What Quik-Pak does

Quik-Pak, operating today as QP Technologies, is a US-based microelectronic packaging and assembly services provider founded in 1992 and acquired by Promex Industries in 2015. The company specializes in prototype and small-volume IC packaging and assembly, with an emphasis on serving defense, aerospace, medical, power semiconductor, and compound semiconductor customers that require domestic manufacturing for ITAR and regulatory compliance reasons.

The company's core technical offering spans wafer preparation (backgrinding, dicing), IC assembly (flip chip bonding, stacked die, wire bonding, BGA substrates, die attach, encapsulation), printed circuit board assembly (SMT, COB/COF, chiplets, MCM, SiP), laser micromachining, and substrate design and fabrication. It sells proprietary package product lines including the exclusive OmPP (Open-molded Plastic Package) pre-molded air-cavity QFN family, OCPP (Open Cavity Plastic Packages) targeting mil-aero applications, traditional leaded plastic packages, overmolded QFN/DFN, and ceramic packages. The firm maintains specialized packaging expertise for compound semiconductor materials (SiC, GaN, AlN) used in power ICs.

QP Technologies generates revenue through three streams: (1) contract IC packaging and assembly services billed on a quote basis, (2) custom-configured package and substrate manufacturing, and (3) sales of standard catalog products. The company operates a sales-led go-to-market motion targeting enterprise buyers, with direct sales outreach and a Request-a-Quote funnel. Pricing is not publicly disclosed and is negotiated per engagement, typically under multi-year contracts. Operations are concentrated at the Escondido, California facility, serving North American customers.

Name

Quik-Pak

Legal name

QP Technologies - A division of Promex Industries

Website

https://icproto.com

Company type

Private

Founded year

1992

Operating status

Operating

Headcount range

11–50 employees

Short description

QP Technologies (formerly Quik-Pak), a division of Promex Industries, provides prototype and small-volume microelectronic IC packaging and assembly services to defense, aerospace, medical, and power semiconductor customers from its Escondido, California facility.

Ownership category

akta.pro rank

Product category

Semiconductor Packaging Services

NAICS

Semiconductor and Related Device Manufacturing (334413), Semiconductor and Other Electronic Component Manufacturing (33441), Other Electronic Component Manufacturing (334419)

SIC

Semiconductors & Related Devices (3674), Electronic Components & Accessories (3670)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

akta.pro secondary industries

Package Substrates & Interposers (ABF/BT, Silicon/Glass) (HDAHADAE), Wafer-Level Packaging (WLP) & Redistribution (RDL) (HDAHADAC), Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB)

Keywords

• IC packaging services
• Microelectronic assembly
• Semiconductor packaging
• Wafer preparation services
• Substrate development

Headquarters

HQ city

San Diego

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Supply Chain, Technology or R&D, Marketing or Sales, Infrastructure

Revenue model

1. IC Packaging and Assembly Services: Prototype and small-volume IC packaging and assembly services including wafer preparation, IC assembly, and substrate development. Services range from fast-turn prototypes to mid-volume manufacturing.
2. Custom Product Manufacturing: Custom-configured IC packages and substrates including ceramic packages, overmolded QFN/DFN, and custom substrate solutions.
3. Standard Product Line: Sale of standard package products including OCPP, OmPP, and leaded plastic packages from their product catalog.

Pricing tiers

Go-to-market motion1 record

Distribution channels2 records

Marketing channels7 records

Core offering

QP Technologies provides prototype and small-volume microelectronic IC packaging and assembly services, complemented by a portfolio of proprietary package products including OCPP, OmPP, Overmolded QFN/DFN, Leaded Plastic, and Ceramic Packages. Service offerings span wafer preparation (backgrinding and dicing), printed circuit board assembly (PCBA), IC assembly (flip chip, wire bonding, stacked die, BGA substrates), substrate design and fabrication, laser micromachining, and design/engineering services for mil-aero, medical, automotive, industrial, and compound/power semiconductor customers.

Product overview

QP Technologies (formerly Quik-Pak) provides a comprehensive portfolio of microelectronic packaging and assembly solutions consisting of proprietary package products and contract manufacturing services. The core product line includes OCPP (Open Cavity Plastic Packages), OmPP (Open-molded Plastic Package) as an exclusive pre-molded air-cavity QFN offering, Overmolded QFN/DFN packages, Leaded Plastic Packages, and Ceramic Packages. These are complemented by a full range of service offerings: wafer preparation (backgrinding and dicing), printed circuit board assembly (PCBA) including SMT, chip on board, chiplets, MCM and SiP, IC assembly (stacked die, flip chip, wire bonding, BGA substrates), substrate development and design, laser micromachining, and design/engineering services. The company targets mil-aero, automotive, medical, industrial, commercial, compound semiconductor, and power semiconductor markets.

Differentiator

Problem solved

Functional benefit

Brands

• OCPP: Open-cavity Plastic Packages - a product line of pre-molded air-cavity packages
• OmPP

Products and services

• OCPP (Open Cavity Plastic Packages) Open Cavity Plastic Packages designed for IC packaging applications requiring access to the die after assembly; used by mil-aero and commercial customers.
• OmPP (Open-molded Plastic Package) Exclusive pre-molded, air-cavity QFN packages available in various sizes for prototype, mid-volume, or production volume IC packaging applications.
• Overmolded QFN/DFN Plastic overmolded QFN and DFN packages offering protected encapsulation for integrated circuits.
• Leaded Plastic Package Traditional leaded plastic packages suitable for military-aerospace and commercial applications.
• Ceramic Packages Ceramic IC packages providing high-reliability packaging solutions for demanding applications.
• Wafer Preparation Services Wafer backgrinding, dicing, and additional wafer preparation services for semiconductor processing customers.
• Printed Circuit Board Assembly (PCBA) Full range of PCBA services including SMT, chip on board/chip on flex, chiplets, multi-chip modules, and system-in-package assembly.
• IC Assembly Services Comprehensive IC assembly including stacked die, flip chip bonding, BGA substrates, wire bonding, die attach, encapsulation, and custom configurations.
• Substrate Development Substrate design, fabrication, assembly, and custom substrate development services for microelectronic packaging.
• Laser Micromachining Precision laser micromachining services for semiconductor and microelectronic applications.
• Design & Engineering Services Engineering and design support services for microelectronic packaging and assembly solutions.

Quantifiable outcome

• Fast turnaround for prototype and small-volume production
• +1 more outcomes

Segments7 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Two partnerships are on record, tiered core and minor.

• Promex IndustriescoreStrategic or Co-development Partner · 1 January 2015Promex Industries acquired Quik-Pak in 2015 and now operates QP Technologies as a division. Promex is a separate company (promex-ind.com) focused on microelectronics manufacturing. QP Technologies benefits from association with parent company's resources and complementary capabilities.
• TÜV SÜD AmericaminorOthersTÜV SÜD America provides certification auditing services. QP Technologies holds ISO 9001:2015, ISO 13485:2016, ANSI/ESD S20.20, and AS 9100D certifications through TÜV SÜD America oversight.

Scale indicators3 records

Recent moves7 records

Expansion highlights5 records

Broad incumbents

• Amkor Technology: Amkor is one of the world's largest OSAT providers offering flip chip, wirebond, wafer-level, and advanced packaging across consumer, automotive, and high-reliability markets. It is a broad incumbent competing for many of the same packaging customers QP Technologies serves, but at vastly greater scale and global footprint.
• JCET Group: JCET is a major Chinese-headquartered OSAT providing back-end assembly and test services including flip chip, BGA, and advanced packaging. It competes for the same commercial and industrial IC packaging customers, typically at lower cost.
• Hana Microelectronics: Hana Microelectronics is a Thailand-headquartered OSAT providing IC assembly and test as well as PCBA services across consumer, industrial, and automotive markets. It is comparable to QP Technologies in service breadth though at significantly larger scale and Asian cost base.
• UTAC Holdings: UTAC is a Singapore-headquartered OSAT providing analog, mixed-signal, and power IC packaging and test services. Its automotive and industrial power device focus overlaps with QP Technologies' compound/power semiconductor segment.
• ASE Technology Holding: ASE (Advanced Semiconductor Engineering) is the largest global OSAT, offering a full suite of packaging and test services including flip chip, SiP, and fan-out wafer-level packaging. It serves as a broad incumbent alternative for the same semiconductor customers QP Technologies targets.
• Powertech Technology: Powertech Technology (PTI) is a Taiwan-based OSAT providing IC packaging, testing, and assembly services including memory and logic packaging. It is a broad incumbent comparable to QP Technologies in core assembly capabilities but at much higher volumes.
• ChipMOS Technologies: ChipMOS is a Taiwan-based OSAT offering packaging and test services for memory, mixed-signal, and display driver ICs. It is a broad incumbent serving some of the same end markets as QP Technologies.

Direct peers

• Micross Components: Micross is a US-based specialty semiconductor packaging and component services provider focused on high-reliability and mil-aero applications. It is the closest direct peer to QP Technologies given its overlapping focus on hermetic/ceramic packaging, MIL-STD processing, and ITAR-controlled programs for defense customers.
• Promex Industries: Promex Industries is the parent of QP Technologies and itself provides microelectronics assembly and packaging services including SMT, chip-on-board, and substrate integration. It is operationally intertwined with QP Technologies and shares customer base, facilities, and management.
• ePAK International: ePAK International is a specialty provider of IC test and packaging services including sockets, burn-in boards, and substrate design. It is a direct peer to QP Technologies in serving niche prototyping and small-volume packaging requirements with engineering-intensive support.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• LinkedInlinkedin.com/company/quik-pak
• Xx.com/quikpak

Compliance5 records

Revenue estimate

Valuation estimate

Number of profiles

Profiles1 record

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Quik-Pak