What Canon Machinery does

Canon Machinery Inc. (キヤノンマシナリー株式会社) is a wholly-owned subsidiary of Canon Inc., headquartered in Kusatsu, Shiga Prefecture, Japan, and operating since its founding on February 1, 1972. The company operates two reporting segments: a Semiconductor Systems business that designs, manufactures, and sells back-end packaging equipment — including the BESTEM family of die bonders (8-inch and 12-inch wafer platforms), dicing saws, clip bonders, wire-bond inspection systems, inline cure ovens, and proprietary needleless-pickup units for ultra-thin die handling — and an FA Systems business that supplies board coining presses (HPM series), singulation machines (SDM-300T), and custom automation lines for electronics components, medical devices, and Canon Group internal production (e.g., inkjet and toner cartridge lines). Its core technology stack rests on high-precision vision-based recognition and alignment systems, servo-press mechanics, 3D confocal measurement inspection, and a world-first needle-less pickup capability enabling damage-free handling of chips down to 25 micrometers.

Canon Machinery's primary customer base comprises semiconductor back-end manufacturers in Asia Pacific (Japan, Taiwan, China, Korea, Malaysia) requiring ultra-thin chip handling, high bonding accuracy (±7μm 3σ for NAND flash), and high-throughput die bonding (UPH up to 18,000 on BESTEM-D610). Secondary verticals include battery/EV manufacturers (secondary battery assembly lines, particularly in China), electronics component makers (substrate coining, board dicing, FC-BGA and IGBT module assembly), medical/pharmaceutical firms (transparent-body inspection, extreme-environment handling using Canon Group optical technology), and Canon Group internal customers (consumables production lines). The company claims top domestic (Japan) share in the die bonder segment.

The business model centers on one-time capital equipment sales plus recurring after-sale maintenance, spare parts, and custom/OEM engineering services. Pricing is quote-based given the custom-engineered nature of each line, with multi-year service contracts and dedicated support personnel stationed in Japan, Malaysia, and Taiwan. Revenue is concentrated in Asia Pacific, with manufacturing split between Japan (Kusatsu, Moriyama, Hiratsuka) and Malaysia, and sales/customer-support offices in Hsinchu, Shanghai, Seoul, and Subang Jaya. Standalone FY2025 revenue was ¥14,496 million on ~627 employees (785 consolidated), with no public equity listing.

Name

Canon Machinery

Legal name

キヤノンマシナリー株式会社 (Canon Machinery Inc.)

Website

https://machinery.canon

Company type

Private

Founded year

1972

Operating status

Operating

Short description

Canon Machinery Inc., a wholly-owned Canon Inc. subsidiary founded in 1972 in Kusatsu, Japan, designs and manufactures semiconductor back-end packaging equipment — die bonders, dicing saws, inspection systems, and needleless-pickup modules — plus factory automation systems for electronics, medical, battery, and Canon Group customers across Asia Pacific.

Ownership category

akta.pro rank

Product category

Semiconductor Manufacturing Equipment

NAICS

Metalworking Machinery Manufacturing (33351), Navigational, Measuring, Electromedical, and Control Instruments Manufacturing (33451), Other General Purpose Machinery Manufacturing (3339)

SIC

Machine Tools, Metal Cutting Types (3541), Special Industry Machinery, Nec (3559), Industrial Instruments For Measurement, Display, And Control (3823), Printing Trades Machinery & Equipment (3555)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industries

Sheet Metal Machinery (Laser/Plasma/Waterjet Cutting, Punching) (IMAHADAD), Industrial Saws & Cutting Systems (Band/Circular Saws, Abrasive Cutting) (IMAHADAL)

Keywords

• Semiconductor manufacturing equipment
• Die bonding equipment
• Factory automation systems
• Electronic component machinery
• Medical inspection systems

Headquarters

HQ city

Kusatsu

HQ country

Japan

HQ region

Asia

Offices7 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Operations, Technology or R&D, Supply Chain, Infrastructure

Revenue model

1. Manufacturing Equipment Sales (Semiconductor & FA Systems): Canon Machinery designs, manufactures, and sells high-precision production equipment including die bonders, die sorters, inspection systems, coining presses, and dicing saws. Revenue is generated through one-time equipment sales to enterprise customers in semiconductor, automotive, electronics, and medical sectors, with full in-house capability from design through manufacturing and delivery.
2. Maintenance, Support & Spare Parts: After-sale service including preventive maintenance visits, troubleshooting, and spare parts supply for installed equipment. Domestic support is provided from Japan, and overseas service personnel are stationed in Malaysia and Taiwan for day-to-day maintenance of installed systems.
3. Custom/OEM Equipment Development: Bespoke automation and production systems developed to customer specifications, covering single-unit custom machines through large integrated production lines, with proposal, design, manufacturing, commissioning, and after-sales support all handled in-house.

Pricing tiers

Go-to-market motion2 records

Distribution channels1 record

Marketing channels3 records

Core offering

Canon Machinery designs, manufactures, and sells high-precision semiconductor manufacturing equipment and factory automation systems. Its primary offerings include the BESTEM series of die bonders, die sorters, dicing saws, inspection systems (BESTEM-V110), inline cure ovens (BCOS-VI), electronic component coining presses (HPM-44000, HPM-13000A), singulation machines (SDM-300T), and medical inspection/handling systems. All equipment is designed, manufactured, and supported in-house with proprietary technologies including world-first needle-less pickup for ultra-thin die handling.

Product overview

Canon Machinery Inc. operates two primary business segments: FA System (Factory Automation) and Semiconductor System. The FA System business provides automation and labor-saving equipment for advanced manufacturing including electronic components, medical devices, and other industrial applications. The Semiconductor System business focuses on semiconductor manufacturing equipment including die bonders, dicing saws, and inspection systems for IC chip positioning, inspection, and bonding material application. The product portfolio centers around the BESTEM series of die bonders available in both 8-inch and 12-inch wafer platform variants, including D310/D311plus (twin-dispense epoxy), D320 (twin-stamp LED), D340/D540 (soft solder), C310 (clip bonder), D510/D511plus/D511f plus/D610 (12-inch epoxy variants), D631 (DAF NAND flash), and S300/S500 dicing saws. Supporting products include the BESTEM-V110 wire bonding inspection system, BCOS-VI inline cure oven, and needleless pickup units for ultra-thin chip handling. Electronic component equipment includes HPM-44000 and HPM-13000A coining presses and SDM-300T singulation machines. Medical products encompass visual inspection systems and automated handling systems for pharmaceutical manufacturing.

Differentiator

Problem solved

Functional benefit

Products and services

• BESTEM-D310/D311plus 8-inch wafer-compatible IC/LSI die bonder using twin-dispense method. D311plus model features back-surface recognition camera for enhanced precision with ±15 micrometers (3-sigma) accuracy. Targeted at IC and LSI chip bonding for semiconductor back-end packaging.
• BESTEM-D320 8-inch wafer-compatible LED die bonder using twin-stamp (transfer) method. Achieves high productivity with 0.185 sec/cycle and ±38 micrometers positioning accuracy. Designed for LED chip bonding applications.
• BESTEM-D340 Soft solder die bonder for 8-inch wafer applications supporting power discrete to power IC and IGBT modules for automotive electronics packaging.
• BESTEM-C310 Clip bonder for clip-joined packages using triple-dispense method. Features individual clip adsorption for reduced defect rates and chip/clip position detection for improved accuracy. Used in power device packaging.
• BESTEM-S300 8-inch wafer-compatible tray-storage dicing saw for separating individual dies from diced wafers with high throughput and compact footprint.
• BESTEM-D510 12-inch wafer-compatible epoxy die bonder with twin-dispense method for high productivity. Minimizes adhesive aging by reducing distance between dispensing and chip placement.
• BESTEM-D511plus 12-inch wafer-compatible high-precision epoxy die bonder with single-dispense method. Achieves ±20 micrometers positioning accuracy with wizard functionality for superior operability.
• BESTEM-D511f plus 12-inch wafer-compatible flip-chip bonder for epoxy flip-chip bonding. Switchable between flip-chip and standard chip bonding with back-surface recognition camera achieving ±12 micrometers accuracy.
• BESTEM-D540 Soft solder die bonder for 12-inch wafers targeting power discretes, power ICs, and IGBT modules. Features stable joint quality with high-performance reducing feeder and digital spancier functionality.
• BESTEM-D631 NAND flash high-precision die bonder for 12-inch wafers using DAF (Die Attach Film) bonding. Achieves ±7 micrometers positioning accuracy with linear motor drive head and intermediate stage image processing alignment.
• BESTEM-S500 12-inch wafer-compatible tray-storage dicing saw with tray pocket recognition for improved tray placement accuracy. Supports glass chip inspection option and thin-chip handling via needleless pickup.
• BESTEM-D610 12-inch wafer-compatible epoxy die bonder with twin-dispense method for IC/LSI. Achieves ±20 micrometers mounting accuracy with 10% productivity improvement and long continuous operation through correction functions. Released November 2024.
• BESTEM-V110 Wire bonding inspection system for automating and improving efficiency of inspection in wire bonding processes. Features 3D measurement using confocal method for slope and fine structure measurement with reduced false detections.
• BCOS-VI Inline cure oven for chip adhesive curing and magazine storage. Achieves maximum curing temperature of 400 degrees C with configurable temperature profiles and inline connection capability with upstream processes.
• HPM-44000 Board coining press for high-precision flattening of C4 bumps on individual substrates. Features 4 independent processing axes with high-precision servo press (300-50,000N) and auto-leveling function for rapid product changeover.
• HPM-13000A Board coining press for flattening solder bumps and other components on supplied workpieces (resin substrates, etc.). Features new servo press mechanism (300-30,000N), auto-leveling, and twin-table mechanism for reduced work replacement time.
• SDM-300T Singulation machine for precision cutting of supplied workpieces to specified dimensions. Features twin spindles for high throughput, high-output air spindle, and 4-point conversion kit for easy product changeover.
• Medical Inspection Systems Visual inspection systems for medical/pharmaceutical applications. Applies optical technology and image processing for automating visual inspection of transparent bodies (film, glass bottles) and detecting foreign matter or bubbles in liquids.
• Medical Handling Systems High-speed, high-precision, flexible workpiece handling systems for medical/pharmaceutical environments. Handles workpieces in extreme conditions (sub-zero, high humidity, toxic substances) and includes AI functions for failure prevention and efficient operation.

Quantifiable outcome

• Die bonding speed up to UPH 18,000 for smallest chip sizes (BESTEM-D610)
• +3 more outcomes

Named customers4 records

Segments5 records

Ideal customer profiles6 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature7 records

Partnerships

One partnership is on record.

• Canon Group (Canon Inc.)coreOthers · 7 March 2026Canon Machinery is a consolidated subsidiary of Canon Inc., operating within the Canon Industrial Group. It develops and manufactures equipment for Canon Group internal use (e.g., inkjet cartridge production lines) as well as for external semiconductor and manufacturing customers. The relationship includes shared branding (Canon name), shared technologies (optical/image processing), shared management systems, and access to Canon Group's global sales and service network.

Scale indicators7 records

Recent moves7 records

Expansion highlights5 records

Direct peers

• Toray Engineering: Japanese subsidiary of Toray Industries supplying die bonders, flip-chip bonders, and FA systems. Directly competes with Canon Machinery in domestic Japan semiconductor and electronics assembly equipment.
• BE Semiconductor Industries (Besi): Dutch supplier of die bonding and advanced packaging equipment (hybrid bonding, TCB). Competes with Canon Machinery in high-end die attach for advanced packaging and power device applications globally.
• Hanmi Semiconductor: Korean supplier of die bonders (NTS series, Vision Placement series) and sawing equipment used by Samsung and SK Hynix. Directly competes with Canon Machinery in memory packaging die bonding, especially NAND and HBM-related applications.
• Yamaha Robotics (Yamaha Motor): Yamaha's surface mounter and semiconductor assembly equipment division produces die bonders and chip shooters that overlap with Canon Machinery's die bonding and electronic component assembly lines, particularly in automotive electronics.
• Kulicke & Soffa: Singapore/US-headquartered supplier of wire bonders and die bonders (IConnPS, Asterion). Directly overlaps with Canon Machinery in die bonding and wire bonding inspection for back-end semiconductor packaging.
• DISCO Corporation: Japan-headquartered global leader in dicing saws and wafer thinning/grinding equipment. Directly comparable to Canon Machinery's BESTEM-S300/S500 dicing saws in semiconductor back-end singulation.
• ASMPT (ASMPT Limited): Hong Kong-headquartered global leader in semiconductor assembly equipment including die bonders (AB 339 series) and SMT solutions. Directly competes with Canon Machinery's BESTEM die bonders across Asian OSAT and IDM customers.

Emerging players

• Festo: German automation and factory automation specialist offering handling systems and assembly modules for medical/pharmaceutical and electronics manufacturing. Comparable to Canon Machinery's medical handling and FA systems business.

Broad incumbents

• Universal Instruments (Apex Tool Group): US-headquartered supplier of advanced die bonders, odd-form placement, and through-hole assembly systems. Competes with Canon Machinery in die bonding and custom assembly for electronics manufacturing services, particularly in power electronics and automotive.
• Panasonic Connect / Panasonic Smart Factory Solutions: Panasonic's smart factory solutions offer die bonders and SMT assembly lines as part of a broader industrial portfolio. Overlaps with Canon Machinery in die bonding for automotive and electronics, but Panasonic operates at significantly larger scale across multiple industrial domains.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat4 records

Key risks5 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/channel/UCi4UxqNHjuLUD6hSb_obCEg

Revenue estimate

Valuation estimate

Number of profiles

Profiles9 records

Subsidiaries1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Canon Machinery