What TASK does

TASK Micro-Electronics Inc. is a privately held, founder-led Canadian contract manufacturer specializing in miniaturized and ruggedized electronics packaging. Founded in 1987 by Doug Bellevue in Kirkland, Quebec, the company operates a single 41,000 sq. ft. state-of-the-art facility with controlled clean rooms where it performs all manufacturing, engineering, sales, and administrative functions under one roof. The company sells custom microelectronics manufacturing services rather than off-the-shelf products, with a vertically segmented go-to-market targeting medical electronics (its primary vertical), high-end industrial, defense and security, aerospace and avionics, oil and gas, and optics and sensing.

Core capabilities are organized around three service pillars. Design Support covers microelectronics design, schematic review, miniaturization, and Design for Manufacturability (DFx). Validation and Pre-Production covers R&D, feasibility, prototyping, and qualification documentation including Device Master Record (DMR), Device History Record (DHR), and FMEA support. Manufacturing spans wire bonding (thin to heavy gauge, gold and aluminum, ball-stitch, wedge, automatic stud bumping, coining, deep access), die placement and attachment with placement accuracy down to 10 µm across substrates including FR4, flex, ceramic, glass, IMS, Kapton, and AlN, complex multi-process assemblies (chip-on-flip-chip, chip-on-chip, 3D stacked dies, flex-on-ceramic hybrids), thick-film printing on 96% Al2O3 alumina substrates, fully automated SMT lines with 01005 placement, laser trimming to 0.5% tolerance, encapsulation (globtop, dam-and-fill, flood-fill), laser marking, dicing, and electrical testing.

Revenue mechanics are quote-based: TASK prices work per customer specification rather than via published catalogs or SaaS subscriptions. The company is qualified to demanding standards relevant to its regulated end markets — AS9100D for aerospace, ISO 13485:2016 for medical devices, ISO 9001:2015 for general manufacturing, and MIL-STD-883 / IPC-A-610 / IPC-A-600 / IPC-6013 for defense and electronics acceptability — giving it access to qualification-intensive programs in Class III implants, avionics, and ruggedized defense electronics. Distribution is direct B2B; the company maintains a corporate website (English and French) and accepts inquiries via [email protected], with no resellers or distributors. There is no disclosed external investment, parent company, or recapitalization event.

Name

TASK

Legal name

Task Micro-Electronics Inc.

Website

https://taskmicro.com

Company type

Private

Founded year

1987

Operating status

Operating

Headcount range

11–50 employees

Short description

TASK Micro-Electronics Inc. is a privately held Canadian contract manufacturer specializing in miniaturized and ruggedized custom electronics packaging, serving medical, aerospace, defense, industrial, oil & gas, and optics customers from its Kirkland, Quebec facility.

Ownership category

akta.pro rank

Product category

Microelectronics Contract Manufacturing

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418), Semiconductor and Other Electronic Component Manufacturing (33441)

SIC

Electronic Components, Nec (3679)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), System-in-Package (SiP) & Module Assembly (RF modules, power modules) (HDAHADAI), Embedded & HMI Electronics Manufacturing (Industrial PCs, HMIs, Panel PCs) (IMAGAGAD)

Keywords

• Microelectronics contract manufacturing
• Miniaturized electronics packaging
• Wire bonding services
• Die placement assembly
• Ruggedized circuit manufacturing

Headquarters

HQ city

Montréal

HQ country

Canada

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Infrastructure, Operations, Technology or R&D, Supply Chain

Distribution channels1 record

Marketing channels3 records

Core offering

TASK Micro-Electronics Inc. is a B2B contract manufacturer specializing in miniaturized and ruggedized electronics packaging. The company provides microelectronics design support, validation and pre-production services, and full-scale manufacturing capabilities including wire bonding, die placement, thick film printing, SMT assembly, laser trimming, and encapsulation across substrates such as FR4, Flex, Ceramic, Glass, IMS, Kapton, and AlN.

Product overview

TASK Micro-Electronics Inc. is a manufacturing and design partner specializing in miniaturized and ruggedized electronics packaging. The company offers a portfolio of services organized into three main pillars: Design Support (microelectronics design, schematic review, miniaturization, and Design for Manufacturability), Validation and Pre-Production (R&D, feasibility, prototyping, and validation), and Manufacturing (wire bonding, die placement, SMT, thick film printing, laser trimming, encapsulation, and testing). TASK supports multiple market verticals including Medical Electronics, High End Industrial, Defense and Security, Aerospace and Avionics, Oil and Gas, and Optics and Sensing. The company operates from a 41,000 sq. ft. facility in Kirkland, Quebec, Canada with all manufacturing performed in-house.

Differentiator

Problem solved

Functional benefit

Products and services

• Microelectronics Design Support Product engineering services to help customers miniaturize or ruggedize their designs with innovative packaging solutions, including microelectronics design and engineering, schematic review, miniaturization, and Design for Manufacturability (DFx) for OEMs across medical, defense, aerospace, and industrial sectors.
• Validation and Pre-Production Services R&D and feasibility phase services including initial prototyping and validation, with Device Master Record (DMR), Device History Record (DHR), FMEA documentation, and process/software validation for customers developing microelectronic devices.
• Medical Electronics Assembly Microelectronics assembly services for the medical industry, including Class III implantable products, robotics, surgical navigation devices, continuous glucose monitoring systems, and hearing aids. TASK is qualified under ISO 13485:2016 to support medical device manufacturers.
• Defense and Security Electronics Assembly Manufacturing of ruggedized and reliable custom microelectronic devices for defense and security markets, including blast impact sensors, designed to operate reliably under extreme conditions.
• Aerospace and Avionics Assembly Manufacturing of hybrid microelectronics assemblies, accelerometers, lighting, and optical encoders for the avionics industry, supported by AS9100D certification.
• High End Industrial Assembly Microelectronics assembly services for high-end industrial applications including LIDAR systems, sensor technologies, thick film industrial sensors, and accelerometers, meeting high reliability standards.
• Oil and Gas Electronics Microelectronics manufacturing for downhole drilling applications and high temperature projects in the oil and gas industry, with high reliability technology suited for harsh environments.
• Optics and Sensing Packaging Packaging solutions for the sensor market, including sensor packaging, multi-module lens assemblies, borescope inspection tools, and optics and sensing applications requiring miniaturization.
• Microelectronics Manufacturing Services Full-scale in-house microelectronics manufacturing services encompassing wire bonding (thin to heavy gauge), die placement (10 µm accuracy), complex multi-process assemblies and 3D chip stacking, thick film printing on 96% Al2O3 substrates, SMT assembly (01005 components), laser trimming (0.5% tolerance), encapsulation (globtop, dam & fill), laser marking, and electrical testing for OEM customers.

Segments6 records

Ideal customer profiles6 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Scale indicators4 records

Recent moves5 records

Expansion highlights4 records

Direct peers

• Stellar Microelectronics: US-based microelectronics contract manufacturer offering hybrid microcircuits, chip-and-wire assembly, and SMT for medical, aerospace and defense — directly comparable to TASK's wire bonding, die placement, and hybrid thick-film service set.
• Quantic Electronics: Holding group of specialty microelectronics companies (including hybrid microcircuits and ruggedized packaging), serving aerospace, defense, and medical markets — overlaps with TASK across hybrid assemblies, wire bonding and ruggedized packaging.
• RJR Technologies: Microelectronics assembly services provider focused on hybrid microcircuits, chip-on-board, and wire bonding for medical and industrial OEMs — directly comparable to TASK's die placement, wire bonding, and validation offerings.
• StratEdge Corporation: Specializes in high-frequency and high-reliability microelectronics packaging for defense, aerospace and telecommunications — comparable niche of ruggedized/advanced packaging for demanding environments.
• American Micro Products: Microelectronics contract manufacturer offering hybrid circuits, chip-and-wire, and SMT assemblies for medical, aerospace, and industrial customers — overlaps with TASK across hybrid thick-film and chip-on-board work.

Broad incumbents

• Benchmark Electronics: Global EMS provider with significant medical, aerospace and defense microelectronics capabilities — broader portfolio but competes with TASK for regulated microelectronics assembly programs.
• Celestica: Canadian-headquartered global EMS serving aerospace, defense, healthcare and industrial — directly comparable geography and overlap with TASK's regulated end-markets, though at vastly larger scale.
• Sanmina: Global EMS with microelectronics, PCB assembly and testing capabilities across medical, aerospace/defense and industrial — competes with TASK on complex microelectronics assembly at much greater scale.
• Amkor Technology: One of the world's largest OSAT providers of semiconductor packaging and test, including advanced packaging (flip chip, 3D, fan-out) — overlaps with TASK's packaging services at much higher volume and capital scale.
• Jabil: Global EMS/ODM with regulated microelectronics assembly in healthcare, aerospace and defense — broader portfolio but competing for the same specialized program work TASK targets.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat4 records

Key risks6 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/watch?v=thUBCKOyjmI
• LinkedInlinkedin.com/company/task-micro-electronics-inc.

Compliance8 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about TASK