Ultron Systems
Ultron Systems is a privately held, California-based manufacturer of precision semiconductor back-end assembly equipment and adhesive films, serving global semiconductor and electronics manufacturers through wholly-owned Asia subsidiaries and an independent sales rep network.
- Company typePrivate
- Founded1982
- HeadquartersMoorpark, United States
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
What Ultron Systems does
Ultron Systems, Inc. is a privately held US corporation, founded in 1982 and headquartered in Moorpark, California, that designs and manufactures precision semiconductor back-end assembly equipment and matched processing materials. The company's equipment portfolio addresses the wafer post-processing workflow: wafer/frame film mounters (UH114 and UH115 series), UV curing systems including conventional lamp and LED-based platforms (UH104, UH105, UH204, and the newer UH106), die-matrix expanders (UH130 and UH132 series), wafer cleaning systems (UH117, UH119), a backgrinding protective-film remover (UH110 series with virtual 180-degree peeling), and a backlapping film applicator (UH108). Its materials portfolio spans silicone-free, standard UV, and antistatic UV adhesive plastic films for dicing and backgrinding, complemented by fiber-reinforced grip rings, film frames, static-dissipative shippers, separator tools, and grip-ring magazines in 6", 8", and 12" wafer formats.
Underlying technology is electromechanical and process-engineering in nature: notable engineering elements include LED-matrix UV curing with rotational stage geometry for fast, low-temperature curing; motor-driven one-pass lamination that eliminates manual crease defects; virtual 180-degree peeling geometry that reduces wafer stress during backgrinding film removal; brushless non-contact high-pressure wafer cleaning with offset capability for non-centered mounted wafers; and silicone-free and antistatic adhesive film formulations aimed at ESD-sensitive and contamination-sensitive device flows. The company is ISO 9001:2015 certified at its Moorpark facility.
Ultron monetizes via direct one-time sales of capital equipment and matched consumables to semiconductor and electronics manufacturers worldwide. Pricing is quote-based and not publicly disclosed. The go-to-market is enterprise field sales executed through a global network: wholly-owned regional subsidiaries Ultronics, Inc. (Kamakura, Japan) and Trend Zone Limited (Kowloon Bay, Hong Kong, covering China, Singapore, Taiwan, and Malaysia), supplemented by independent sales representatives across the US, Canada, and Europe (Italy, UK, Germany, France, Netherlands, plus pan-European coverage of Belgium, Finland, Poland, Greece, Ireland, Portugal, Spain, Scandinavia, Israel, and Turkey) and select other territories. Marketing relies on the company website and industry exhibitions. Customer segments are not publicly disclosed; no named end-customer logos or revenue splits are available.
Ultron Systems firmographics
Firmographics- Name
- Ultron Systems
- Legal name
- Ultron Systems, Inc.
- Website
- https://ultronsystems.com
- Company type
- Private
- Founded year
- 1982
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Short description
- Ultron Systems is a privately held, California-based manufacturer of precision semiconductor back-end assembly equipment and adhesive films, serving global semiconductor and electronics manufacturers through wholly-owned Asia subsidiaries and an independent sales rep network.
- Ownership category
- akta.pro rank
Ultron Systems industry classification
Industry- Product category
- Semiconductor Assembly Equipment
- NAICS
- Semiconductor Machinery Manufacturing (333242), Semiconductor and Other Electronic Component Manufacturing (33441), Other Electronic Component Manufacturing (334419)
- SIC
- Semiconductors & Related Devices (3674), Electronic Components, Nec (3679), Electronic Components & Accessories (3670)
- akta.pro primary industry
- Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)
- akta.pro secondary industries
- Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders) (HDAHAGAM), Wafer Cleaning & Surface Preparation Equipment (HDAHAEAG)
Keywords
Where Ultron Systems is headquartered
LocationHeadquarters
- HQ city
- Moorpark
- HQ country
- United States
- HQ region
- North America
Offices3 records
Markets served
Ultron Systems business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Supply Chain, Personnel, Operations, Marketing or Sales, Technology or R&D, Infrastructure
Revenue model
- Semiconductor Assembly Equipment: Sale of precision semiconductor assembly equipment in both manual and fully-automatic models including wafer/frame film mounters, UV curing systems, die-matrix expanders, wafer cleaning systems, and backgrinding film removers
- Processing Materials: Sale of semiconductor adhesive plastic tapes including silicone-free, standard UV, and antistatic UV films, as well as grip rings, film frames, shippers, separator tools, and magazines
Go-to-market motion2 records
Distribution channels3 records
Marketing channels2 records
Ultron Systems product offering
Product offeringCore offering
Ultron Systems manufactures and sells precision semiconductor assembly equipment in both manual and fully-automatic models — including wafer/frame film mounters, UV curing systems, die-matrix expanders, wafer cleaning systems, backgrinding protective-film removers, and backlapping film applicators. The company also produces semiconductor processing materials such as silicone-free, standard UV, and antistatic UV adhesive plastic films, grip rings, film frames, shippers, separator tools, and magazines used in dicing, backgrinding, curing, and die-separation processes.
Product overview
Ultron Systems, Inc. is a semiconductor assembly equipment and processing materials manufacturer established in 1982. The company offers two main product categories: (1) Assembly Equipment including Model UH114/115 Series Wafer/Frame Film Mounters, Model UH104/105/204 Series UV Curing Systems, Model UH130/132 Series Die-Matrix Expanders, Model UH117/119 Wafer Cleaning Systems, Model UH110 Film Removers, and Model UH108 Backlapping Film Applicators; and (2) Processing Materials including Silicone-Free, Standard UV, and Antistatic UV Adhesive Plastic Films, UGR Series Grip Rings, UFF Series Film Frames, UGFS Series Shippers, Grip Ring Separator Tools, and UGRM Series Grip Ring Magazines. The product line serves semiconductor dicing, backgrinding, cleaning, and curing processes with both manual and fully-automatic models in 6", 8", and 12" wafer configurations.
Differentiator
Problem solved
Functional benefit
Products and services
- Model UH114 Series Wafer/Frame Film Mounters Manual/semiautomatic film mounter that applies adhesive plastic film to wafers mounted on film frames; supports 6", 8", and 12" wafers with adjustable spring-loaded roller assembly, bubble-free lamination, and digital temperature control.
- Model UH115 Series Wafer/Frame Film Mounters Semiautomatic motor-driven film mounter with one-pass uniform lamination that eliminates crease lines common to manual mounters; adjustable motorized roller speed and pressure, supports 6", 8", and 12" wafers.
- Model UH104 Series UV Curing Systems Desktop UV tape exposure systems with ozone-free UV lamp array and cool low-temperature UVA 365nm curing process; UH104-8 supports up to 8" wafers and UH104-12 supports up to 12" wafers on grip ring or film frame.
- Model UH105 Series LED UV Curing Systems LED-based UV curing system with instant startup, fast conveyor, and significant operational cost savings; accommodates up to 8" wafers and rectangular substrates up to 8"x12".
- Model UH204 UV Curing System Fully automatic single-cassette UV tape exposure system with auto-scan feature that senses the presence or absence of a film frame in the magazine carrier; accommodates up to 8" wafers with 6" or 8" film frame adapter included.
- Model UH130 Series Die-Matrix Expanders Pneumatic die-matrix expander that precisely separates die on wafers; UH130 supports up to 8" wafers/film frames and UH130-12 supports up to 12"; offers optional motorized circular cutter assembly and digital temperature-controlled heated stage.
- Model UH132 Series Die-Matrix Expanders Motor-driven die-matrix expander with digital speed control offering linear and uniform expansion throughout the drive stroke for greater precision; supports 8" wafers/film frames (UH132) and 12" (UH132-12).
- Model UH117 Wafer Cleaning System Semiautomatic programmable wafer cleaning system with touchscreen LCD and microprocessor control; stores up to 10 programs with up to 99 cleaning/rinsing/drying steps; supports up to 8" diameter wafers or 6" wafers on film frame/grip ring.
- Model UH119 Wafer Cleaning System Brushless non-contact wafer cleaning system using variable-cycle high-pressure wash; intelligent menu eliminates operator error; accommodates 4", 5", 6", and 8" wafers and 6" and 8" film frames with an offset feature for non-centered mounted wafers.
- Model UH110 Series Wafer Backgrinding Protective-Film Remover Semiautomatic film demounter for 3" to 8" wafers that uses a virtual 180-degree peeling angle for efficient peeling with lower wafer stress and higher yields; throughput up to 200 wafers/hour; UH110 supports up to 6" wafers and UH110-8 up to 8".
- Model UH108 Series Wafer Backlapping Film Applicator Benchtop protective tape application equipment that cuts film to wafer edge within 0.005" in less than 20 seconds; features adjustable spring-loaded roller for bubble-free lamination, adjustable cutting angle/depth/diameter, and vacuum-securing wafer stage.
- Rotational LED UV Curing System Model UH106 New rotational LED UV curing system using LED matrix and rotational stage for fast and accurate curing; instant startup for on-demand use and significant operational cost savings; targeted at semiconductor wafer UV tape curing processes.
- Silicone-Free Adhesive Plastic Films Adhesive plastic films containing no silicone release agents, providing cleaner processes and more consistent adhesive properties; used for dicing and backgrinding processes.
- Standard UV Adhesive Plastic Films UV-sensitive adhesive films offering high adhesive strength during sawing that reduces significantly after UV exposure for easy die removal; available in a wide selection of thicknesses and adhesive strengths.
- Antistatic UV Adhesive Plastic Films UV adhesive films with an antistatic layer that dissipates negative charge build-up, preventing ESD as a process variable for static-selective devices.
- UGR Series Grip Rings Fiber-reinforced polycarbonate grip (expander) rings with exacting tolerances, available in USI blue and white for 6", 8", and 12" wafers; feature dimple marks for quick orientation confirmation.
- UFF Series Film Frames Film frames designed for manual and high-efficiency automated operations, available in 6", 8", and 12" sizes with registration notches for accurate engagement.
- UGFS Series Grip Ring / Film Frame Shippers Static-dissipative durable shippers that accommodate same-sized grip rings or film frames; smoke-color minimizes UV light exposure; available in 6", 8", and 12" sizes.
- Grip Ring Separator Tool Tool for easily separating grip ring segments with minimal effort; works on many non-USI grip rings.
- UGRM Series Grip Ring Magazines Durable magazines for transporting multiple wafer-mounted USI Grip Rings; hold up to 10 grip rings and are available in 6", 8", and 12" sizes.
Companies that use Ultron Systems
Customer profileSegments1 record
Ideal customer profiles2 records
Ultron Systems technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature7 records
Ultron Systems partnerships and signals
Strategic signalPartnerships
Ten partnerships are on record, tiered core and minor.
- Ultronics, Inc. (Japan)coreWholly-owned subsidiary serving the Japan market for semiconductor assembly equipment and processing materials sales and support.
- Trend Zone Limited (Hong Kong)coreWholly-owned subsidiary serving China, Singapore, Taiwan, and Malaysia markets for semiconductor equipment distribution.
- S.P.S. S.r.l. (Italy)minorRegional sales representative for Italy market. Sales contact: Sergio Moroni, Service contact: Alessandro Barilaro.
- S.P.S. Ltd. (United Kingdom)minorRegional sales representative for United Kingdom market. Sales contact: Peter Summers.
- MINITRON elektronik GmbH (Germany)minorRegional sales representative for Germany market. Contact: Mr. Roland Scheuerer.
- Microworld Grenoble (France)minorRegional sales representative for France market. Sales contact: Ms. Marie Laure Tresca.
- SPS-Europe B.V. (Netherlands)minorRegional sales representative for Netherlands, Belgium, Finland, Poland, Greece, Portugal, Spain, Turkey, Scandinavia, and Israel markets. Sales contacts: Rein de Groot, Cor Rozema.
- Dietz and Associates (Northern California)minorRegional sales representative for Northern California. Contact: Mr. Geoff Dietz.
- Cope Assembly Products (Eastern US)minorRegional sales representative for North Carolina, South Carolina, Maryland, Virginia, and Washington D.C. Contact: Mr. Ted Kress.
- Lyons & Associates (Northeast US and Canada)minorRegional sales representative for Eastern Canada, New Jersey, New York, Delaware, and Pennsylvania. Contact: Mr. Jack Lyons.
Scale indicators2 records
Recent moves5 records
Expansion highlights4 records
Ultron Systems competitors and assessment
Company assessmentDirect peers
- Lintec Corporation: Major manufacturer of dicing tapes and protective films for semiconductor wafer processing. Direct competitor to Ultron's silicone-free, UV, and antistatic UV adhesive plastic film product lines.
- DISCO Corporation: Global leader in semiconductor dicing and backgrinding equipment and blades. Directly competes with Ultron's UH110 backgrinding film remover and UH108 backlapping film applicator lines across the same back-end packaging tool category.
- Advanced Dicing Technologies (ADT): Specializes in dicing blades, dicing saws, and precision cut technology for semiconductor wafers. Competes with Ultron in the wafer dicing equipment and consumables space.
- AI Technology: US-based manufacturer of adhesive films and thermal management materials for semiconductor and electronics packaging. Direct competitor to Ultron's adhesive plastic film and tape offerings.
- Tokyo Seimitsu (Accretech): Manufactures dicing saws, backgrinders, CMP, and wafer probers serving the same back-end semiconductor processing customers. Direct competition in dicing and backgrinding equipment.
Broad incumbents
- SCREEN Holdings: Large Japanese semiconductor equipment supplier with a leading position in single-wafer cleaning systems. Overlaps with Ultron's UH117/UH119 wafer cleaning product line as a broader equipment incumbent.
- Nitto Denko Corporation: Diversified global manufacturer of industrial tapes including semiconductor processing tapes and protective films. Overlaps with Ultron's adhesive film portfolio as a broader incumbent across multiple industrial tape categories.
- Mitsubishi Materials: Manufactures dicing blades and precision cutting tools for semiconductor back-end processing. Adjacent competitor to Ultron's tape-mount dicing workflow consumables.
Market position
Strengths4 records
Weaknesses5 records
Competitive moat4 records
Key risks6 records
Key highlights6 records
Customer concentration
Ultron Systems social profiles
Digital presenceUltron Systems compliance and trust
Trust signalCompliance1 record
Ultron Systems financial estimates
Financial estimateRevenue estimate
Valuation estimate
Ultron Systems leadership team
Management profileNumber of profiles
Ultron Systems subsidiaries and ownership
Company hierarchySubsidiaries2 records
Ultron Systems funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
Ultron Systems M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about Ultron Systems
What does Ultron Systems do?
Ultron Systems manufactures and sells precision semiconductor assembly equipment in both manual and fully-automatic models — including wafer/frame film mounters, UV curing systems, die-matrix expanders, wafer cleaning systems, backgrinding protective-film removers, and backlapping film applicators. The company also produces semiconductor processing materials such as silicone-free, standard UV, and antistatic UV adhesive plastic films, grip rings, film frames, shippers, separator tools, and magazines used in dicing, backgrinding, curing, and die-separation processes.
Is Ultron Systems a public or private company?
Ultron Systems is a private company. It is classified as founder individual operated bootstrapped and is currently operating.
When was Ultron Systems founded?
Ultron Systems was founded in 1982. It employs 11 to 50 people.
Where is Ultron Systems based?
Ultron Systems is headquartered in Moorpark, United States, in the North America region.
How does Ultron Systems make money?
Two revenue lines are on record. Semiconductor Assembly Equipment is the primary driver. The others are processing Materials.
Who are Ultron Systems's main competitors?
Direct peers on record are Lintec Corporation, DISCO Corporation, Advanced Dicing Technologies (ADT), AI Technology and Tokyo Seimitsu (Accretech). Broad incumbents are SCREEN Holdings, Nitto Denko Corporation and Mitsubishi Materials.
Does Ultron Systems have an API?
No public API is recorded for Ultron Systems.
What industry is Ultron Systems in?
Ultron Systems's product category is Semiconductor Assembly Equipment. Its primary akta.pro industry code is HDAHAEAL, Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB), with a secondary code of HDAHAGAM, Packaging Materials & Chemicals (Underfill/Mold Compound/Die Attach/Solders). Its NAICS code is 333242 and its SIC code is 3674.