What Tresky Automation does

Tresky Automation GmbH is a privately held German manufacturer of high-precision DIE bonding machines headquartered in Hennigsdorf near Berlin, with operating history dating to 1980 and a current headcount of approximately 25 employees. The company designs, produces and distributes modular DIE bonder platforms (T-200, T-6000-L, T-6000-L/G, T-7000, T-8000-G) on granite-based foundations that deliver sub-micron placement accuracy across multiple bonding technologies — epoxy, UV, ultrasonic, thermocompression, sintering, flip chip, eutectic, 3D and photonics bonding. Its differentiated capabilities include nanometer-precision active alignment with real-time optical feedback for photonic integrated circuit assembly, and a hybrid alignment feature combining passive and active modes on a single machine platform.

The company serves customers in photonics and optoelectronics, power electronics (including SiC/GaN modules and e-mobility), defense and security, and general semiconductor and microelectronics packaging, with named exposure to organizations such as EPIC Photonics, optecBB and ISA. Tresky generates revenue through two streams: capital equipment sales of its DIE bonder platforms and a Contract Manufacturing Hub offering prototyping, small-series production, DIE sorting and process development services. Go-to-market combines direct enterprise sales from the German headquarters with wholly owned subsidiaries in Taiwan (Tresky Asia) and the United States (Tresky Corporation, New Jersey), supplemented by a distributor network covering 30+ countries. Pricing is quote-based, no public list exists, and contracts are typically multi-year — consistent with customized industrial capital equipment. The company is founder-controlled under Managing Director Daniel Schultze, has no disclosed external funding, and was recognized with the 2021 Brandenburg Innovation Award for its air-lubricated bond head technology.

Name

Tresky Automation

Legal name

Tresky GmbH

Website

https://tresky.de

Company type

Private

Founded year

1980

Operating status

Operating

Headcount range

11–50 employees

Short description

Tresky Automation is a German manufacturer of high-precision DIE bonding machines serving photonics, power electronics, defense and semiconductor packaging customers via modular granite-based platforms, direct sales offices in Germany, Taiwan and the US, and a 30+ country distributor network.

Ownership category

akta.pro rank

Product category

Semiconductor Assembly Equipment

NAICS

Semiconductor Machinery Manufacturing (333242)

SIC

Special Industry Machinery, Nec (3559), Industrial Process Furnaces & Ovens (3567)

akta.pro primary industry

Back-End/Advanced Packaging Equipment (Die Attach/Wire Bond/Flip-Chip/TCB) (HDAHAEAL)

akta.pro secondary industry

Thermal Processing Equipment (Furnaces/RTP/Anneal) (HDAHAEAE)

Keywords

• Die bonding equipment
• Semiconductor assembly machines
• Photonics packaging systems
• Precision placement machinery
• Power electronics bonding

Headquarters

HQ city

Hennigsdorf

HQ country

Germany

HQ region

Europe

Offices3 records

Markets served

GTM type

B2B

Offering type

Hardware or Manufacturing

Cost components

Technology or R&D, Personnel, Supply Chain, Operations, Marketing or Sales

Revenue model

1. DIE Bonder Equipment Sales: Sale of high-precision DIE bonding machines and platforms (T-200, T-6000-L, T-6000-L/G, T-7000, T-8000-G) for semiconductor manufacturing, photonics, and microelectronics applications.
2. Contract Manufacturing Services: Prototyping and small-to-medium series production services including photonics, optoelectronics, sintering for power electronics, flip chip bonding, and die sorting. Operated from in-house Contract Manufacturing Hub.

Pricing tiers

Go-to-market motion1 record

Distribution channels4 records

Marketing channels5 records

Core offering

Tresky Automation designs, manufactures, and distributes high-precision DIE bonding machines for semiconductor, photonics, optoelectronics, and power electronics applications. The portfolio includes multiple bonding technologies (epoxy, UV, ultrasonic, thermocompression, sintering, flip chip, eutectic, 3D, photonics) built on granite-based modular platforms (T-200, T-6000-L, T-6000-L/G, T-7000, T-8000-G). The company also operates a Contract Manufacturing Hub providing prototyping, small series production, DIE sorting, and process development services.

Product overview

Tresky Automation is a German manufacturer of high-precision DIE bonder machines with 40 years of experience in the semiconductor industry. The product portfolio consists of multiple bonding technology platforms and specialized products: DIE bonding systems including Epoxy/Adhesive Bonder, UV Bonder, Ultrasonic Bonder, Thermocompression Bonder, Sinter Bonder, Flip Chip Bonder, Eutectic Bonder, 3D Bonder, and Photonics Bonder; five machine platform lines (T-200, T-6000-L, T-6000-L/G, T-7000, T-8000-G); Active Alignment systems for photonics; and specialized Large Area Sintering for power electronics. All platforms share a modular architecture with granite-based precision foundations and support both manual and automatic operating modes. The company also offers contract manufacturing services including prototyping, small series production, DIE sorting, and process development. Tresky serves industries including photonics, optoelectronics, power electronics, MEMS, sensors, defense/military, and advanced semiconductor packaging.

Differentiator

Problem solved

Functional benefit

Brands

• Hybrid Alignment: A technology combining passive alignment and active alignment on a single DIE bonder platform for advanced photonics packaging
• GRANITe

Products and services

• Epoxy / Adhesive Bonder

Quantifiable outcome

• Edge coupling efficiency typically less than 1 dB coupling loss
• +5 more outcomes

Named customers3 records

Segments4 records

Ideal customer profiles4 records

Technology focussed Yes

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Feature5 records

Partnerships

Six partnerships are on record, tiered minor.

• EPIC PhotonicsminorStrategic or Co-development PartnerPhotonics industry partner featuring Tresky on their news/events section. Represents customer relationship in photonics bonding sector.
• optecBBminorStrategic or Co-development PartnerPhotonics cluster partner in Germany. Represents ecosystem collaboration in the Brandenburg photonics industry.
• ISA (International Semiconductor Analytics)minorStrategic or Co-development PartnerSemiconductor analytics company. Partner featured on Tresky's website indicating industry collaboration.
• ProMuPower Project (Fachhochschule Kiel)minorStrategic or Co-development PartnerResearch collaboration with Fachhochschule Kiel on electronic low-voltage drive module with multifunctional high-current circuit carrier. Tresky contributes bonding expertise.
• BUTTER AND SALT tech marketing GmbHminorOthersTechnical marketing agency responsible for website implementation and digital presence.
• GEOTEK Datentechnik GmbHminorOthersExternal hosting provider for Tresky's website infrastructure.

Scale indicators4 records

Recent moves5 records

Expansion highlights6 records

Direct peers

• ASMPT (ASM Pacific Technology): One of the largest back-end semiconductor equipment suppliers globally, with a comprehensive die bonding portfolio (including the MRSI brand). Overlaps with Tresky across multiple bonding technologies and serves the same photonics and advanced packaging customers.
• SET (Smart Equipment Technology): French manufacturer of high-precision die and flip chip bonders serving semiconductor, MEMS, and photonics markets. Closely comparable niche specialist competing head-to-head with Tresky in European research institutes and photonics labs.
• BE Semiconductor Industries (Besi): Global market leader in die bonding equipment for advanced packaging, including flip chip, TCB, and hybrid bonding. Directly competes with Tresky in flip chip and thermocompression bonders for semiconductor and photonics customers, but at vastly larger scale.
• Kulicke & Soffa Industries: Diversified semiconductor and LED packaging equipment supplier with a long-standing die bonder product line. Competes with Tresky in traditional die attach and is expanding into advanced packaging and photonics-adjacent applications.
• Palomar Technologies: US-based specialist in precision die bonders and photonics packaging equipment. Closely comparable to Tresky in size, focus, and end markets (photonics, RF, defense), with similar active alignment capabilities for hybrid integration.
• Toray Engineering: Japanese specialist in thermocompression bonders (TCB) and advanced packaging equipment. Direct peer in the high-end TCB segment serving 3D stacking and advanced logic packaging.
• Shibaura Mechatronics: Japanese manufacturer of die bonders and other semiconductor back-end equipment. Directly overlaps with Tresky in flip chip and eutectic bonding, with a stronger presence in Asian production fabs.
• MRSI (MyData / part of ASMPT): Specialist in high-precision die bonding for photonics, datacom, and life sciences applications. Direct competitor in the silicon photonics and active alignment segments where Tresky is building presence.

Broad incumbents

• SÜSS MicroTec: Larger German semiconductor equipment company with a broad portfolio in lithography, coating, bonding, and inspection. Competes with Tresky in advanced packaging and photonics, but as a broad incumbent with a much wider product line.

Emerging players

• Amicra Microtechnologies (SÜSS MicroTec): Specialist in sub-micron die bonding for photonics and semiconductor packaging, now part of SÜSS MicroTec. Niche competitor in the same precision photonics bonding space as Tresky, with comparable scale and customer base.

Market position

Strengths4 records

Weaknesses4 records

Competitive moat5 records

Key risks5 records

Key highlights6 records

Customer concentration

• YouTubeyoutube.com/@TreskyGmbH/videos
• LinkedInlinkedin.com/company/tresky-automation
• Xx.com/treskygmbh

Revenue estimate

Valuation estimate

Number of profiles

Profiles4 records

Subsidiaries2 records

Funding overview

Funding rounds

Investors

Funding detail is available on the Subscription and Enterprise plan.Contact sales →

M&A

Investments

M&A and investment is available on the Subscription and Enterprise plan.Contact sales →

Frequently asked questions about Tresky Automation