Leti

Name

Leti

Legal name

CEA-Leti (Laboratoire d'électronique et de technologie de l'information)

Website

https://leti-cea.fr

Company type

Private

Founded year

1967

Operating status

Operating

Ownership category

akta.pro rank

Headquarters

HQ city

Grenoble

HQ country

France

HQ region

Europe

Offices2 records

Markets served

Revenue model

1. Public Research Funding: CEA-Leti receives base funding from the French government as part of the CEA (Commissariat à l'Énergie Atomique et aux Énergies Alternatives) national research organization. Additional funding comes from European programs including Chips JU, France 2030, and various Horizon Europe projects.
2. Industrial R&D Contracts: Collaborative research contracts with industrial partners including technology development, custom prototyping, and applied research projects. Partners include GlobalFoundries, STMicroelectronics, Intel, Applied Materials, Soitec, Valeo, Schneider Electric, and others.
3. Technology Licensing and Transfer: Technology transfer through licensing of patents and proprietary technologies to industrial partners, and creation of spin-off companies commercializing CEA-Leti innovations.

Go-to-market motion1 record

Distribution channels7 records

Marketing channels10 records

Core offering

Leti (CEA-Leti) is a French government-funded research institute operating under the French Alternative Energies and Atomic Energy Commission (CEA) that performs applied research in microelectronics, nanotechnology, MEMS, photonics, and semiconductor technologies. It licenses patents and IP, provides R&D services, transfers technology to industry partners, and pilots innovations from concept through low-volume production for industrial customers in semiconductor, healthcare, automotive, and aerospace sectors.

Product overview

CEA-Leti is a technology research institute specializing in micro and nanotechnologies for semiconductor, healthcare, and communication systems. The institute operates a platform-plus-infrastructure model consisting of core technology products (FeRAM, FD-SOI, quantum cascade lasers, microLED, silicon photonics, microfluidics, 3D integration) supported by specialized research platforms (Clinatec, 300mm cleanroom, PREVAIL TEF, FAMES Pilot Line, SPINfab). The portfolio addresses industrial markets including IoT, HPC, medical devices, transport, security, telecom, defense, and smart cities through both direct technology licensing and collaborative R&D services.

Differentiator

Problem solved

Functional benefit

Quantifiable outcome

• FeRAM 22nm technology demonstrated for Edge AI memory applications
• +6 more outcomes

Named customers12 records

Segments1 record

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

AI capability13 records

Feature12 records

Partnerships

37 partnerships are on record, tiered core, major and minor.

• GlobalFoundriescoreStrategic or Co-development PartnerLong-standing collaboration on FD-SOI technology spanning over two decades. GF participates as end user in the FAMES Pilot Line advancing European innovation in fully depleted silicon on insulator technology, reinforcing Europe's leadership in energy-efficient, sovereign semiconductors.
• STMicroelectronicscoreStrategic or Co-development PartnerMultiple collaborative research projects including 3D sequential integration for RF front-ends, hybrid bonding with nanocrystalline copper, microLED and organic photodetector co-integration, and health/wellness technologies including continuous sweat monitoring wearable system.
• Fraunhofer-GesellschaftcoreStrategic or Co-development PartnerOne of four founding partners of PREVAIL consortium (European TEF for Edge AI HW). German RTO providing complementary capabilities in semiconductor research and technology development across European ecosystem.
• imeccoreStrategic or Co-development PartnerOne of four founding partners of PREVAIL consortium. Belgian RTO contributing advanced semiconductor research capabilities to European Edge AI hardware testing and experimentation facility.
• VTTcoreStrategic or Co-development PartnerOne of four founding partners of PREVAIL consortium. Finnish RTO completing the European network of major research and technology organizations for Edge AI hardware innovation.
• WooptixcoreTechnology or IntegrationInstallation of first production Phemet® metrology system at CEA-Leti in May 2026. Validates Phemet® technology in industrial cleanroom environment and explores new use cases for 300mm wafer metrology, nanotopography, and advanced packaging processes.
• LynredcoreStrategic or Co-development PartnerNearly 40-year partnership dating back to Lynred's creation from CEA-Leti infrared detector technology. Collaboration continues with Lynred's new Campus production site, strengthening French and European sovereignty in infrared detection.
• MBDAmajorStrategic or Co-development PartnerGeneral collaboration agreement since 2016 for defense technology innovation. Collaborative work focuses on components developed with CEA-Leti, structured by framework agreement facilitating exchanges between the two defense technology actors.
• Schneider ElectricmajorStrategic or Co-development PartnerSix-year cybersecurity collaboration renewed for additional three years. Joint laboratory advancing hardware and system cybersecurity, with focus on secure connected systems for energy management and industrial applications.
• SoiteccoreStrategic or Co-development PartnerStrategic partnership for FD-SOI cybersecurity applications leveraging intrinsic physical attack resistance. Inaugurated dedicated collaboration zone within CEA-Leti cleanrooms. Additional collaboration on automotive cybersecurity and FD-SOI technology advancement.
• ValeomajorStrategic or Co-development PartnerFour-year renewed partnership for decarbonized, autonomous, and connected mobility. Combines CEA's research capabilities with Valeo's automotive technology leadership to anticipate next-generation automotive innovations.
• Applied MaterialsmajorStrategic or Co-development PartnerExpanded joint laboratory to accelerate specialty semiconductor innovation. Multi-year agreement developing materials engineering solutions for AI data center infrastructure challenges and emerging specialty chip applications.
• Lam ResearchmajorStrategic or Co-development PartnerMulti-year agreement expanding collaboration on specialty technology fabrication. Focus on new materials and processes for manufacturing energy-efficient specialty devices including microLED and MEMS applications.
• IntelmajorTechnology or IntegrationCollaboration announced October 2020 to advance chip design through 3D packaging technologies. CEA-Leti contributes advanced packaging expertise to Intel's semiconductor development.
• SNCFmajorStrategic or Co-development PartnerFive-year renewable framework cooperation agreement signed at Vivatech. Aims to accelerate railway innovation for performant, decarbonized, and responsible mobility through technology collaboration.
• SanofimajorStrategic or Co-development PartnerPartnership on Lipidots® nanoparticle technology for universal flu vaccine development in collaboration with IAB (Institut Albert Bonniot). CEA-Leti contributes nanoparticle expertise for improved immune response to vaccine antigens.
• NcodiNmajorStrategic or Co-development PartnerPartnership to industrialize 300mm silicon photonics for bandwidth-hungry AI interconnects. Kick-off coincided with FAMES Pilot Line launch, advancing European photonic integrated circuit capabilities.
• PSMCmajorStrategic or Co-development PartnerCollaboration with CEA-List to integrate RISC-V technology and MicroLED silicon photonics into 3D stacking and interposer solutions for next-generation AI applications.
• CEZAMAT-WUTminorStrategic or Co-development PartnerStrategic partnership reinforced with MoU signing to foster knowledge exchange, joint R&D projects, and talent development. Advances toward more integrated, resilient, and competitive European ecosystem.
• InfiplastminorStrategic or Co-development PartnerPartnership leading new microfluidics sector in Auvergne-Rhône-Alpes region. CEA-Leti and Infiplast create shared industrialization platform for microfluidic chips, addressing national sovereignty in microfluidics technology.
• C2MIminorStrategic or Co-development PartnerAlliance to strengthen Franco-Canadian collaboration in advanced semiconductor technologies. Positions both organizations for enhanced North American and European technology development cooperation.
• AlediacoreTechnology or IntegrationCEA-Leti spin-off launched industrial production of 3D nanowire microLED technology (FlexiNova product). First worldwide at-scale manufacturing platform for microLED with advantages for display manufacturers. Long-term collaboration with CEA-Leti on technology development.
• Scintil PhotonicscoreTechnology or IntegrationCEA-Leti spin-off developing silicon photonic integrated circuits for AI data center optical communication. Raised 50M€ from investors. Technology based on CEA-Leti research.
• Moon PhotonicscoreTechnology or IntegrationCEA-Leti spin-off launched January 2026 designing photodetectors with record-breaking sensitivity. First generation infrared detection components launching 2027, quantum applications planned for 2030.
• iNGagecoreTechnology or IntegrationCEA-Leti spin-off developing high-performance inertial measurement units (M&NEMS technology). Raised 6M€ funding. CEA-Leti accelerating industrialization through joint lab following spin-off creation in February 2025 from Magellan accelerator program.
• nawu diagnosticscoreTechnology or IntegrationCEA-Leti spin-off developing portable pathogen analysis from exhaled breath for livestock respiratory disease diagnosis in 30 minutes. Technology based on CEA-Leti microfluidics expertise.
• SiquancecoreTechnology or IntegrationCEA and CNRS spin-off launched November 2022 for quantum computing development using microelectronics technologies and European semiconductor manufacturing capabilities. Led by Maud Vinet. Advances French and European quantum sovereignty.
• KalraycoreTechnology or IntegrationCEA-Leti spin-off developing massively parallel MPPA processors (256-1024 cores) for video encoding, image analysis, 3D/AR, and defense applications. 40+ patents including 20 from Leti/List on programming tools and network-on-chip.
• DiabeloopcoreTechnology or IntegrationCEA-Leti spin-off developing artificial pancreas for Type 1 diabetes combining continuous glucose sensor and miniature patch pump. Revolutionary solution for diabetic patient glucose management.
• AryballecoreTechnology or IntegrationCEA-Leti spin-off developing universal electronic nose combining biochemical sensors, signal processing, and databases. 50+ identified applications in food, cosmetics, environment, and smart home. Joint lab with CEA-Leti for technology advancement.
• eLichenscoreTechnology or IntegrationCEA-Leti spin-off developing miniaturized NDIR gas sensors (CO2 and CH4) 6x smaller and 10x less power than competitors. Joint lab maintaining and expanding technological lead. 30+ patent portfolio.
• University Grenoble Alpes (UGA)coreStrategic or Co-development PartnerAcademic partner in multiple CEA-Leti research projects including bipolar disorder AI diagnosis using EEG and fNIRS, AUDACE brain-computer interface program, and quantum technologies through QuCube ERC Synergy Grant.
• CHU Grenoble AlpescoreStrategic or Co-development PartnerClinical partner in medical technology research including bipolar disorder AI diagnosis project combining neuroimaging and artificial intelligence for psychiatric diagnostic assistance.
• CNRScoreStrategic or Co-development PartnerResearch partner in QuCube quantum processor project and Siquance quantum computing spin-off. Partner in advanced research across multiple CEA-Leti technology domains.
• CEA-ListcoreStrategic or Co-development PartnerSister CEA institute collaborating on PSMC partnership for RISC-V and MicroLED silicon photonics integration into 3D stacking for AI. Joint participation in hardware cybersecurity AUDACE program.
• OrangemajorStrategic or Co-development PartnerLaunching world-class joint research laboratory on semantic communications, a major technological breakthrough for networks in the AI era. CEA and Orange collaboration advancing next-generation communication technologies.
• Mistral AImajorStrategic or Co-development PartnerRenewed agreement for sovereign and secure generative AI deployment through Maïa platform serving 22,000 CEA employees. CEA and Mistral collaborating on latest generation models with full security and participatory development approach.

Scale indicators15 records

Recent moves15 records

Expansion highlights6 records

Direct peers

• imec: Belgium-based semiconductor RTO and CEA-Leti's closest European peer. Both operate 300mm pilot lines, run coordinated European programs (PREVAIL TEF, EU Chips Act), serve overlapping industrial partners (GlobalFoundries, Applied Materials), and pursue advanced nodes in logic, memory, photonics, and 3D integration.
• Fraunhofer-Gesellschaft: Germany's applied research network and a co-founding partner of PREVAIL TEF alongside CEA-Leti. Fraunhofer institutes (e.g., IZM, IPMS, AISEC) cover microelectronics, packaging, and cybersecurity — directly comparable domains to Leti's portfolio.
• VTT Technical Research Centre of Finland: Finland's RTO and fourth PREVAIL consortium partner. VTT operates 300mm cleanroom capabilities, pursues microelectronics and quantum technologies, and works with European semiconductor partners — directly comparable scope and structure to CEA-Leti.
• CSEM: Swiss RTO specializing in micro/nanotechnologies, MEMS, photonics, and systems engineering. Comparable mid-sized European applied research model with industry partnerships, technology transfer, and spin-off activity similar to CEA-Leti.

Regional players

• ITRI (Industrial Technology Research Institute): Taiwan's leading applied research organization with deep semiconductor, MEMS, and electronics programs. Comparable institutional R&D model with industry spin-offs, but serves Asian markets and partners rather than competing with Leti in Europe.
• Albany NanoTech (NY Creates): US public-private semiconductor R&D center with 300mm pilot line capabilities. Operates a similar model of public infrastructure serving industrial partners, but is US-based with a different partner ecosystem and government funding structure.

Broad incumbents

• TSMC Research: Global leading-edge foundry with extensive internal R&D. While a commercial manufacturer rather than a public institute, TSMC sets the leading-edge node benchmark against which Leti's FD-SOI/22nm positioning is measured.

Others

• Applied Materials: CEA-Leti's joint laboratory partner for specialty semiconductor innovation and materials engineering. Comparable advanced semiconductor process technology development, though as a commercial equipment maker rather than a public research institute.
• GlobalFoundries: FD-SOI manufacturing partner within the FAMES Pilot Line and Leti's long-standing industrial R&D counterpart. Comparable involvement in specialty semiconductor process development, though as a commercial foundry.

Emerging players

• Kalray: CEA-Leti spin-off developing massively parallel MPPA processors for AI, video, and defense. Comparable technology lineage but smaller, commercial-scale operating model — useful proxy for the value-creation potential of Leti spin-offs.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat6 records

Key risks6 records

Key highlights6 records

Customer concentration

• Xx.com/cea_leti
• YouTubeyoutube.com/user/CEALeti
• LinkedInlinkedin.com/company/leti

Revenue estimate

Valuation estimate

Number of profiles

Funding overview

Funding rounds

Investors

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M&A

Investments

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Frequently asked questions about Leti