edge zone removal), and the Radix Lab-to-Fab product line, sold to semiconductor manufacturers, foundries, and OSATs globally.
Is Semiconductor Process Equipment a public or private company?
Semiconductor Process Equipment is a private company. It is classified as unknown and is currently operating.
When was Semiconductor Process Equipment founded?
Semiconductor Process Equipment was founded in 1986. It employs 101 to 250 people.
Where is Semiconductor Process Equipment based?
Semiconductor Process Equipment is headquartered in Valencia, United States, in the North America region.
How does Semiconductor Process Equipment make money?
Two revenue lines are on record. Semiconductor Equipment Sales are the primary driver. The others are global Services and Support.
Who are Semiconductor Process Equipment's main competitors?
Direct peers on record are BE Semiconductor Industries N.V. (Besi), ASMPT, Kulicke & Soffa Industries, SÜSS MicroTec and Toray Engineering Co., Ltd.. Broad incumbents are Tokyo Electron (TEL), Applied Materials, Lam Research, SCREEN Holdings and ULVAC.
Does Semiconductor Process Equipment have an API?
No public API is recorded for Semiconductor Process Equipment.
What industry is Semiconductor Process Equipment in?
Semiconductor Process Equipment's product category is Semiconductor Process Equipment. Its primary akta.pro industry code is HDAHAEAL, Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB), with a secondary code of HDAHADAE, Package Substrates & Interposers (ABF/BT, Silicon/Glass). Its NAICS code is 333242 and its SIC code is 3600.