International Microelectronics Assembly and Packaging Society

What International Microelectronics Assembly and Packaging Society does

International Microelectronics Assembly and Packaging Society (IMAPS), founded in 1967 as the International Society for Hybrid Microelectronics (ISHM) and operating under its current name since the 1996 merger with the International Electronic and Packaging Society (IEPS), is a U.S. non-profit professional membership association headquartered in Pittsburgh, Pennsylvania. IMAPS serves as the principal connective organization across the microelectronics advanced packaging, interconnect, and assembly supply chain, serving individual engineers and researchers, students, academic institutions, corporate members (semiconductor manufacturers, OSATs, equipment suppliers, materials providers, EDA vendors), and government/defense stakeholders. The organization is staffed by a small professional team of 1-10 employees led by Executive Director Brian Schieman, with governance provided by an Executive Council drawing senior figures from Honeywell, Cadence, Northrop Grumman, ASE, NXP, Henkel, SkyWater, Ajinomoto Fine-Techno, and Arizona State University.

IMAPS generates revenue through six streams: (1) recurring membership dues from individual, corporate, premier-corporate, academic, and student tiers; (2) one-time conference and event registration fees across eight signature events including the International Symposium on Microelectronics, Device Packaging Conference, CHIPcon, THERMcon, SiPhotonics Packaging Summit, Wire Bonding Workshop, Memory Summit Silicon Valley, Executive Summit Silicon Valley, and the Onshoring Workshop (with member and non-member pricing ranging roughly $100-$1,450); (3) corporate sponsorship and tabletop exhibit fees at conferences ($1,500-$6,000 tiers); (4) advertising in Advancing Microelectronics Magazine and media marketing kits; (5) IMAPS Academy on-demand online courses for semiconductor packaging; and (6) Professional Development Courses ($325-$575) taught at symposia. Supporting programs include the Global Business Council, the Microelectronics Foundation (a 501(c)(3) entity established 2006 that administers the $10,000/year 3D InCites Student Scholarship, $2,000 Student Travel Grants, and student chapters), the Journal of Microelectronics and Electronic Packaging, and the IMAPSource research portal. Geographic reach spans U.S. regional chapters (Silicon Valley, New England) and international chapters in Poland, Germany, Italy, France, with documented participation from attendees across more than 20 countries.

The asset base of IMAPS is intangible rather than physical: a 50+ year publication heritage, a 58-year-old flagship symposium, the 3DInCites content platform taken over in early 2026, a multi-event conference franchise anchored by 1,090 attendees and 96 sold-out booths at the 2026 Device Packaging Conference, and Premier Corporate Member relationships with more than 20 of the largest firms in the semiconductor and defense electronics supply chain (Intel, IBM, ASE, Amkor, Applied Materials, Honeywell, RTX, Siemens, Cadence, Besi, Henkel, Materion, Rapidus, NSWC Crane, Palomar Technologies, Deca Technologies, MRSI Systems, Promex, NXP, SkyWater, Indium).

Name

International Microelectronics Assembly and Packaging Society

Legal name

International Microelectronics Assembly and Packaging Society

Website

https://imaps.org

Company type

Private

Founded year

1967

Operating status

Operating

Headcount range

1–10 employees

Short description

IMAPS is a U.S. non-profit professional membership association founded in 1967 that convenes the microelectronics advanced packaging, interconnect, and assembly community across industry, academia, and government through conferences, publications, online education, and workforce development programs.

Ownership category

akta.pro rank

Product category

Professional Association Services

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

SIC

Electronic Components, Nec (3679)

akta.pro primary industry

Assembly & Packaging Services (Wirebond/Flip-Chip/FCBGA) (HDAHADAA)

Keywords

• Microelectronics packaging association
• Semiconductor packaging conferences
• Advanced packaging education
• Microelectronics membership society
• Semiconductor workforce development

Headquarters

HQ city

Pittsburgh

HQ country

United States

HQ region

North America

Offices1 record

Markets served

GTM type

B2B

Offering type

Services

Cost components

Personnel, Operations, Marketing or Sales, Technology or R&D, Infrastructure, Others

Revenue model

1. Membership Dues: Annual membership fees from individual members, corporate members, premier corporate members, academic institutions, and students. Individual and corporate memberships provide access to technical publications, event discounts, networking, and professional development opportunities.
2. Conference and Event Registration: Registration fees for signature events including International Symposium on Microelectronics (~$100-$1325 depending on member status and timing), Device Packaging Conference (~$200-$1450), CHIPcon (~$650-$1150), THERMcon, Onshoring Workshop, and specialized workshops. Fees vary by attendee type and early-bird pricing.
3. IMAPS Academy Online Courses: Revenue from on-demand semiconductor assembly and packaging courses taught by industry experts through the IMAPS Academy software portal.
4. Sponsorships and Exhibits: Corporate sponsorship tiers (Premier, Corporate, Reception, Break sponsorships) and tabletop exhibit fees at conferences. Premier Sponsorship at Onshoring Workshop is $4000-$4500; CHIPcon Premier Sponsorship is $6000.
5. Publications and Advertising: Advertising in Advancing Microelectronics magazine and media marketing kits sold to exhibitors and sponsors.
6. Professional Development Courses (PDCs): Fees for 2-hour professional development courses taught at symposia and conferences, typically $325-$575 per course depending on event and timing.

Pricing tiers

Go-to-market motion1 record

Distribution channels5 records

Marketing channels8 records

Core offering

IMAPS is a non-profit membership association that provides technical conferences (International Symposium on Microelectronics, Device Packaging Conference, CHIPcon, THERMcon, Onshoring Workshop, SiPhotonics Packaging Summit, Wire Bonding Workshop, Memory Summit), online education through IMAPS Academy, peer-reviewed publications (Advancing Microelectronics magazine, Journal of Microelectronics and Electronic Packaging, IMAPSource research portal), and student/workforce development programs including scholarships and travel grants for the microelectronics advanced packaging community.

Product overview

IMAPS is a premier non-profit membership association dedicated to Microelectronics Advanced Packaging, Interconnect and Assembly. The organization operates a platform of interconnected products and services: the core offering consists of signature conferences (IMAPS Symposium, Device Packaging Conference, CHIPcon, THERMcon, Onshoring Workshop, SiPhotonics Packaging Summit, Wire Bonding Workshop, and Memory Summit), supported by educational platforms (IMAPS Academy for online courses and Professional Development Courses), publications (Advancing Microelectronics Magazine, Journal of Microelectronics and Electronic Packaging, IMAPSource Research Portal), and student workforce development initiatives (IMAPS 3D InCites Student Scholarship, Student Travel Grant, and Microelectronics Foundation). The Global Business Council provides business-focused programming for corporate members. Together, these products serve the entire microelectronics packaging supply chain across academia, industry, and government.

Differentiator

Problem solved

Functional benefit

Products and services

• IMAPS Symposium Annual international conference for microelectronics advanced packaging featuring 5 technical tracks, 100 exhibitors, panels, posters, professional development courses, and keynotes from industry leaders such as Qualcomm, Marvell, and Cerebras.
• Device Packaging Conference Annual international conference dedicated to device packaging technologies, offering technical sessions, keynotes, poster presentations, and professional development courses. The 23rd Annual DPC 2027 will be held in Phoenix, Arizona.
• CHIPcon Leading technical conference dedicated to chiplet-based architectures and heterogeneous integration, focused on advancing adoption of chiplet technologies across the semiconductor industry.
• THERMcon Semiconductor thermal management conference addressing cooling technologies, thermal interface materials, thermal design methodology, and metrology for advanced packaging.
• Onshoring Workshop Workshop focused on increasing domestic microelectronics production, bringing together U.S. Government, Defense Industrial Base, and key stakeholders to drive advanced packaging and assembly onshoring initiatives.
• SiPhotonics Packaging Summit Summit dedicated to advancing silicon photonics and co-packaging optics, bringing together leaders from IDM/fabless companies, foundries/OSATs, EDA and equipment suppliers, and academia.
• Wire Bonding Workshop Advanced technical workshop and tabletop exhibition focused on wire bonding technologies in semiconductor and microelectronics packaging, featuring keynotes, tutorials, and industry expert presentations.
• Memory Summit Silicon Valley Executive summit focused on memory access issues limiting AI inference at scale, including bandwidth utilization, latency, data movement, and memory tiering for system architects and technology decision-makers.
• IMAPS Academy Online learning portal offering on-demand semiconductor assembly and packaging courses taught by industry experts, providing workforce development and professional education in microelectronics packaging.
• Advancing Microelectronics Magazine Monthly publication covering the microelectronics packaging industry.
• Journal of Microelectronics and Electronic Packaging Peer-reviewed academic journal publishing research on microelectronics and electronic packaging technologies.
• IMAPSource Research Portal Digital research library providing open access proceedings from past IMAPS events and publications.
• Microelectronics Foundation 501(c)(3) charitable foundation supporting student activities in microelectronic packaging, including scholarships, travel grants, technical paper awards, student chapters, and high school STEM programs.
• Global Business Council IMAPS initiative focused on business issues related to microelectronics packaging technologies, producing conferences, forums, and webinars for corporate members.
• Professional Development Courses (PDCs) Two-hour educational tutorials offered at IMAPS events covering design, materials, and processes at both component and system level for microelectronic packaging technologies.

Named customers23 records

Segments5 records

Ideal customer profiles4 records

Technology focussed No

API detail

Has API

No

API docs

API detail

Core technology

AI maturity

App detail

Partnerships

Five partnerships are on record, tiered core and minor.

• Global Electronics Association (GEA)coreStrategic or Co-development PartnerIMAPS and Global Electronics Association co-host the Onshoring Advanced Packaging Workshop, focused on increasing domestic microelectronics production. The workshop brings together U.S. Government, Defense Industrial Base, and key stakeholders. GEA provides additional industry representation and expertise for the onshoring initiative.
• 3D InCitescoreStrategic or Co-development Partner3D InCites had been a media partner of IMAPS for over a decade. Francoise von Trapp and Martijn Pierik established a 3D InCites Fund that raised awareness and funds to support young engineers in underrepresented areas. In 2025, 3D InCites donated the entire fund to IMAPS Microelectronics Foundation to expand scholarship efforts. In early 2026, IMAPS took over stewardship of the 3D InCites content platform.
• Encore Boston HarborminorOthersVenue partner for IMAPS Symposium 2026 (September 28 - October 1, 2026). Located at 1 Broadway, Everett, MA 02149. Group rate: $309 Premier King or $339 Premier Double Queen plus tax. Room block closes August 28.
• Sheraton Grand at Wild Horse PassminorOthersVenue partner for Device Packaging Conference 2027 (March 1-4, 2027). Located at 5594 W Wild Horse Pass Blvd., Phoenix, AZ 85226. Group Rate: $339 room plus tax plus $20 nightly resort service charge.
• Rapidus Design SolutionsminorOthersHost venue for IMAPS Executive Summit Silicon Valley 2025 (September 24-25). Located at 3965 Freedom Circle, Santa Clara, CA 95054. Rapidus is also a Premier Corporate Member of IMAPS.

Scale indicators6 records

Recent moves8 records

Expansion highlights5 records

Direct peers

• IPC (Association Connecting Electronics Industries): Global trade association for the electronics manufacturing and assembly supply chain with conferences, standards, and training across PCB, EMS, and packaging. Direct peer competing for the same corporate members, exhibitors, and workforce training budgets as IMAPS.
• IEEE Electronics Packaging Society (EPS): IEEE society focused on electronic packaging, with ECTC, IEMT, and other packaging conferences plus the Transactions on Components, Packaging and Manufacturing Technology journal. Direct peer in packaging technical content and conferences.
• SMTA (Surface Mount Technology Association): Non-profit association running conferences, training, and certification programs for electronics assembly, surface mount, and packaging technologies. Closest direct peer to IMAPS in mission, event portfolio, and member base within the assembly/packaging community.

Broad incumbents

• Materials Research Society (MRS): International non-profit materials science society running the MRS Spring/Fall Meetings with strong packaging materials, interconnect, and heterogeneous integration programming. Adjacent peer competing for packaging researcher attendance and paper publication venues.
• SEMI: Largest global semiconductor manufacturing association running SEMICON conferences, working groups, and standards across the entire chip supply chain. Broader incumbent that overlaps with IMAPS on packaging adjacent events and corporate membership competition.
• SPIE (Society of Photo-Optical Instrumentation Engineers): International non-profit for optics and photonics running conferences and journals that overlap with IMAPS' SiPhotonics Packaging Summit and co-packaged optics content. Broad incumbent with adjacent photonics-packaging programming.
• Global Electronics Association (GEA): Global electronics industry association (formerly SMTA-I); co-hosts the IMAPS Onshoring Workshop with IMAPS and competes/collaborates across EMS and assembly standards and conferences. Adjacent peer with overlapping member base.

Others

• JEDEC Solid State Technology Association: Standards body for the microelectronics industry covering semiconductor packaging standards that IMAPS members interface with. Ecosystem/standards enabler rather than direct conference competitor.
• Electronic Components Industry Association (ECIA): Trade association for electronic component manufacturers, distributors, and manufacturers' representatives. Adjacent ecosystem enabler serving overlapping corporate member companies in the semiconductor component supply chain.
• iMAPS Microelectronics Foundation: IMAPS' own 501(c)(3) subsidiary running student scholarships, travel grants, and workforce development programs; included for completeness as the affiliated nonprofit vehicle, not an external peer.

Market position

Strengths5 records

Weaknesses5 records

Competitive moat5 records

Key risks5 records

Key highlights7 records

Customer concentration

• Xx.com/imapsorg
• LinkedInlinkedin.com/company/imapshq

Revenue estimate

Valuation estimate

Number of profiles

Profiles17 records

Subsidiaries1 record

Funding overview

Funding rounds

Investors

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M&A

Investments

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