Genesem

What Genesem does

Genesem Inc. (제너셈 주식회사) is a South Korea-based, KOSDAQ-listed (ticker 053376) manufacturer of semiconductor back-end process equipment, headquartered in Songdo, Incheon with 101-250 employees. The company designs and sells twelve product lines spanning the semiconductor packaging workflow: HBM equipment (vacuum/roll mounters, film removers, package sorters, KGD die recons), 2.5D CoWoS equipment (tray-to-boat, wafer transfer, wafer mount systems), Saw Singulation (VELOCE and UNICON series all-in-one systems integrating cutting, washing, drying, vision inspection, defect sorting, and loading), EMI Shield equipment, laser marking/cutting systems, pick-and-place, test handlers, flip-chip smart-factory equipment, wafer-level packaging equipment, trim/form/singulation systems, and PCB substrate equipment.

Underlying technology emphasizes process integration (multiple steps unified in single tools), laser-based precision processing, and vision inspection capabilities targeted at advanced packaging for AI, HBM, and high-performance computing applications. The company claims the No. 1 position in South Korea's semiconductor back-end equipment market and a global footprint spanning the USA, China, Mexico, Philippines, and India, with a newly added Indian customer base (April 2026).

Genesem's business model is direct enterprise hardware sales to semiconductor manufacturers, executed through a Technical Sales Department and Application Engineering Team with no disclosed channel partners. Marketing relies primarily on SEMICON Korea and SEMICON Taiwan trade shows, corporate IR materials (KOSDAQ-mandated disclosures), and the corporate website. Named tier-1 customers include Samsung Electronics (EMI Shield equipment, December 2016 Co-growth Partnership Award) and Skyworks (2017 Best Equipment Supplier), with the company positioning its HBM and 2.5D CoWoS lines to capture AI-driven advanced packaging capex demand.

Name

Genesem

Legal name

제너셈 주식회사

Website

https://genesem.com

Company type

Public

Founded year

2000

Operating status

Operating

Headcount range

101–250 employees

Short description

Genesem is a KOSDAQ-listed South Korean manufacturer of semiconductor back-end process equipment, offering twelve product lines spanning HBM, 2.5D CoWoS, saw singulation, EMI shielding, laser processing, and test handling for global semiconductor packaging customers.

Ownership category

akta.pro rank

Product category

Semiconductor Back-End Process Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Semiconductors & Related Devices (3674)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industries

Advanced Packaging (2.5D/3D-IC, Fan-Out WLP, Chiplets) (HDAHADAB), Test, Probe & Burn-In Equipment (Wafer Sort/Final Test) (HDAHAEAJ), Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

Keywords

• Semiconductor packaging equipment
• Back-end process equipment
• HBM packaging machinery
• Advanced chip packaging tools
• Wafer-level packaging equipment

Headquarters

HQ city

Incheon

HQ country

South Korea

HQ region

Asia

Offices1 record

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Personnel, Technology or R&D, Operations, Supply Chain, Marketing or Sales, Infrastructure

Revenue model

1. Semiconductor Equipment Sales: Genesem generates revenue through manufacturing and selling semiconductor back-end process equipment. The company sells directly to semiconductor manufacturers globally, supplying equipment for HBM, 2.5D CoWoS, saw singulation, EMI shielding, laser processing, test handling, and PCB substrate applications.

Go-to-market motion1 record

Distribution channels2 records

Marketing channels4 records

Core offering

Genesem Inc. (제너셈 주식회사) designs, manufactures, and sells semiconductor back-end process equipment — i.e., the specialized machinery used after wafer fabrication to cut, mark, shield, mount, sort, test, and package integrated circuits. The product portfolio covers HBM memory packaging, 2.5D CoWoS advanced integration, saw singulation, EMI shielding, laser marking/cutting, pick-and-place, test handling, flip chip smart factory automation, wafer-level packaging, trim/form/singulation, and PCB substrate processing. Equipment is sold directly to semiconductor manufacturers globally for use in high-volume production lines.

Product overview

Genesem is a semiconductor back-end packaging equipment manufacturer offering a comprehensive portfolio of 12 product lines. The core offerings include HBM (High Bandwidth Memory) equipment for memory packaging, 2.5D CoWoS equipment for advanced chip-on-wafer-on-substrate integration, Saw Singulation systems (VELOCE and UNICON series) for automated package cutting/inspection, EMI Shield equipment for electromagnetic compatibility, LASER Marking/Cutting equipment for package identification, Pick & Place systems, Test Handlers for IC testing, Flip Chip Smart Factory Equipment for Industry 4.0 automation, Wafer Level PKG Equipment, Trim/Form/Singulation systems, and PCB Substrate Equipment. The company supplies equipment domestically in Korea and internationally to the US, China, Mexico, and Philippines. The product portfolio operates as a unified semiconductor back-end packaging solution ecosystem rather than a single unified platform.

Differentiator

Problem solved

Functional benefit

Products and services

• HBM Equipment Line High Bandwidth Memory (HBM) packaging equipment including Vacuum Mounter, Roll Mounter, Film Remover (De-mounter), PKG Sorter (Ring to Reel and Ring to Tray variants), and Die Recon (KGD sorter) for semiconductor memory packaging processes. Built for HBM manufacturers supplying AI/data center applications.
• 2.5D CoWoS Equipment Chip-on-Wafer-on-Substrate (CoWoS) packaging equipment for 2.5D integration including Tray to Boat (PLS-1000FA), Wafer Transfer (GWTS-1000), Wafer Mount (GWRM-1000FA), and GWDM-1000(FA) for advanced chip-on-wafer-on-substrate packaging used in AI and high-performance computing.
• Saw Singulation Systems Unmanned, integrated Saw Singulation equipment (VELOCE-G7A, VELOCE-G7, VELOCE-G7R, UNICON-G7W/UNICON-G7Q) that combines semiconductor package cutting, washing, drying, vision inspection, defect sorting, and loading into a single device for back-end packaging lines.
• EMI Shield Equipment Electromagnetic interference (EMI) shielding equipment (GTAS-2100A, GTM-1000, GLC-1000, VELOCE-G5-FTT, VELOCE-G5-TTF) for semiconductor packages requiring electromagnetic compatibility in mobile, automotive, and RF applications.
• Laser Marking/Cutting Systems Laser-based marking and cutting equipment (GBMS-1000L, GAMS-6500, GTMS-2000, GWMS-2000, GLCS-4000, GLCS-2200, GLES-2100) for semiconductor package identification and precision processing.
• Pick & Place Equipment Component placement equipment (GPPS-2500) for precision placement of components in semiconductor back-end packaging operations.
• Test Handler Systems IC testing equipment (GV-2032, GTHS-2004, GV-2016, GTHS-3400, GTHS-3300, GTNR-2000, GTHS-3000) for semiconductor device testing and sorting in back-end packaging lines.
• Flip Chip Smart Factory Equipment Smart factory automation equipment for flip chip packaging (PLS-1000FA, GMLS-2000, GSMT-2010V/GSMT-3001) integrating Industry 4.0 automation capabilities for advanced packaging lines.
• Wafer Level PKG Equipment Wafer-level packaging equipment (GWTS-1000, GFWM-1000, GWDM-1000(FA), GWRM-1000(FA)) for advanced wafer-level semiconductor packaging processes used by logic and memory manufacturers.
• Trim/Form/Singulation Systems Package trimming, forming, and singulation equipment (GAFS-2200, GATS-2000, GTFS-2000T, GTFS-2200, GTFS-2000, GTFS-2000B) for semiconductor package finishing on back-end lines.
• PCB Substrate Equipment Printed circuit board substrate processing equipment (GAMS-4100, GAMS-3000, GALD-5242, GSHS-1000, GAIS-2000, GAIS-2300D, GAIS-2300) for PCB substrate manufacturing, processing, and inspection.
• Tape Lamination System Tape lamination system for semiconductor packaging processes, listed under the 'Others' product category on the Genesem website.

Named customers3 records

Segments4 records

Ideal customer profiles1 record

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature8 records

Partnerships

One partnership is on record.

• Indian Semiconductor Packaging CustomerssignificantOthers · 8 April 2026Genesem secured orders from three major Indian semiconductor packaging customers in April 2026, expanding its customer base in the Indian market.

Scale indicators4 records

Recent moves8 records

Expansion highlights5 records

Direct peers

• Cohu: US-based manufacturer of semiconductor test handlers and interface solutions. Directly comparable to Genesem's Test Handler (GV/GTHS series) product line serving IC testing and package sort operations.
• Hanmi Semiconductor: Korean semiconductor back-end equipment maker specializing in HBM thermocompression bonding, saw singulation and sorter equipment. Closest domestic peer to Genesem given shared Korean base, shared HBM-focused product line, and shared exposure to Samsung/SK Hynix.
• Kulicke & Soffa Industries: Singapore/US-listed back-end semiconductor equipment maker spanning wire bonders, ball bonders, and advanced packaging tools. Competes head-to-head with Genesem across multiple packaging equipment categories and serves similar global customer base.
• Toray Engineering: Japanese supplier of laser processing, PCB drilling and substrate equipment. Comparable to Genesem's LASER Marking/Cutting and PCB Substrate Equipment product families.
• TOWA Corporation: Japanese maker of semiconductor encapsulation/molding equipment and precision molding tools for advanced packaging. Peer to Genesem in back-end packaging equipment, with strengths in resin molding and complementary to Genesem's singulation and packaging portfolio.
• ASMPT (ASM Pacific Technology): Hong Kong-headquartered leader in semiconductor back-end assembly and packaging equipment (wire bonders, flip chip, TCB, die bonding). Directly comparable to Genesem as a back-end equipment provider serving OSATs, foundries and IDMs with overlapping product categories such as flip chip and packaging tools.
• DISCO Corporation: Japanese leader in semiconductor dicing (saw) and grinding equipment. Directly comparable to Genesem's Saw Singulation (VELOCE / UNICON) product family and a dominant incumbent in the die-separation step Genesem serves.
• BE Semiconductor Industries (BESI): Dutch semiconductor assembly equipment specialist focused on die bonding, packaging, and advanced packaging tools. Direct competitor to Genesem across flip-chip, advanced packaging and back-end assembly equipment, with similar exposure to AI/HBM capex.
• SÜSS MicroTec: German semiconductor equipment vendor supplying lithography, bonding, coating and advanced packaging tools. Overlaps with Genesem's wafer-level packaging, bonding and advanced packaging equipment categories.

Emerging players

• FormFactor: US semiconductor probe and test equipment maker with overlap to Genesem's Test Handler portfolio. Adjacent rather than direct competitor — focuses on wafer probe and test, complementary to Genesem's final test handling.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• Xx.com/GenesemInc

Revenue estimate

Valuation estimate

Number of profiles

Profiles5 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Genesem