StratEdge
StratEdge designs, manufactures, and assembles high-performance ceramic semiconductor packages for GaN, GaAs, and SiC devices operating from DC to 63+ GHz, serving defense, aerospace, satellite, telecom/5G, and harsh-environment markets globally.
- Company typePrivate
- Founded1992
- HeadquartersSantee, United States
- Headcount11–50
- GTM typeB2B
- OfferingHardware or Manufacturing
What StratEdge does
StratEdge Corporation, founded in 1992 and headquartered in Poway, California, designs, manufactures, and provides assembly services for high-performance semiconductor packages operating from DC to 63+ GHz. The company specializes in packaging for compound semiconductor devices (GaAs, GaN, SiC) using proprietary post-fired ceramic technology and patented electrical transition designs that deliver exceptionally low electrical losses and dimensional stability at millimeter-wave frequencies. Manufacturing and assembly operations run from a 12,500 sq ft ISO 9001:2015 certified, ITAR-registered facility in Santee, California, with a Class 1000 cleanroom supporting die attach, wire and ribbon bonding, and lid sealing. StratEdge's packages have been flight-qualified into NASA Mars rover missions (Spirit, Opportunity, Curiosity, Perseverance) since 2003, providing multi-decade field-reliability evidence that anchors its defense and aerospace positioning.
The product portfolio spans post-fired ceramic packages, molded ceramic packages (including ceramic QFNs), leaded laminate packages (LL series), surface mount packages (SMK/SMX), glass sidewall packages, and gold plated mounting tabs, complemented by assembly and test services including AuSn eutectic die attach achieving bond line thickness under 6 micrometers and automated void-free attachment rates above 96%. The company generates revenue through two streams: hardware sales of standard and custom semiconductor packages (quote-based, not publicly disclosed) and professional services for chip assembly and test. StratEdge sells directly to enterprise customers from Poway and through a network of manufacturer's representatives covering the US, Japan, Singapore, Italy, France, Israel, and China, with off-the-shelf packages additionally available via Amazon.com. Primary markets served include telecom/5G, defense, aerospace, satellite, test and measurement, automotive, clean energy, and harsh-environment applications.
The company is privately held with no disclosed external investors, operates with 11-50 employees of which nearly half have 15+ year tenure, and has been led by President and CEO Tim Going since 2004. Certifications include ISO 9001:2015 (originally certified March 2003, cyclically re-certified), MIL Std 45208 compliance, and ITAR registration, and the company has received IMAPS Founders, IMAPS Leadership, IMAPS Corporate Recognition, and BAE Systems Partner 2 Win Gold Tier Awards in the 2024-2026 period.
StratEdge firmographics
Firmographics- Name
- StratEdge
- Legal name
- StratEdge Corporation
- Website
- https://stratedge.com
- Company type
- Private
- Founded year
- 1992
- Operating status
- Operating
- Headcount range
- 11–50 employees
- Short description
- StratEdge designs, manufactures, and assembles high-performance ceramic semiconductor packages for GaN, GaAs, and SiC devices operating from DC to 63+ GHz, serving defense, aerospace, satellite, telecom/5G, and harsh-environment markets globally.
- Ownership category
- akta.pro rank
StratEdge industry classification
Industry- Product category
- Semiconductor Packaging
- NAICS
- Semiconductor and Other Electronic Component Manufacturing (33441)
- SIC
- Semiconductors & Related Devices (3674), Electronic Components, Nec (3679)
- akta.pro primary industry
- Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)
- akta.pro secondary industry
- Leadframes & Package Interconnect Materials (HDAHADAF)
Keywords
Where StratEdge is headquartered
LocationHeadquarters
- HQ city
- Santee
- HQ country
- United States
- HQ region
- North America
Offices11 records
Markets served
StratEdge business model
Business model- GTM type
- B2B
- Offering type
- Hardware or Manufacturing
- Cost components
- Personnel, Operations, Infrastructure, Technology or R&D, Marketing or Sales, Supply Chain
Revenue model
- Semiconductor Package Sales: Sale of high-performance semiconductor packages operating from DC to 63+ GHz, including post-fired ceramic, molded ceramic, ceramic QFN, and leaded laminate packages for GaN, GaAs, and SiC devices.
- Assembly and Test Services: Chip assembly and test services including eutectic die attach, wire bonding, ribbon bonding, lid sealing, and post-assembly testing using HP 8510C network analyzer up to 50 GHz.
Go-to-market motion1 record
Distribution channels3 records
Marketing channels4 records
StratEdge product offering
Product offeringCore offering
StratEdge designs, manufactures, and provides assembly and test services for high-performance semiconductor packages operating from DC to 63+ GHz, including post-fired ceramic, molded ceramic, ceramic QFN, and leaded laminate (LL) package families tailored for GaAs, GaN, and SiC compound-semiconductor devices. Offerings span standard package outlines, custom designs, gold-plated mounting tabs, and complete chip-on-board assembly including eutectic die attach, wire/ribbon bonding, and hermetic lid sealing in an ISO 9001:2015-certified Class 1000 cleanroom. Target applications include telecom/5G infrastructure, VSAT, broadband wireless, satellite, defense, test and measurement, automotive radar, clean energy, and down-hole harsh-environment electronics.
Product overview
StratEdge designs, manufactures, and provides assembly services for a complete line of high-performance semiconductor packages operating from DC to 63+ GHz. The portfolio includes three main package technologies: post-fired ceramic, molded ceramic (including ceramic QFNs), and laminate packages (LL Series), along with specialized product series (SE, SMK/SMX, LPA, MC, High Speed Digital, Glass Sidewall) and gold plated tabs. All packages are lead-free and most meet RoHS and WEEE standards. The company specializes in packages for demanding GaAs, GaN, and SiC compound semiconductor devices serving telecom/5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and harsh-environment applications.
Differentiator
Problem solved
Functional benefit
Products and services
- Post-Fired Ceramic Semiconductor Packages High-frequency semiconductor packages using hardened post-fired ceramic that does not shrink, providing complete dimensional stability and precise mechanical tolerances, with patented electrical transition designs for exceptionally low electrical losses operating from DC to 63+ GHz. Sold to engineers and OEMs designing GaAs, GaN, and SiC devices for telecom/5G, defense, aerospace, and satellite applications.
- Molded Ceramic (MC Series) Packages Molded ceramic packages with glass sidewall technology in standard open-tooled configurations, all MIL-STD hermetic, for RF and microwave applications up to 18 GHz, with optional CMC bases for power applications. Available in over 200 standard outlines.
- Ceramic QFN Hermetic Packages Hermetic air cavity ceramic QFN packages offering performance and reliability for applications where standard plastic QFNs cannot meet requirements, available in standard outlines from 3x3 mm to 8x8 mm.
- LL Series Leaded Laminate Packages High-power leaded laminate copper-moly-copper (CMC) base packages with a 1:3:1 CMC ratio for GaN, GaAs, and SiC devices operating up to 63 GHz, providing enhanced thermal dissipation and matched CTE for alumina-based materials.
- LPA Series Leaded Power Amplifier Packages Ceramic leaded packages for power amplifiers used in point-to-point, point-to-multipoint, and VSAT applications, featuring copper composite bases for thermal dissipation and supporting DC to 28 GHz operation.
- SMK/SMX Surface Mount Packages Surface mount ceramic packages for use at frequencies as high as 26 GHz with wideband electrical performance, featuring copper composite bases and liquid crystal polymer lids sealed with B-stage epoxy; available in multiple sizes and lead counts and customizable for switch MMICs and similar devices.
- SE Series (SE20 / SE50) Semiconductor Packages High-performance packages including SE20 and SE50 series with industry-leading low electrical loss design for compound semiconductors operating at frequencies as high as 63+ GHz; proven in NASA Mars rover missions.
- High Speed Digital Semiconductor Packages Semiconductor packages for high-speed digital applications supporting OC-48, OC-192, and OC-768, mixed signal, and broadband wireless, with speeds in excess of 40 GB/s.
- Glass Sidewall (Alumina/Glass) Packages Small outline thermally enhanced alumina/glass sidewall packages for power semiconductors using a glass-to-metal seal process with gold germanium brazing, handling temperatures up to 360°C for silicon, SiC, GaN, and compound semiconductors in harsh-environment applications.
- Gold Plated Mounting Tabs Gold plated mounting tabs for GaN and GaAs devices that support eutectic die attachment using gold-tin (AuSn) and gold-silicon (AuSi) for chip-on-board and high-frequency, high-power, high-reliability device assembly.
- Semiconductor Assembly and Test Services Complete assembly and test services performed in an ISO 9001:2015 certified Class 1000 cleanroom, including eutectic and epoxy die attach, automated wire and ribbon bonding, AuSn solder die attach achieving bond line thickness under 6 micrometers, lid sealing, and post-assembly testing using an HP 8510C network analyzer up to 50 GHz, for compound-semiconductor and silicon devices.
Quantifiable outcome
- Operating frequency range from DC to 63+ GHz with exceptionally low electrical losses
- +4 more outcomes
Companies that use StratEdge
Customer profileNamed customers3 records
Segments7 records
Ideal customer profiles4 records
StratEdge technology and API
TechnologyTechnology focussed Yes
API detail
- Has API
- No
- API docs
- API detail
Core technology
AI maturity
App detail
Feature5 records
StratEdge partnerships and signals
Strategic signalPartnerships
Ten partnerships are on record, tiered standard.
- Coastal RF SystemsstandardManufacturer's representative covering Southern California territory. Located at 5716 Corsa Ave., Suite 207, Westlake Village, CA 91362. Phone: 866 389 9099.
- Vitale EngineeringstandardManufacturer's representative covering Upstate New York territory. Located at 429 N Franklin St, Unit 105, Syracuse, NY 13204.
- Advanced Technology MarketingstandardManufacturer's representative covering New England territory. Located at 11 Trafalgar Square, Suite 203, Nashua, NH 03063.
- PTM CorporationstandardManufacturer's representative covering Japan territory. Located at Palm View Bld 3F, 1-6-15 Nakayama, Midori-ku, Yokohama-City, Kanagawa 226-0019, Japan.
- Meds Technologies Pte., Ltd.standardManufacturer's representative covering Singapore territory. Located at Blk. 5012 Ang Mo Kio Avenue 5, #04-01 Techplace II, Singapore 569879.
- Nexos Electronic Systems SRLstandardManufacturer's representative covering Italy territory. Located at Via Valsesia 47, Roma, Italy 00141.
- 3F EnergystandardManufacturer's representative covering France territory. Located at 24 rue du Coteau, Chaville, 92370, France.
- F.E.M.C. Communications Ltd.standardManufacturer's representative covering Israel territory. Located at PO Box 62, 20 Yoni Netanyahu Street, Givat Shuimuel 54424, Israel.
- Beijing TeanShek Technologies Co., Ltd.standardManufacturer's representative covering China territory. Located at Room 209, Building 10, No.12 Changsheng Road, Changping District, Beijing, China.
- Elecsys, LLCstandardWorld-wide distributor featuring StratEdge high-performance semiconductor packages at IEEE COMCAS in Israel. Elecsys distributes semiconductor manufacturing materials, microwave components, ceramic packages, and test instrumentation.
Scale indicators8 records
Recent moves9 records
Expansion highlights5 records
StratEdge competitors and assessment
Company assessmentDirect peers
- Q-Tech Corporation: Specialty microelectronics packaging company focused on space-grade, high-reliability quartz and hybrid microcircuits for aerospace and defense. Directly comparable to StratEdge in mission-critical space and defense packaging, where both compete for prime contractor programs.
- Quik-Pak: A division of Promex Industries offering IC packaging and assembly services for RF, microwave, and MEMS devices. Highly directly comparable to StratEdge's Assembly Services Division; StratEdge's VP of Global Sales Casey Krawiec was previously Director of Sales and Marketing at Quik-Pak.
- Hermetic Solutions Group: Provider of hermetic microelectronic packaging and interconnect solutions serving defense, aerospace, and space markets. Directly comparable to StratEdge's hermetic ceramic QFN and leaded ceramic product families.
- CoorsTek: Specialty ceramic manufacturer producing ceramic packages and substrates for high-frequency and high-reliability semiconductor applications. Closest direct competitor in ceramic packaging for RF, GaN, and high-power compound semiconductor devices.
- SCHOTT Electronic Packaging: Subsidiary of SCHOTT AG manufacturing hermetic glass-to-metal and ceramic feedthroughs and packages for electronic packaging. Closely comparable to StratEdge in hermetic and ceramic packaging for high-reliability/defense applications.
Broad incumbents
- JCET Group: Leading Chinese-headquartered OSAT offering advanced packaging and test services, including for RF and power compound semiconductors. Broad incumbent with overlap in StratEdge's served device categories.
- Amkor Technology: One of the world's largest OSATs providing advanced package assembly and test for semiconductor and high-frequency device customers. A broad incumbent that competes for packaging of GaN, GaAs, and SiC devices across similar end markets.
- Kyocera Corporation: Global Japanese electronics conglomerate with a large ceramic components and semiconductor packaging portfolio (organic packages, ceramic substrates). A much broader incumbent that overlaps with StratEdge in ceramic packages for compound semiconductors (Casey Krawiec began his career at Kyocera).
- ASE Technology Holding: World's largest OSAT providing a broad range of advanced packaging, including RF and high-frequency module packaging. Competes for high-volume GaN/SiC device packaging programs that StratEdge's customers may also outsource.
Emerging players
- CeramTec: Specialty supplier of advanced ceramic components and substrates, including for semiconductor packaging applications. More material/component focused than StratEdge, but overlapping in high-reliability ceramic packaging markets.
Market position
Strengths5 records
Weaknesses5 records
Competitive moat6 records
Key risks6 records
Key highlights7 records
Customer concentration
StratEdge social profiles
Digital presenceStratEdge compliance and trust
Trust signalCompliance3 records
StratEdge financial estimates
Financial estimateRevenue estimate
Valuation estimate
StratEdge leadership team
Management profileNumber of profiles
Profiles3 records
StratEdge funding detail
Funding detailFunding overview
Funding rounds
Investors
Funding detail is available on the Subscription and Enterprise plan.Contact sales →
StratEdge M&A and investment
M&A and investmentM&A
Investments
M&A and investment is available on the Subscription and Enterprise plan.Contact sales →
Frequently asked questions about StratEdge
What does StratEdge do?
StratEdge designs, manufactures, and provides assembly and test services for high-performance semiconductor packages operating from DC to 63+ GHz, including post-fired ceramic, molded ceramic, ceramic QFN, and leaded laminate (LL) package families tailored for GaAs, GaN, and SiC compound-semiconductor devices. Offerings span standard package outlines, custom designs, gold-plated mounting tabs, and complete chip-on-board assembly including eutectic die attach, wire/ribbon bonding, and hermetic lid sealing in an ISO 9001:2015-certified Class 1000 cleanroom. Target applications include telecom/5G infrastructure, VSAT, broadband wireless, satellite, defense, test and measurement, automotive radar, clean energy, and down-hole harsh-environment electronics.
Is StratEdge a public or private company?
StratEdge is a private company. It is classified as founder individual operated bootstrapped and is currently operating.
When was StratEdge founded?
StratEdge was founded in 1992. It employs 11 to 50 people.
Where is StratEdge based?
StratEdge is headquartered in Santee, United States, in the North America region.
How does StratEdge make money?
Two revenue lines are on record. Semiconductor Package Sales are the primary driver. The others are assembly and Test Services.
Who are StratEdge's main competitors?
Direct peers on record are Q-Tech Corporation, Quik-Pak, Hermetic Solutions Group, CoorsTek and SCHOTT Electronic Packaging. Broad incumbents are JCET Group, Amkor Technology, Kyocera Corporation and ASE Technology Holding. CeramTec is listed as an emerging player.
Does StratEdge have an API?
No public API is recorded for StratEdge.
What industry is StratEdge in?
StratEdge's product category is Semiconductor Packaging. Its primary akta.pro industry code is HDAHADAB, Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets), with a secondary code of HDAHADAF, Leadframes & Package Interconnect Materials. Its NAICS code is 33441 and its SIC code is 3674.